Qualcomm has announced that its board of directors has unanimously rejected the unsolicited proposal announced by Broadcom Limited ("Broadcom") on November 6, 2017, saying the bid...

Power discrete component supplier HY Electronic specializing in diode products has disclosed plans to acquire a 70% stake in Taiwan GPP (TGI) for NT$350 million (US$11.52 million).

Qualcomm has announced that it has signed three non-binding memoranda of understanding (MoU) wherein Xiaomi Technology, Oppo Mobile Telecommunications and Vivo Communication Technology...

The Android camp could follow the steps of Apple to temporarily suspend royalty payments to Qualcomm aiming to force the US-based chip vendors back to the negotiating table to work...

Qualcomm has announced that its subsidiary, Qualcomm Technologies, and Alibaba have ported Alibaba Cloud Link One to run on the Qualcomm MDM9206 global multi-mode LTE IoT modem. This...

Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...

Taiwan fabless IC firms are aggresively vying to secure capacity at 8-inch foundries to meet increasing orders in 2018, particularly for MCU and MOSFET chips needed to support a variety...

Pure-play IC foundry United Microelectronics (UMC) has announced consolidated revenues of NT$13.81 billion (US$457.6 million) for October 2017, rising 16.4% sequentially and hitting...

Full in-cell display module makers have been improving yield rates to lower their production costs for all-screen panels, which will see wider adoption by smartphones and tablets in...

Zhaoxin Semiconductor, a leading China maker of x86 processors, expects its annual CPU sales to double for two consecutive years in 2017-18 due to its successful penetration into government...

China AI chip unicorn Cambricon Technologies plans to launch MLU machine learning series processor chips for cloud-based applications within the next 18 months, with the chips to be...

With to a lack of growth momentum in the traditional mainstream TV and monitor markets, most flat panel makers have paid more attention on the development niche applications for large-sized...

Teardown engineers at IHS Markit have completed their preliminary physical dissection of the new Apple iPhone X and found that the model A1865 version of the smartphone with 64GB of...

China-based vendors Oppo and Xiaomi Technology will adopt 3D sensing solutions for smartphones to be launched in 2018, with such solutions to be developed by Himax Technologies via...

Fingerprint sensor supplier Egis Technology (Egistec) has announced net profits for the third quarter hiked 132% sequentially to NT$174 million (US$5.76 million). EPS for the quarter...