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IN THE NEWS
Thursday 26 December 2019
MediaTek to showcase Dimensity 800 5G SoC at CES 2020
MediaTek is set to unveil its second sub-6 GHz 5G SoC, codenamed Dimensity 800, at the upcoming CES 2020 and start delivering the chips in the second quarter of the year.
Wednesday 25 December 2019
Highlights of the day: US may tighten Huawei ban
The world's two superpowers may be heading towards a truce in their trade war, but the US reportedly is not letting Chinese tech giant Huawei off the hook easily. Washington may tighten...
Wednesday 25 December 2019
PCIe 4.0 still awaiting Intel support
Despite AMD and SSD players' aggressive promotions of PCIe 4.0, the standard may not become popular until Intel releases CPUs that supports the technology, according to sources from...
Wednesday 25 December 2019
Shennan Circuits to expand HDI PCB production capacity
Shennan Circuits (SCC) is looking to raise a total of CNY1.52 billion (US$50.4 million) by issuing convertible bonds, and will use the proceeds to expand production capacity, according...
Wednesday 25 December 2019
Samsung to source more HDI PCBs from Korea suppliers
Samsung Electronics reportedly will place more orders with its existing suppliers DAP and Korea Circuit, rather than their Taiwanese peers, after the withdrawal of its PCB supply...
Wednesday 25 December 2019
Intel to intro innovative thermal design for notebooks
At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...
Wednesday 25 December 2019
US may tighten ban on Huawei with mixed impacts on Taiwan IC designers
The US government is reportedly mulling adjusting regulations to tighten control on Huawei's access to US-originated technology, which may bring uncertainties to Taiwan-based IC design...
Wednesday 25 December 2019
Huawei reportedly to roll out 2nd-gen Mate X foldable phone in 2H20
Huawei reportedly plans to launch its next-generation Mate X foldable smartphone in the second half of 2020, seeking to maintain its leading position in the segment, according to...
Wednesday 25 December 2019
GlobalWafers sees order visibility improve
Silicon wafer manufacturer GlobalWafers has seen better-than-expected order visibility for the first quarter of 2020, particularly for 12-inch wafers, according to company chairperson...
Wednesday 25 December 2019
LCD heyday coming to an end
For the global LCD panel industry, the year 2019 has been mostly engulfed by oversupply due notably to rampant capacity ramps by Chinese makers. Oversupply coupled with the impacts...
Tuesday 24 December 2019
Highlights of the day: MediaTek embraces super-midrange smartphone concept
MediaTek introduced its super-midrange smartphone market concept in 2017, focusing on competitive midrange pricing for products with high-end specs. It has been adhering to the strategy,...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Tuesday 24 December 2019
China initiates new push to raise IC self-sufficiency
China has initiated a new round of efforts to accelerate the development of its homegrown chip industry, a move that is likely to create significant business opportunities for Taiwan-based...
Tuesday 24 December 2019
ASE, VisEra to enjoy robust demand for in-display fingerprint sensors
ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
Tuesday 24 December 2019
Goodix to be biggest client for TSMC 8-inch fab capacity
China-based fabless chipmaker Goodix has booked considerable 8-inch fab capacity at Taiwan Semiconductor Manufacturing Company (TSMC) for its optical in-display fingerprint sensor...