Foundries and IC designers are set to face increasingly volatile market conditions in 2022, as strong demand seen in 2020-2021 is expected to start softening at a slow pace, US-China...
Taiwan is tightening its control over semiconductor and LCD-panel technology transfer to China, seeking to examine investments, mergers and acquisitions involving Chinese individuals...
BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor...
The Chinese authorities have granted SK Hynix merger clearances for its acquisition of Intel's NAND memory and storage unit with conditions, a move some industry analysts say would...
The continuing price hike of overseas semiconductor intellectual property (IP) could force small- and medium-sized IC design houses in South Korea to give up cutting-edge process...
Taiwan is currently lagging in the development of the third-generation semiconductor silicon carbide (SiC), which has grown popular for its potential applications in 5G communications,...
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Technology merger and acquisition activities accelerated in 2021 and deals in Asia broke the US$100 billion mark for the first time in history, totaling US$137.3 billion, up 86.3%...
GlobalWafers, a subsidiary of solar wafer maker Sino-American Silicon Products (SAS), plans to more than double production capacity for third-generation semiconductors in 2022, according...
Taiwan-based IC design houses including first-tier players are aware they will have to accept price increases proposed by pure-play foundries in order to obtain more available fab...
ProAsia Semiconductor (PASC), a wholly-owned subsidiary of Taiwan Asia Semiconductor (TAS, formerly Opto Tech), will be engaged in compound semiconductor R&D and production with...
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Leading manufacturer of assembly equipment for the semiconductor industry, BE Semiconductor Industries N.V. (Besi) announced that due to flooding affecting its main production facility...
As Wi-Fi technology standards continue to advance from Wi-Fi 5 and Wi-Fi 6/6E to Wi-Fi 7, high-frequency and mixed-frequency chips testing interfaces are badly needed to help chipmakers...
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