China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to...

Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and...

The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more...

This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted...

HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...

Days after the launch of Apple's US$2,000 iPhone Duo, a wave of reports regarding broken inner screens has surfaced across Reddit, TechCrunch, and Forbes. Early buyers...

Cadence Design Systems is betting that chipmakers will want AI models trained on its own design tools and run wherever customers choose. That puts it on a different route from rival...

Cadence Design Systems used its third-quarter earnings call to argue that demand for chip design tools is no longer tied only to the AI hardware buildout. It pointed to analog and...

India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded...

Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying...

In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...

Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from...

Mitsubishi Electric has announced plans to carve out its distribution panel components business for factories and commercial buildings into a joint venture (JV) with Swiss power and...

Japan's Leading-edge Semiconductor Technology Center (LSTC), Hokkaido University, Fujifilm Corporation, GE HealthCare Japan, and imec announced a joint initiative in Tokyo on October...

Israeli security firm Lava identified 32 Nvidia Blackwell Ultra B300 GPUs through monitoring endpoints linked to China Telecom, a state-owned carrier. The chips are barred from sale...