BOE Technology expects first-half 2026 net profit to rise sharply as China's largest display panel maker benefits from a stronger LCD cycle, higher-end AMOLED shipments, and the start of mass production at its 8.6-generation OLED line for medium-sized panels.
While the overall mobile market outlook for the second half of 2026 is not especially strong, foldable phones are drawing attention because Apple's first foldable phone is finally expected to arrive. Industry watchers broadly believe the move will inject fresh momentum into the foldable phone market, with Samsung Electronics, Google, Huawei, Xiaomi, and other Android brands also expected to join the broader discussion around the segment.
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the company says the technology is still far from commercial use. GlassBridge is aimed at passive alignment in advanced systems, underscoring the convergence of AI infrastructure, photonics, and packaging.
The rapid expansion of AI applications is redefining what device makers need from display technology.
Apple is reportedly planning to launch at least five new models by this time next year, with the company expanding its foldables' production. Amid surging component prices and a weakening smartphone market, these moves may be a bid to gain market share while rivals are on the back foot.
Chinese polarizer film suppliers are seeking higher prices from panel makers after raw-material and logistics costs rose in the second quarter, exposing a weak point in China's display-material supply chain.
BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team for Micro LED optical interconnect systems and glass substrate-based co-packaged optics (CPO), working with ecosystem partners on early-stage technology research to advance optical interconnect and glass substrate CPO development.
China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on South Korea's chip and panel industries.
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the company says the technology is still far from commercial use. GlassBridge is aimed at passive alignment in advanced systems, underscoring the convergence of AI infrastructure, photonics, and packaging.
