Dell Taiwan general manager Terence Liao said enterprise adoption of AI will continue expanding in scope and scale through 2026. Dell has shipped Nvidia's B300 and GB300 AI servers, with the GB10 model especially popular. While AI servers are booming, the PC market faces headwinds from memory shortages and rising prices, which inevitably impact sales. Liao expects memory price increases to persist, making current PC prices the lowest point for the year.

Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul Economic Daily, citing data from the Financial Services Commission, Samsung plans to invest KRW465.4 billion (approx. US$308.8 million) in its Xi'an plant in 2025, a 67.5% increase over the KRW277.8 billion invested in 2024.

Major memory manufacturer Nanya Technology announced a groundbreaking private placement that, for the first time, will involve four major international companies, forming a notably strong lineup. The investors include NAND leaders Kioxia and Sandisk, SK Hynix's NAND subsidiary Solidigm, and networking giant Cisco Systems. Together, they will subscribe to approximately 352 million common shares.

SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions.

Phison Electronics is partnering with AIC, InWin, and other platform, server, and PC solution providers to deploy Pascari PCIe Gen5 SSDs across the EU, targeting storage bottlenecks for AI and data-center workloads. The move carries wider implications for global supply, energy efficiency, data sovereignty, and operational resilience.

Micron Technology's planned Singapore expansion, driven by soaring AI memory demand, requires hundreds of transformers, signaling supply constraints that could affect global AI and semiconductor infrastructure timelines and costs for data-center buildouts, energy storage projects, and heavy electrical equipment suppliers, potentially reshaping procurement and construction schedules worldwide and logistics planning.

Xiaomi executives outlined the group's 2025 performance and strategic priorities during an investor earnings call and webcast on March 24. Management highlighted record annual revenue and adjusted net profit, then devoted much of the presentation to artificial intelligence (AI), embodied intelligence (physical AI), and progress in the company's electric vehicle (EV) business. The call opened with standard operator instructions and procedural remarks from investor relations, followed by prepared remarks from Xiaomi president Lu Weibing and CFO Alain Lam Sai Wai, who fielded investor questions.

SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of a broader push to tap global capital markets.

SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production capacity for advanced memory products such as high-bandwidth memory (HBM), further cementing its leadership in the global AI semiconductor sector.

SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI architectures, according to Nikkei and PC Watch.

Memory module maker Team Group reported a record-high monthly profit for January 2026, with earnings soaring over 50 times year-over-year. Although shipments declined in February due to the Lunar New Year holidays, the company expects a full recovery of shipment momentum over March. Annual procurement strategies and specification adjustments among system integrator (SI), edge computing, and OEM customers for high-end memory products are anticipated to drive sales in the second quarter of 2026.

Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained a KRW100 billion (US$66.7 million) performance guarantee since early 2025, raising questions about whether its equipment has fully met the chipmaker's requirements.

Zenitron president YY Chou warned that surging demand for AI servers, data centers, and robotics is driving memory shortages that will affect global supply chains and pricing, with gradual market balance expected over two years, influencing hardware costs and capacity planning for international technology companies and data center operators worldwide.

Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis and reliability testing for advanced packaging customers worldwide and reducing testing wait times for partners pursuing heterogeneous integration and chiplet technologies.

The semiconductor market's supply-demand imbalance is affecting more than consumer gadgets, with industrial PC (IPC) makers reporting component shortages and price hikes that dented profitability in the fourth quarter of 2025 and could ripple into 2026, raising risks of order delays and strained supply stability for industrial customers worldwide.

SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth memory (HBM4E).

Samsung Electronics is facing escalating labor tensions after its largest union secured approval for a strike, raising concerns over potential disruptions to semiconductor production at a critical juncture for the global AI supply chain, according to Korean media reports, including SEDaily and Chosun Ilbo.

Below are the most-read DIGITIMES Asia stories from the week of March 16-22, 2026:

Elon Musk has unveiled one of his most ambitious industrial visions yet: a "Terafab" that would allow Tesla and SpaceX to design and manufacture their own semiconductors for artificial intelligence, robotics, and even space-based data centers. While the project reflects Musk's sweeping vision of a vertically integrated, AI-driven future, analysts and industry realities suggest the plan may face formidable technical, financial, and structural obstacles.

Netronix said it expects revenue and profits to continue to climb into 2026 after peaking in 2025, driven by e-book readers, digital advertising displays, and contributions from subsidiaries. The company forecast continued shipment growth and double-digit revenue gains next year.

Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding technologies, as competition shifts from chip performance to packaging capabilities, according to NewDaily.

Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to the supply of HBM4 memory for Nvidia's next-generation AI accelerators.

SK Hynix is targeting the development of autonomous semiconductor fabrication facilities by 2030 as it seeks to address rising AI-driven demand and increasing manufacturing complexity, according to Ddaily, IT Chosun, and SEDaily.