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Tuesday 16 September 2025
SEMICON Taiwan 2025: UK seeks Taiwanese partnerships to overcome domestic chip manufacturing constraints
The United Kingdom demonstrated a prominent presence at SEMICON Taiwan 2025 last week, reinforcing its position as a key player in innovative technology. The UK Department for Business and Trade and Innovate UK, the national innovation agency, led a delegation of over 30 emerging companies across semiconductor manufacturing, design, testing, and materials sectors to the event.
Tuesday 16 September 2025
South Korea's August ICT exports hit record high, Taiwan surge drives growth
South Korea's information and communications technology (ICT) exports in August 2025 reached a record high for the period compared to previous years. Due to rising memory semiconductor prices and increased investment in artificial intelligence server infrastructure, semiconductor export values also reached an all-time high.
Tuesday 16 September 2025
CSPs' shift to eSSDs set to cause QLC NAND Flash shortage by 2026
The increasing demand for big data storage driven by artificial intelligence data centers is expected to intensify a supply shortage of QLC NAND Flash memory, potentially resulting in a significant deficit by 2026. Major US cloud service providers are planning to replace traditional hard disk drives with enterprise-grade solid-state drives on a large scale starting in 2026, which will drive explosive growth in demand for high-capacity QLC SSDs. This transition is anticipated to narrow the price gap between SSDs and HDDs to roughly three times.
Tuesday 16 September 2025
NVIDIA's Rubin CPX may reshape AI memory demand, boosting GDDR7 over HBM
Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context processing workloads and expected to debut in late 2026. Unlike its flagship AI accelerators that rely on HBM, Rubin CPX will feature 128GB of GDDR7, a move that industry observers say could rebalance demand between the two leading memory types, according to SemiAnalysis, Wide Daily, and ET News.
Monday 15 September 2025
Japan grants up to JPY536 billion subsidy to Micron for advanced DRAM production
The Ministry of Economy, Trade and Industry (METI) of Japan announced on September 12, 2025, that it will provide Micron Technology with subsidies amounting to as much as JPY536 billion (US$3.63 billion) for the development and mass production of next-generation DRAM at its Higashihiroshima factory. The assistance is intended to promote advanced research and expand production capacity.
Monday 15 September 2025
CXMT breaks into CXL memory, putting Samsung and SK Hynix on edge
China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market takes off in 2026. According to South Korea's EBN, CXMT has outlined its CXL roadmap to Korean semiconductor component suppliers and begun early design work, with one major substrate partner confirming initial joint R&D on CXL substrates.
Monday 15 September 2025
Nvidia reportedly moving forward with SOCAMM2, Korean memory giants set to gain
Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including Micron, Samsung, and SK Hynix. This move signals a strategic push to address technical challenges and advance AI memory solutions ahead of mass production in 2026.
Monday 15 September 2025
Exclusive: Micron halts NAND and DRAM quotes after SanDisk price hike, sharper increases looming
Memory manufacturers are swiftly following SanDisk's announcement of a 10% price increase for NAND products, signaling a broader industry move toward higher pricing amid expected supply shortages starting in 2026. Micron has paused NAND Flash and DRAM pricing quotes for a week, while market sources anticipate potential NAND Flash price rises of up to 30%.
Saturday 13 September 2025
SK Hynix's rumored slowing TCB investment raises concerns for Hanmi Semiconductor as bonders market expands
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial for HBM production. Industry watchers say this shift could reshape the competitive landscape for suppliers such as Hanmi Semiconductor, even as the broader market for bonding equipment is set for strong growth in the coming years.
Saturday 13 September 2025
Micron courts Trump policies to challenge Korean memory giants
Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media, this move could intensify competitive pressure on non-US rivals such as Samsung Electronics and SK Hynix.
Saturday 13 September 2025
Memory shortages stretch into 2026, fueling revenue boom for Taiwanese suppliers
The global memory industry saw simultaneous growth in volume and pricing during the third quarter of 2025, with DRAM and NAND memory prices rising amid ongoing supply constraints. Market participants anticipate that the DDR4 supply-demand imbalance will persist for another two to three quarters, leading to price increases for both DDR4 and DDR5 into early 2026. Chinese manufacturers have also raised NOR Flash prices, while Taiwanese suppliers are preparing price hikes starting in the fourth quarter to offset rising costs.
Friday 12 September 2025
Nvidia reportedly asks Samsung to double GDDR7 memory orders
Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue. South Korean sources indicate that while Samsung currently trails in supplying fifth-generation high bandwidth memory (HBM3E), its exclusive GDDR7 supply and mass production capabilities could help secure its position in Nvidia's upcoming sixth-generation HBM (HBM4).
Friday 12 September 2025
China's 10 memory firms post mixed 1H25: sales rise, profits lag
By September 2025, half-year earnings reports from 10 Chinese memory firms are in. Nine posted revenue growth, underscoring solid top-line momentum. Profitability, however, diverged sharply: companies could generate sales but struggled to convert them into lasting profits.
Friday 12 September 2025
SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the South Korean company debuted its "2.5D big-die TC/FC bonder," designed for AI chips and capable of packaging interposers up to 120mm x 120mm—over six times larger than conventional semiconductor sizes.
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.
Thursday 11 September 2025
Winbond sees nearly 90% DRAM price increase, aims for 4Q25 peak
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized after cumulative hikes of 80% to 90% since the second quarter price bottom. The company anticipates its DDR4 operations will reach yearly peak performance in the fourth quarter of 2025, driven largely by strong demand for the DDR4 4Gb product variant.
Thursday 11 September 2025
Phison Electronics reports record revenue growth amid rising AI demand and potential memory shortages
Phison Electronics posted consolidated revenue of NT$5.934 billion (approx. US$195.7 million) for August 2025, marking a 4.3% increase from July and a 23% rise year-over-year, reaching a historical high for the month. The cumulative revenue from January to August 2025 hit NT$43.35 billion, also setting a new record.
Thursday 11 September 2025
CXMT said to target 2026 HBM3E mass production, narrowing gap with Samsung and SK Hynix to 2 years
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South Korean outlet Business Post reported that CXMT may start mass production of HBM3E as early as 2026, far ahead of expectations, underscoring how quickly the company is closing the gap with its South Korean competitors.
Thursday 11 September 2025
South Korean memory giants reportedly accelerate domestic production amid US export control threats
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly expanding DRAM production capacity in South Korea, with plans to complete its Cheongju plant by the fourth quarter of 2025.
Wednesday 10 September 2025
AP Memory's new ApSRAM completes customer validation, aims for mass production in 2025
AP Memory has announced that its new generation PSRAM, known as ApSRAM (Attached-pSRAM), has completed customer platform validation and is slated for mass production by the end of 2025. The company highlighted the product's suitability for edge computing and Internet of Things (IoT) applications.
Wednesday 10 September 2025
YMTC launches US$2.9B Phase III project as Hubei state investors step up; no Big Fund in sight
Yangtze Memory Technologies (YMTC) officially registered its Phase III unit, Changcun Phase III (Wuhan) Integrated Circuit, on September 5. The company has not disclosed details on investment, technology roadmap, or capacity, but the move indicates YMTC is preparing for fresh expansion. Market speculation continues over whether the initiative signals a push into the DRAM segment.
Wednesday 10 September 2025
Commentary: YMTC's decade-long march, leadership shifts, and the undercurrent of China's memory substitution drive
YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan, signaling its determination to scale up capacity and sharpen its edge in next-generation memory chips. The move not only underscores Beijing's backing of a national champion but also raises the stakes in the intensifying global memory race.
Wednesday 10 September 2025
SEMICON Taiwan 2025: Memory giants compete in customized HBM race amid AI surge
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The three major memory manufacturers are treating advanced memory technologies as a primary battleground, with customized HBM emerging as a key strategic focus.
Tuesday 9 September 2025
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position. Micron Technology reports its 2026 HBM output is already sold out, underscoring the company's confidence in its market position as demand intensifies.
Tuesday 9 September 2025
Samsung to double GDDR7 output following Nvidia B40 order
Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously used in the China-market-specific AI accelerator B40, drawing significant attention to the ongoing collaboration between Samsung and Nvidia.