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Thursday 12 February 2026
HBM4 first-mover fog: Samsung and Micron duel for supremacy amid Nvidia supply tension
Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.
Thursday 12 February 2026
China's Lenovo profit drops 21% even as revenue climbs 18%, flags memory shortage pressure
Lenovo Group reported a 21% decline in third-quarter profit but exceeded analyst expectations as strong revenue growth, driven by artificial intelligence (AI) demand, helped offset margin pressures. The company also warned of mounting pressure on PC shipments due to a worsening memory-chip shortage.
Thursday 12 February 2026
Cisco revenue beats expectations, but margin outlook pressured by rising memory costs

Cisco Systems forecast quarterly gross margins below market expectations, citing higher memory chip costs. The weaker margin outlook overshadowed stronger-than-expected results and sent shares down about 7% in extended trading.

Thursday 12 February 2026
SMIC warns AI pull-forward is rewriting chip cycle, lifts mature-node pricing
The global foundry industry is undergoing a structural shift, and it is emerging first in mature process nodes once widely considered oversupplied. SMIC stated on February 11 that its performance in the first quarter of 2025 defied seasonality. Utilization held steady from the prior quarter, and pricing for mature nodes has begun to stabilize.
Thursday 12 February 2026
Global Mixed-Mode's DDR5 PMIC push signals tighter memory supply and margin focus
Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising memory prices make PC and smartphone end-demand unpredictable. The company disclosed its operational outlook and market observations during an investor briefing on February 10, 2026.
Thursday 12 February 2026
Micron begins high-volume HBM4 shipments as supply stays tight and capex rises
Micron Technology has begun high-volume production and customer shipments of its next-generation HBM4 memory, ramping volumes earlier than expected amid tight industry supply, CFO Mark Murphy said at an analyst meeting on February 11. Murphy also signaled higher capital spending driven by strong AI-related demand and multiyear supply commitments.
Wednesday 11 February 2026
Taiwan breaks ground on 12-inch semiconductor R&D base at ITRI, backed by TSMC equipment donations
Taiwan has launched construction of a new 12-inch semiconductor pilot production platform at the Industrial Technology Research Institute (ITRI), aiming to strengthen the island's advanced R&D capabilities while lowering development and verification barriers for startups and small-to-medium IC design firms.
Wednesday 11 February 2026
Memory squeeze from AI demand threatens industrial PC margins and delivery timelines
The expansion of computing power driven by generative AI has repositioned memory as a critical resource, with data centers and AI servers redefining its value and leaving industrial PC (IPC) manufacturers facing rising costs and worsening lead-time challenges as 2026 begins.
Wednesday 11 February 2026
Taiwan exports exceed NT$2 trillion in January, memory shortage escalates
Taiwan's Ministry of Finance (MOF) announced on February 9, 2026, that Taiwan's exports in January 2026 hit a record high, surpassing NT$2 trillion (US$63.4 billion) for the first time, up 69.9% year-on-year. Strong demand for AI servers, ongoing memory shortages, and the competitiveness of Taiwan's semiconductor products drove the surge.
Tuesday 10 February 2026
SK Hynix set to ship HBM4 for Nvidia's Vera Rubin this month

SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power semiconductor designed for Nvidia's next-generation artificial intelligence accelerator, Vera Rubin.

Tuesday 10 February 2026
China reportedly enters HBM3 mass production as South Korea pushes into HBM4

China is preparing to initiate large-scale production of high-bandwidth memory (HBM), narrowing a technology gap with South Korea in a critical component for AI semiconductors. As Chinese manufacturers ramp up current-generation output, South Korean memory makers are moving to extend their market lead with next-generation products.

Tuesday 10 February 2026
Phison CEO meets India's Modi to boost NAND, edge AI strategies
Phison Electronics CEO Khein-seng Pua met with Indian Prime Minister Narendra Modi on February 8, 2026, to discuss leveraging their respective strengths to advance the deployment of NAND flash storage and edge artificial intelligence (AI) technologies.
Tuesday 10 February 2026
Behind Nvidia’s fried-chicken diplomacy
Nvidia CEO Jensen Huang reportedly hosted a "fried chicken and beer" meeting in Silicon Valley on February 5, 2026, with SK Group chairman Tony Choi, according to industry sources cited by Yonhap News Agency and The Hankyung. The informal dinner in Santa Clara took place at the restaurant "99 Chicken" and followed a similar high-profile gathering Huang held in Seoul in October 2025 with Samsung Electronics chairman Lee Jae-yong and Hyundai Motor Group chairman Chung Eui-sun.
Tuesday 10 February 2026
Memory cost pressures lead ODMs to adopt cautious 2026 outlook for notebook shipments
Notebook ODMs reported mixed January 2026 shipment results, with Quanta declining year-over-year while Wistron and Inventec showed growth. The industry expects a first quarter seasonal decline and overall 2026 shipments to face challenges due to memory shortages and price hikes.
Tuesday 10 February 2026
Japanese election landslide puts Korean spotlight on chips, Rapidus and TSMC
Japanese Prime Minister Sanae Takaichi secured a decisive victory in the February 8, 2026, lower house election after her Liberal Democratic Party (LDP) won 316 seats, surpassing the two-thirds threshold required to control parliamentary committees and initiate constitutional revisions.
Monday 9 February 2026
Can ZAM replace HBM? Intel, SoftBank push 'alternative' memory architecture
As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM capacity remains concentrated among Samsung, SK Hynix, and Micron.
Monday 9 February 2026
Samsung boosts HBM4 DRAM investment to secure market leadership
Samsung Electronics is set to begin mass production of the world's first sixth-generation high-bandwidth memory (HBM4) chips later in February 2026, marking a major milestone in the race to supply critical components for next-generation AI hardware. Industry sources cited by the Yonhap News Agency say shipments could start as early as next week, following the Lunar New Year holiday, with Nvidia among the first customers.
Monday 9 February 2026
Generic DDR shortage persists as smartphone brands adopt multi-pronged strategies
The smartphone industry is facing ongoing challenges from soaring memory prices, with many expecting the market to contract in 2026. Mid- and low-tier smartphones are projected to suffer the most significant impact. Retailers report that the persistent shortage and price surge of generic DDR memory remain unresolved. Smartphone manufacturers have responded with various strategic measures, including adjusting pricing and downgrading specifications for mid- and low-end models.
Monday 9 February 2026
Winbond, Macronix post strong January sales as memory demand heats up
Memory makers Macronix International and Winbond Electronics reported impressive revenue growth for January 2026, signaling a positive trend in the memory market despite the traditional seasonal slowdown.
Monday 9 February 2026
Silicon Motion expands enterprise storage amid NAND supply shift
NAND flash supply shortages have pushed original manufacturers to focus on AI servers, leaving PC and smartphone markets to memory module vendors. This shift offers Silicon Motion an opportunity to grow its market share in NAND controllers.
Monday 9 February 2026
Samsung, SK Hynix shift to shorter memory contracts as prices surge

Memory chip manufacturers are adjusting long-standing supply practices in response to rising prices. According to South Korean media reports, suppliers are shortening contract durations and introducing "post-settlement" pricing mechanisms that allow payments to be adjusted after delivery to reflect market movements.

Monday 9 February 2026
512Gb NAND wafer shortage triggers forced upgrades, narrows gap with 1Tb

The supply landscape for 3D NAND wafers is being structurally reshaped as major manufacturers shift capacity aggressively toward enterprise storage. While output of mainstream 1Tb dies is ramping rapidly, prices for 512Gb TLC wafers have surged. Though 1Tb TLC wafer prices rose to around US$23 in February 2026, the gap with 512Gb wafers has narrowed sharply to below 30%.

Sunday 8 February 2026
Silicon Motion posts strong Q4 results, forecasts continued growth in 2026

Silicon Motion Technology, a leading global supplier of NAND flash controllers, reported robust financial results for the fourth quarter of 2025, driven by broad-based product growth and expanding market share across key segments.

Saturday 7 February 2026
SK Hynix clears power hurdle in Yongin as Samsung faces site delays

South Korea is moving ahead with plans to develop what it bills as the world's largest semiconductor cluster in Yongin, Gyeonggi Province, where SK Hynix and Samsung Electronics plan to build up to 10 advanced wafer fabs. Infrastructure issues that once drew intense scrutiny, particularly power supply, have eased after authorities adopted an unconventional approach that integrates power grids into road construction.

Friday 6 February 2026
South Korean president meets conglomerate chiefs as Samsung, others pledge US$186b in regional investments

South Korean President Lee Jae-myung recently convened a meeting at the Blue House titled the "Corporate Roundtable on Youth Employment and Expanded Regional Investment," bringing together leaders from the country's 10 largest conglomerates, including Samsung Electronics, Hyundai Motor and LG Group, along with representatives from the financial sector. Lee urged companies to work with the government to promote youth employment, entrepreneurship and more balanced regional development.