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Sunday 29 March 2026
Samsung's 2026 strike poses bigger challenges despite economic shift and tripled scale
Samsung Electronics is facing a looming labor strike in May as its memory and foundry businesses take off, marking a more complex challenge than the initial 2024 walkout. The upcoming strike reflects significant changes in industry conditions and union size, highlighting Samsung's structural difficulties with labor issues amid evolving laws and its broad business portfolio.
Sunday 29 March 2026
Innodisk says AI success depends on software-hardware integration, signaling shifts for edge and industry deployments
Innodisk told attendees at the 2026 AI EXPO that effective AI deployment requires more than raw computing power; it depends on tight integration between software and hardware, and on selecting components tailored to specific environments. The company argued that edge AI has progressed from image recognition and language models to autonomous learning and decision-making.
Sunday 29 March 2026
Adata invests US$3 million in KonstTech to boost AI computing infrastructure
Amid the rapid development of generative artificial intelligence (GenAI) and large language models (LLM), global demand for high-performance computing (HPC) continues to rise. Memory module maker Adata Technology announced a US$3 million investment in the Series A funding round of artificial intelligence (AI) computing infrastructure provider KonstTech (Konst).
Sunday 29 March 2026
AI demand leaves memory industry's commodity model intact

espite a surge in demand driven by generative artificial intelligence, the fundamental economics of the memory industry remain largely intact. While high-bandwidth memory (HBM) has created a premium segment, the broader market continues to operate on standardized, high-volume production rather than structural product differentiation.

Sunday 29 March 2026
AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to NewDaily, as major technology firms reportedly begin on-site audits of its production lines.

Sunday 29 March 2026
SK Hynix and Kioxia targeted in US ITC memory chip probe
On March 27, the US International Trade Commission (ITC) launched an investigation into memory chip imports by SK Hynix Inc. and KIOXIA Holdings Corporation following a patent complaint filed by MonolithIC 3D Inc., according to a notice published by the agency.
Saturday 28 March 2026
Samsung bets on turnkey strategy as non-memory strength becomes critical
Samsung Electronics is aggressively pushing its semiconductor "super-gap" core strategy centered on a turnkey solution model. However, the success of this approach hinges on restoring and rebuilding competitiveness in its non-memory businesses.
Friday 27 March 2026
SK Hynix CEO expected to meet Microsoft executive on memory supply

SK Hynix CEO Kwak Noh-jung is expected to meet Scott Guthrie, executive vice president of Cloud and AI at Microsoft, in Seoul this week to discuss memory supply, according to Maeil Business Newspaper, citing industry sources.

Friday 27 March 2026
CXMT revenue doubles on AI-driven memory boom ahead of major China IPO

ChangXin Memory Technologies (CXMT) more than doubled revenue to about US$8 billion in 2025, as surging demand from artificial intelligence (AI) and data centers drove up memory chip prices, according to Bloomberg. The growth provides a boost to the strategically important Chinese chipmaker ahead of a planned domestic IPO.

Friday 27 March 2026
DRAM ASPs surged up to 80% QoQ in 1Q26, fueling US$1 trillion chip boom and supply squeeze, says Omdia analyst

The global semiconductor industry is set to surpass the US$1 trillion revenue mark in 2026, driven by accelerating artificial intelligence demand, but the milestone comes with mounting structural pressures—particularly in memory—that are beginning to ripple across the broader electronics ecosystem.

Friday 27 March 2026
In-depth: Google TurboQuant cuts LLM memory 6x, resets AI inference cost curve

Google has introduced TurboQuant, a compression algorithm that reduces large language model (LLM) memory usage by at least 6x while boosting performance, targeting one of AI's most persistent bottlenecks: memory. The breakthrough lowers inference costs and expands deployment across cloud and edge environments.

Friday 27 March 2026
SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence (AI) infrastructure, as surging demand reshapes the memory industry and drives a new round of capital spending.

Friday 27 March 2026
Adata secures NT$12B syndicated loan to drive expansion, debuts Trusta for edge AI infrastructure
Taiwan's memory module giant Adata Technology has secured a NT$12 billion (US$375 million) syndicated loan led by Bank of Taiwan, strengthening its mid-term working capital while advancing its expansion into enterprise AI infrastructure.
Friday 27 March 2026
SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial projections as it advances its next-generation roadmap amid evolving market conditions.

Friday 27 March 2026
DRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits
Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential memory types—DRAM (mainly LPDDR) and NAND flash—are soaring faster than ever before.
Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers, foundries, and equipment suppliers worldwide. Demand for integrated microscopy platforms and localised service hubs is increasing to control yield, reduce costly iterations, and secure AI supply-chain positions.
Friday 27 March 2026
Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the acquisition of a facility previously owned by Powerchip Semiconductor Manufacturing Corporation (PSMC).

Thursday 26 March 2026
Dell sees stronger AI demand boosting early PC orders despite memory price hikes
Dell Taiwan general manager Terence Liao said enterprise adoption of AI will continue expanding in scope and scale through 2026. Dell has shipped Nvidia's B300 and GB300 AI servers, with the GB10 model especially popular. While AI servers are booming, the PC market faces headwinds from memory shortages and rising prices, which inevitably impact sales. Liao expects memory price increases to persist, making current PC prices the lowest point for the year.
Thursday 26 March 2026
Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul Economic Daily, citing data from the Financial Services Commission, Samsung plans to invest KRW465.4 billion (approx. US$308.8 million) in its Xi'an plant in 2025, a 67.5% increase over the KRW277.8 billion invested in 2024.
Thursday 26 March 2026
Nanya Technology secures major private placement with Kioxia, Sandisk
Major memory manufacturer Nanya Technology announced a groundbreaking private placement that, for the first time, will involve four major international companies, forming a notably strong lineup. The investors include NAND leaders Kioxia and Sandisk, SK Hynix's NAND subsidiary Solidigm, and networking giant Cisco Systems. Together, they will subscribe to approximately 352 million common shares.
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions.
Thursday 26 March 2026
Phison partners with EU vendors to deploy Pascari PCIe Gen5 SSDs
Phison Electronics is partnering with AIC, InWin, and other platform, server, and PC solution providers to deploy Pascari PCIe Gen5 SSDs across the EU, targeting storage bottlenecks for AI and data-center workloads. The move carries wider implications for global supply, energy efficiency, data sovereignty, and operational resilience.
Wednesday 25 March 2026
Micron's Singapore expansion could trigger global transformer shortage and delay AI data centers
Micron Technology's planned Singapore expansion, driven by soaring AI memory demand, requires hundreds of transformers, signaling supply constraints that could affect global AI and semiconductor infrastructure timelines and costs for data-center buildouts, energy storage projects, and heavy electrical equipment suppliers, potentially reshaping procurement and construction schedules worldwide and logistics planning.
Wednesday 25 March 2026
Xiaomi flags memory pressure, sees Apple user conversions, and pushes embodied AI strategy
Xiaomi executives outlined the group's 2025 performance and strategic priorities during an investor earnings call and webcast on March 24. Management highlighted record annual revenue and adjusted net profit, then devoted much of the presentation to artificial intelligence (AI), embodied intelligence (physical AI), and progress in the company's electric vehicle (EV) business. The call opened with standard operator instructions and procedural remarks from investor relations, followed by prepared remarks from Xiaomi president Lu Weibing and CFO Alain Lam Sai Wai, who fielded investor questions.
Wednesday 25 March 2026
SK Hynix files for potential US listing and ramps EUV investment as AI demand accelerates
SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of a broader push to tap global capital markets.