China–US trade fell 9.3% year-over-year in the first half of 2025, totaling CNY2.08 trillion (approx. US$290 billion), according to data released by the General Administration of Customs on July 14. Chinese exports to the US dropped 9.9% to CNY1.55 trillion, while imports from the US fell 7.7% to CNY530.35 billion during the same period.
As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.
Below are the most-read DIGITIMES Asia stories from July 7 to July 13, 2025. This week's top three highlights include China’s semiconductor ambitions facing setbacks as Jiangsu Advanced Memory Semiconductor cancels its restructuring amid investment delays. Meanwhile, MediaTek gains ground on Qualcomm in China’s premium smartphone market, signaling a notable industry shift. The US-China semiconductor standoff shows signs of tactical maneuvering, with both sides testing political and economic limits.
Samsung Electronics is placing a high-stakes bet on its 2nm chip manufacturing technology, as its foundry division works to reverse mounting losses and compete more effectively with global leader TSMC.
