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Wednesday 17 December 2025
Moore's Law of Economy: Former TSMC exec warns semiconductor talent gap could widen 15-fold
Burn-Jeng Lin, one of TSMC's six R&D pioneers and current dean of National Tsing Hua University's College of Semiconductor Research, introduced the concept of a "Moore's Law of Economy" on December 16, 2025. He emphasized that innovation can still overcome the physical limits of chip size reduction, but warned that global semiconductor talent shortages may expand 15-fold as countries race to build complete supply chains.
Wednesday 17 December 2025
MSScorps eyes rebound as angstrom-era and silicon photonics demand surges
MSScorps signaled a business recovery on Wednesday following a midyear lull, citing surging demand for angstrom-era semiconductor manufacturing and silicon photonics as key drivers for growth heading into 2026. The Taiwan-based materials analysis firm reported record November 2025 sales after overcoming third-quarter delays caused by strategic adjustments at major foundry and equipment clients.
Wednesday 17 December 2025
Topco partners with Taiwan academia to advance semiconductor materials R&D
In a strategic move to bolster Taiwan's semiconductor talent pipeline and advanced research capabilities, Topco Scientific Co. (TSC) announced on December 16, 2025, a deep industry-academia collaboration with the College of Semiconductor Research at National Tsing Hua University (NTHU).
Wednesday 17 December 2025
Taiwan's WIN Semiconductors bets on optical and microwave tech for the space age
The rapid push by companies such as SpaceX and Amazon to develop space-based AI data centers is creating new applications for optical communications, a technology long viewed as central to the future of high-speed data transmission.
Wednesday 17 December 2025
Tokyo Ohka ramps up South Korea investment for advanced chip materials

Tokyo Ohka Kogyo plans to accelerate investment in South Korea and expand production of materials critical to generative AI semiconductors, positioning itself to meet rising demand for advanced lithography and packaging technologies.

Tuesday 16 December 2025
'Father of Immersion Lithography' warns: Intel's TSMC talent grab invites process tech scrutiny
Intel's recruitment of Wei-jen Lo, formerly TSMC's Senior Vice President of Strategy Development, signals an aggressive push by the US IDM to regain process leadership. However, industry veteran Burn J. Lin argues that while high-level talent acquisition is significant, it does not guarantee the ability to replicate TSMC's manufacturing success.
Tuesday 16 December 2025
Intel deepens policy alignment with executive reshuffle following US government investment
Intel has announced several key executive appointments, including Robin Colwell, former deputy director of the US National Economic Council under US President Donald Trump, as senior vice president of Government Affairs. This appointment follows the US government's August investment in acquiring a 10% stake in Intel, signaling a closer partnership to advance US semiconductor policy, according to Bloomberg, Reuters, and CRN Magazine.
Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US and its allies use stringent export controls to reshape the advanced node industry order, China's semiconductor industry is aggressively pursuing self-sufficiency across equipment, materials, and processes to mitigate reliance on foreign suppliers.
Tuesday 16 December 2025
SenseTime's Seko 2.0 ties AI video breakthrough to Cambricon chips, signaling China's multimodal push

SenseTime has released Seko 2.0, which it describes as the industry's first multi-episode video generation agent, marking a step beyond short AI clips toward longer, more coherent video content.

Monday 15 December 2025
Samsung chair, Musk reportedly meet at Texas fab as chip output looms
Samsung Electronics chairman Jay Y. Lee reportedly met Tesla CEO Elon Musk on December 11, 2025, local time at Samsung's semiconductor plant in Texas, underscoring a deepening partnership as the South Korean chipmaker prepares to launch advanced chip production in the US and stabilize manufacturing yields for Tesla's next-generation processors.
Monday 15 December 2025
Samsung courts AMD for 2nm chips as foundry recovery hinges on new orders
Samsung Electronics is reportedly in talks with Advanced Micro Devices about producing next-generation chips using its second-generation 2nm process, as the South Korean technology group seeks to secure major customers and revive its loss-making foundry business, according to industry sources and reports from South Korea's Seoul Economic Daily and G-enews.
Monday 15 December 2025
TSMC, Broadcom AI outlook signals strong growth for Samsung, SK Hynix in 2026
Analysts believe that the performance outlook for 2026 from Taiwan Semiconductor Manufacturing Company (TSMC) and Broadcom offers a glimpse into the expected performance of South Korea's two semiconductor leaders, Samsung Electronics and SK Hynix.
Monday 15 December 2025
Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
Monday 15 December 2025
Intel CEO backs India's step-by-step semiconductor push
As India intensifies its efforts to become a global semiconductor hub, Intel CEO Lip-Bu Tan has expressed support for the country's strategy of pursuing incremental progress, focusing initially on legacy node fabrication for automotive and industrial applications.
Monday 15 December 2025
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To address the strong demand for advanced packaging capacity from AI GPU and ASIC vendors, and as IC design houses increasingly introduce second suppliers to enhance supply chain resilience, TSMC is expected to begin expanding the release of Chip-on-Wafer (CoW) packaging process orders to OSAT providers starting in 2026-2027.
Monday 15 December 2025
Intel reportedly to buy AI chip startup SambaNova, reviving governance questions over CEO ties
Bloomberg, citing unnamed sources, reported that Intel Corp. is in advanced discussions to acquire artificial intelligence chip startup SambaNova Systems Inc. for about US$1.6 billion including debt, a move that could significantly bolster Intel's AI product portfolio while reigniting scrutiny over governance and potential conflicts of interest linked to its chief executive.
Monday 15 December 2025
Taiwan set for 2026 outperformance on AI, advanced chip orders

Global growth is poised to lose momentum. IMF forecasts show global GDP easing from 3.3% in 2024 to 3.2% in 2025 and 3.1% in 2026. China's growth is expected to slow from 5% to 4.8% and then to 4.2%, while India may dip from 6.6% to 6.2%. Taiwan remains an outlier, supported by strong AI and semiconductor investment and exports, with GDP projected at 7.37% in 2025. Continued strength in AI server exports could also lift its 2026 forecast of 3.54%.

Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA).
Monday 15 December 2025
Samsung pushes new thermal packaging to win back Qualcomm and Apple

Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market share from TSMC. The South Korean company plans to offer its Heat Path Block solution to third-party chip designers after validating the system in its upcoming Exynos 2600 processor, according to local media reports.

Monday 15 December 2025
India roundup: Intel commits to India semiconductor mission
Intel and Tata to assemble chips locally as global firms, including Amazon, Microsoft, and Vingroup, announced fresh investments in India.
Sunday 14 December 2025
Taiwan's WinWay partners with Technoprobe and MS SUN in 5-year MEMS probe card deal
Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater China distributor MS SUN Technology. The contract, spanning at least five years, covers the procurement of micro-electro-mechanical systems (MEMS) probe card products, marking a significant cross-border collaboration in the semiconductor testing sector.
Sunday 14 December 2025
Shih Her Technologies sees rising semiconductor demand driving growth despite labor challenges
Precision parts cleaning, once considered a routine task, has become a vital part of the semiconductor supply chain due to increasing demands for advanced process yields. Shih Her Technologies president Shyue-Jer Chen highlighted how this shift affects equipment utilization, process stability, and chip yields, raising the sector's importance year by year.
Saturday 13 December 2025
Commentary: Uncertainty rises as US delays Section 232 semiconductor tariff ruling after eight months
The US Department of Commerce (DOC) launched a Section 232 national security investigation on April 1, 2025, targeting semiconductors, manufacturing equipment, and related products. The review remains ongoing more than eight months later, as disagreements are still unsettled regarding which items should face tariffs and at what rates.
Friday 12 December 2025
Intel reportedly tests chip tools linked to sanctioned Chinese firms for 14A

Intel has evaluated advanced manufacturing equipment from ACM Research, a US supplier with subsidiaries subject to American trade restrictions, even as Chinese semiconductor toolmakers report surging revenues and technological gains.

Friday 12 December 2025
Japan's major banks and corporations back Rapidus with massive financing and new investments
Japan is accelerating its national push to rebuild an advanced semiconductor ecosystem as Rapidus, the country's flagship next-generation chip venture, secures financing from major banks and private equity from more than twenty Japanese companies. According to reports from Nikkei and Asahi Shimbun, Japan's three megabanks, Mitsubishi UFJ Bank, Sumitomo Mitsui Banking, and Mizuho Bank, will provide Rapidus with up to JPY2 trillion (approx. US$12.8 billion) in financing.