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Sunday 11 January 2026

Taiwan's Yield Microelectronics rakes in IP royalties, stands as semiconductor outlier

Yield Microelectronics Corp., a Taiwanese designer of embedded nonvolatile memory (eNVM) silicon intellectual property, has quietly established itself as a leader in multi-time programmable eNVM for logic processes. Buoyed by a growing stream of royalty income, the company has posted gross margins of 99% for two consecutive years—an exceptionally rare figure in the semiconductor industry.

Sunday 11 January 2026

WinWay reports record revenue growth driven by AI demand in 2025

Semiconductor test solution supplier WinWay recorded its highest-ever revenue in December 2025, fueled by strong demand from artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuit (ASIC) customers. The company's December revenue reached NT$928 million (US$29.44 million), up 103.79% year over year and 48.42% from November.

Saturday 10 January 2026

Chicony Power targets 2H26 benefits from Supermicro AI container supply chain entry

With the ongoing volatility in the electronics supply chain and persistent component shortages, Chicony Power is accelerating its transformation on the back of its existing notebook power supply business. The company is cautious for 2026 with expectations that the PC and consumer electronics industries will be constrained by semiconductor supply issues. In response, Chicony Power stated that it will shift its operational focus from pursuing shipment scale to optimizing its product mix. Through strategic alliances, the company has officially entered Supermicro's modular AI containerized computing center supply chain, intending to offset volatility in the traditional consumer electronics market with high-value-added AI applications and intelligent solutions.

Saturday 10 January 2026

Trump praises US stake as Lip-Bu Tan reports 18A chips on schedule

US President Donald Trump recently met with Intel CEO Lip-Bu Tan at the White House to discuss the development progress of Intel's next-generation processors and the latest status of the US government's investment in the company. Trump later posted on Truth Social that the meeting with "the very successful Intel CEO" was highly productive and emphasized that the US government's stake in Intel is a great deal, helping bring advanced chip manufacturing back to the US. In his post, Trump also wrote that Intel has launched its first CPU designed, manufactured, and packaged in the US at sub-2nm process technology.

Friday 9 January 2026

Taiwan targets SiPh CPO-AI ecosystem in 10-year plan

Taiwan's National Science and Technology Council (NSTC) has designated the silicon photonics (SiPh) co-packaged optics (CPO)-AI ecosystem as a core focus for the next decade, aiming to advance key AI computing infrastructure and technologies. This move aligns with the government's new AI-driven initiatives under the "New Ten Major AI Construction Projects," which include unmanned vehicles, smart robots, SiPh, and quantum technology development. The NSTC's decision comes amid a stalled 2026 budget proposal totaling NT$299.2 billion (US$9.5 billion), which includes funding for these critical tech sectors. If the 2026 plan is interrupted, continuation will depend on securing support beyond 2027 to maintain momentum in this strategic area.

Friday 9 January 2026

AMEC chairman plans share sale after restoring Chinese citizenship

AMEC disclosed on January 8, 2026, that its founder and chairman, Gerald Yin, plans to reduce his personal shareholding over the next three months to meet tax obligations following his restoration of Chinese citizenship. The filing shows that Yin plans to sell up to 290,000 shares via centralized bidding starting 15 trading days after the announcement, with the sale window running from January 30 to April 29, 2026. The transaction represents 0.046% of AMEC's total outstanding shares.

Friday 9 January 2026

AMIES Technology acquires SMEE affiliate in US$32m deal, clarifying China's lithography split

China's domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating industrial assets originally spun out from Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE). Corporate filings and Shanghai Securities News show that AMIES has acquired 100% of Shanghai Weiyao Industrial Co. for CNY228.5 million (US$32.5 million), replacing SMEE as the sole shareholder. The transaction completes SMEE's exit from Weiyao while keeping the asset within the SMEE-origin corporate structure.

Friday 9 January 2026

MSScorps hits record 4Q25, 2025 revenue on AI and chip demand

Materials test and analysis provider MSScorps continued its record-breaking revenue performance in December 2025, buoyed by active investments by customers in advanced processes and next-generation advanced packaging technologies. Robust demand from semiconductor and artificial intelligence (AI) customers fueled orders for materials analysis, as well as silicon photonics (SiPh) and AI inspection and testing services.

Friday 9 January 2026

MA-tek reports higher December and full-year revenue driven by AI chip and advanced process demand

Taiwan-based semiconductor testing firm MA-tek announced December 2025 revenue of NT$501 million (approx. US$15.91 million), marking a 2.7% increase from November and a 10.65% rise compared to December 2024. The growth was mainly fueled by accelerated in-house ASIC development among cloud service providers (CSPs) and increased requirements for materials analysis (MA) and failure analysis (FA) testing amid advanced process development. For the full year, MA-tek achieved NT$5.545 billion in revenue, up 8.51% year-over-year.

Friday 9 January 2026

TSMC posts strong full-year growth in 2025 as December revenue eases on seasonal shipment patterns

TSMC reported solid year-over-year growth in December 2025 revenue, even as monthly momentum softened slightly toward the end of the year, underscoring resilient underlying demand led by advanced technologies while reflecting seasonal shipment patterns.

Friday 9 January 2026

Commentary: How fragile is the China–Japan semiconductor supply chain?

China has intensified pressure on Japan's supply chains. Following curbs on dual-use items and rare earth exports, the Ministry of Commerce has launched an anti-dumping probe into Japanese-origin dichlorosilane (DCS).

Friday 9 January 2026

SAS and GlobalWafers see slight 2025 revenue dip; TSC, AWSC, ATC hit new highs

SAS subsidiary GlobalWafers reported consolidated revenue of NT$5.506 billion (US$173.9 million) in December 2025, up 16.86% month-over-month and 0.27% year-over-year, marking the third-highest historical level for the period. For the fourth quarter of 2025, consolidated revenue reached NT$14.502 billion, a marginal 0.06% quarter-over-quarter increase but an 11.27% decline from the previous year. Full-year 2025 consolidated revenue totaled NT$60.598 billion, down 3.24% year-over-year.

Friday 9 January 2026

Commentary: China's DCS probe against Japan shows where substitution is viable

China's Ministry of Commerce said on January 7, 2026, that it has launched an anti-dumping investigation into Japanese-origin dichlorosilane (DCS). While framed as a routine trade-remedy case under existing rules, the decision reflects a more specific reality in the semiconductor materials supply chain: China now has domestic fallback capacity in this critical process material, allowing policymakers to act selectively at a sensitive juncture.

Friday 9 January 2026

Niching Industrial reports record revenue driven by advanced packaging materials in December 2025

Niching Industrial, a supplier of semiconductor packaging materials, reported consolidated revenue of NT$128.37 million (approx. US$4.07 million) in December 2025, representing a 25% year-over-year and 16% month-over-month increase. The company's full-year revenue reached NT$1.275 billion, up 11% from 2024, marking its highest annual revenue in nearly 14 years.

Friday 9 January 2026

Taiwan accelerates infrastructure expansion to fortify AI and chip supply chains

As Taiwan's semiconductor and AI server industries rapidly expand—led by TSMC and major hardware manufacturers—the government is accelerating infrastructure planning to secure industrial land, water supply, and green energy, while balancing domestic capacity constraints with overseas investment.

Friday 9 January 2026

China tests US-Japan-South Korea alliance with export controls

China is testing the extent of support US President Donald Trump would extend to Japan by imposing export controls on the country, just months after Trump boasted that he had solved the rare earth issue for the whole world. Beijing has announced a ban on exports of all dual-use items that could potentially be used for military purposes. The move could impact approximately 40% of China's exports to Japan and pose a threat to its automotive industry, which relies heavily on rare earths. Shortly following this announcement, China launched an anti-dumping investigation into dichlorosilane, a key chipmaking material originating from Japan.

Friday 9 January 2026

TSMC Arizona's land purchase signals continued expansion of US chip manufacturing footprint

TSMC said on January 8 that it has acquired land in Arizona through its subsidiary TSMC Arizona, marking another step in expanding its overseas manufacturing footprint.

Friday 9 January 2026

Samsung Foundry eyes auto chips for growth beyond data centers

Samsung Electronics is positioning its contract chipmaking business to win automotive orders, a move industry analysts view as a practical entry point into the emerging "Physical AI" market. While TSMC remains the leader in AI processors for data centers, Samsung is focusing on the specific demands of vehicles and robotics.

Friday 9 January 2026

TSMC accelerates global expansion despite talent shortage

TSMC is rapidly expanding its global footprint, with facilities in Kumamoto, Japan; Arizona, the US; and Saxony, Germany. Facing a critical shortage of semiconductor equipment and management talent, the company is actively partnering with universities worldwide to cultivate skilled professionals.

Thursday 8 January 2026

India's OSATs are comfortable with materials today, but that may not last

India's backend semiconductor manufacturers are benefiting from a narrow window of materials comfort that is closely tied to the use of legacy packaging technologies.

Thursday 8 January 2026

Qualcomm reportedly in talks with Samsung on 2nm chip production

Qualcomm is reportedly in talks with Samsung Electronics about contract manufacturing of next-generation 2nm chips, discussions that could support Samsung's efforts to revive its loss-making foundry business.

Thursday 8 January 2026

Taiwan outlines strategy to bolster semiconductor and AI industries in 2026

The Taiwanese Executive Yuan's 2026 Science and Technology Advisory Meeting concluded with Taiwan's top technology firms represented by new leaders, including TSMC's Cliff Hou and MediaTek's Rick Tsai. President Ching-te Lai emphasized that 2026 marks a critical year to strengthen Taiwan's semiconductor capabilities and advance AI projects alongside the biotech, defense, and SME sectors.

Thursday 8 January 2026

CES 2026: Taiwan researchers showcase neuromorphic chip breakthroughs

To overcome AI's limits, a bridge must be built between computer science and biology, according to Kea-Tiong Tang, a professor from Taiwan's National Tsing Hua University (NTHU) and a leading scholar in neuromorphic computing. Tang recently led a Taiwan team to the US for CES in 2026, demonstrating efforts to break from the traditional von Neumann architecture.

Thursday 8 January 2026

Win Semiconductors sees 29.37% revenue boost in 4Q25, driven by US smartphone shipments

Win Semiconductors, the world's leading gallium arsenide (GaAs) wafer foundry, reported consolidated revenue of NT$1.61 billion (US$51.31 million) for December 2025, down slightly by 0.38% from the previous month but up 31.26% year over year. Consolidated revenue for the fourth quarter of 2025 reached NT$4.79 billion, marking a 6.83% sequential increase and a 29.37% rise compared to the same quarter last year. However, full-year 2025 consolidated revenue totaled NT$16.64 billion, reflecting a 4.69% decline compared with full-year 2024.

Thursday 8 January 2026

Why TSMC is giving mature fabs billion-dollar makeovers

TSMC is undertaking significant upgrades at its existing 8-inch and 12-inch fabrication facilities that process chips at 90nm and above, while accelerating expansion for cutting-edge 2nm and below technologies. Semiconductor equipment suppliers confirm major reconstruction projects are underway at TSMC's Hsinchu 6-inch (Fab 2) and 8-inch fabs (Fab 3, 5, 6, and 8), reflecting the company's response to robust market demand.

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