TSMC used its earnings call for the fourth quarter of 2025 to deliver one of its most bullish outlooks in years, arguing that artificial intelligence (AI) is reshaping the semiconductor industry's growth trajectory rather than inflating a short-lived bubble.
Taiwan's government is stepping up cross-ministerial support to build a domestic silicon photonics ecosystem, with a focus on strengthening local capabilities in co-packaged optics materials and supporting industrial deployment under its long-term chip innovation strategy.
The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass fiber cloth, an obscure but indispensable material in advanced semiconductor packaging.
As global governments accelerate investments in the semiconductor sector, Japan's Rapidus is moving forward with its goal of mass-producing 2nm AI chips. The company maintains that its primary concern is not a potential surplus of capacity, but rather structural constraints, specifically a significant shortage of skilled professionals.
GlobalFoundries said on January 13 that it has agreed to acquire the ARC Processor IP Solutions business from Synopsys, a move that modestly broadens the foundry's exposure to processor IP and so-called "physical AI" workloads.
Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes continue to shrink and packaging architectures become more complex.
Ping Ho Environmental Technology said it will move beyond its core wastewater treatment business and invest in recycling waste sulfuric acid from the semiconductor industry into raw materials for green building products. Operations are scheduled to begin in 2026. The company will also continue to cautiously evaluate new development or partnership opportunities in recycling and reuse to expand its circular economy business.
