Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing (HPC) chip demand drives the need for high-layer-count, large-size IC substrates. The company's board has approved an additional NT$50.9 billion (US$1.57 billion) in long-lead equipment orders and plans to sell its Japanese subsidiary to PCB maker Meiko Electronics.

Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion for BT substrates used in memory packaging remains limited. With BT substrate supply tightening and demand for low-power SOCAMM memory modules rising, South Korea's Simmtech could benefit from its business in both memory package substrates and module PCBs.

South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands SOCAMM2 production and builds capacity to retain its position in the high-end memory module substrate market.

South Korean semiconductor equipment component maker MiCo Ceramics is set to acquire an idle facility in Gumi, North Gyeongsang Province, from LG Display (LGD) for KRW150 billion (approx. US$113.2 million). The acquisition of the land and buildings will allow MiCo Ceramics to expand production capacity for key products, including ceramic heaters and electrostatic chucks (ESCs). The deal highlights a broader trend across the tech sector, as real estate assets shed during display industry downsizing are repurposed for the semiconductor supply chain.

US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake in the company through a private placement. The two companies aim to accelerate technology development and expand manufacturing capacity for expanded beam optics (EBO).

As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector. Amid a historic supply crisis for helium, an indispensable element in the production of semiconductors and advanced electronics, as well as in medical imaging, the US Department of Energy has officially designated helium as a critical material under the Energy Act of 2020.

South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications, a market where Taiwanese suppliers are already moving toward commercial production.

As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film and heat-resistant tape remain in development.

In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association, AI server motherboards have become the largest, thickest, and most structurally complex PCBs ever manufactured, drawing substrate and PCB makers, which historically reacted to decisions made by chipmakers and packaging clients, into the heart of AI hardware development.

Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.

Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities in South Korea. The move reflects growing efforts by global technology companies to secure stable supplies of high-performance semiconductor substrates for AI applications.

Apple's iPhone Duo has gone on sale, with pre-orders in several key markets reportedly exceeding the company's expectations. Delivery dates have stretched to late 2026 and even early 2027. The strong initial response could partly offset weaker-than-expected sales momentum for the iPhone 18 Pro series, pointing to growing consumer interest in foldable smartphones.

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench capacitor (DTC) technology and wafer manufacturing capabilities with AP Memory's silicon capacitor design and system integration expertise. The collaboration comes as rising power consumption in AI and high-performance computing (HPC) chips accelerates the shift towards near-chip power delivery and advanced packaging integration.

The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.

PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry faces obstacles in securing affordable renewable power, validating low-carbon materials, and measuring emissions across its supply chain. Industry output is expected to exceed NT$1.13 trillion (US$34.63 billion) in 2026, putting pressure on the industry to balance growth with its sustainability goals.

The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron, STATS ChipPAC, Wistron, and market research firm TechSearch. Covering crucial supply chain segments—including PCBs, IC substrates, OSATs, and EMS providers—the forum addressed pressing technical bottlenecks in AI-driven high-performance computing (HPC).

Taiwanese passive-component maker Holy Stone has entered the supply chain of a major South Korean automaker after about two years of market expansion, prompting the company to raise its 2027 South Korea revenue-growth target to more than 50%. The company is targeting automotive, safety-certified, and high-end multilayer ceramic capacitors (MLCCs) while expanding Taiwan production to meet AI-driven demand and pursuing semiconductor and timing-component opportunities.

Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The fundraising follows the automaker's recent opening of its in-house technologies to external customers, mirroring similar moves by other Chinese EV companies.

Japan's Murata Manufacturing has developed the world's smallest NTC thermistor, the 008004 NCU01 series, measuring 0.25mm × 0.125mm. Compared with Murata's previous smallest 01005-inch thermistor, measuring 0.4mm × 0.2mm, the new product cuts mounting area by about 60% while maintaining equivalent temperature-sensing performance, with both resistance and B-constant tolerances at ±1%.

Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering an open-ended shortage of upstream materials and equipment. Key suppliers of copper-clad laminates (CCL), copper foil and drill bits are launching capacity expansion plans covering the next 3-4 years.

The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to seize opportunities created by the AI boom. Taiwan's PCB industry is expected to generate more than NT$1 trillion in output for the first time in 2026 as AI infrastructure drives demand across the technology supply chain.

DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through higher layer counts and lower-loss materials. In this transition, via structures have become critical bottlenecks affecting signal integrity. When high-frequency signals route between layers in a multilayer board, residual barrel copper can impair transmission, generating robust demand for high-precision backdrilling equipment.

PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in AI servers, high-speed optical communications, and AI terminal devices. The company is presenting comprehensive PCB solutions spanning AI infrastructure and smart terminals.

Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA Show 2026, the company presented tools and processing technologies for advanced materials, including ABF substrates, quartz cloth, and PTFE, while outlining its capacity expansion in Taiwan and China.