As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates.
ZJeagles Comsemi Technology (ZJeagles) has closed its Series B+ funding round, securing over CNY700 million (approx. US$98 million) — a new record for China's Vertical Cavity Surface Emitting Laser (VCSEL) industry.
The TPCA Show 2025 — the printed circuit board industry's premier annual event — officially opened on October 22 in Taipei, with Taiwan-based Topoint Technology, a leading provider of PCB drill bits and drilling services, unveiling its latest generation of coated drill bits, milling tools, and advanced drilling technologies.
