Inpaq, part of the PSA Group, said it will eliminate the chief executive officer (CEO) position effective immediately as it adjusts its organizational structure and management responsibilities. In a related personnel change, Joyin chair Jui-Tsung Chang will serve as general manager, while former CEO and president Eunice Chen will remain a company director.

South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate after years of limited business following a patent dispute. The contract comes a week after Samsung Electro-Mechanics announced a KRW6.78 trillion expansion of its AI server substrate business, as demand for advanced chip packaging continues to grow.

Viking Tech said demand from AI, data centers, server power, military, and aerospace applications has kept capacity fully loaded as it enters the fourth quarter of 2026, with its book-to-bill ratio still at 1.5, though down slightly from the April peak of 1.7. The thin-film resistor maker said average lead time for both precision thin-film and standard thick-film resistors has now extended to 25 weeks, or nearly half a year, while some orders are already scheduled into the second half of 2027. The company said shortages are concentrated in 1206 and 0603 sizes.

Episil Technologies Chairman Rex Hsu said overall demand has gradually recovered following an industry downturn, with silicon carbide (SiC) capacity utilization rebounding sharply from approximately 30% in the first half of 2026 to around 90% currently. Meanwhile, production capacity for gallium nitride (GaN) and silicon-based transient voltage suppressor (TVS) diodes has reached full utilization.

South Korea's Doosan is directing more than half of its record KRW968.4 billion (approx. US$724 million) copper-clad laminate (CCL) investment to China, positioning itself closer to major printed circuit board (PCB) manufacturers as tight supplies and rising prices strengthen the business case for expanding high-end materials production.

Chang Wah Technology said record September and third-quarter revenue reflected recovering customer restocking, expanding applications, and rising demand in AI and satellite markets. The lead frame maker's growth points to tighter global supply capacity, broader industrial adoption, and stronger shipments to customers across electronics and advanced technology sectors.

Taiwanese OSAT provider Sigurd Microelectronics and its subsidiary Winstek Semiconductor held a joint investor briefing on October 6. President Charles Yeh reported that surging demand across AI CPUs, GPUs, ASICs, silicon photonics, and memory is severely tightening testing capacity, prompting long-term contracts, price adjustments, and a potential upward revision to 2026 capex.

Taiwan-Asia Semiconductor Corporation (TASC) expects a stronger second half of 2026 as new Apple Watch demand lifts sensor orders. The company said weak consumer electronics demand has not materially affected its business, with smartwatch and earphone orders arriving faster than expected. More sensors per device and seasonal demand should lift fourth-quarter performance above the third, making the second half clearly stronger than the first.

As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become major research priorities across academia and industry.

TSMC will hold its third-quarter earnings call on October 15 this year.

The traditional market divide between the third-generation semiconductors gallium nitride (GaN) and silicon carbide (SiC) is seeing greater overlap in 2026, with SiC increasingly encroaching on GaN's territory.

Memory module maker Kingston Technology announced that, according to TrendForce's revenue rankings, it held a 62% share of the global third-party dynamic random-access memory (DRAM) module market in 2025, retaining the top spot for the 23rd consecutive year. The company noted that enterprise, data center, and industrial clients are showing an increasing need for stable supply, product reliability, and long-term technical support, making B2B operations a primary growth engine.

Samsung Electro-Mechanics (Semco) has secured another major AI server order, signing a KRW290 billion (about US$216 million) contract to supply multilayer ceramic capacitors (MLCCs) to an undisclosed global customer throughout 2027. The deal is its sixth disclosed long-term supply agreement this year.

South Korean materials company Chemtronics has delivered glass interposer samples to Samsung Electronics, with customer evaluation now underway, according to Korean business outlet DealSite. This step moves the technology from supplier-side development into physical testing by one of the world's largest chipmakers.

China's Ministry of Industry and Information Technology and the National Development and Reform Commission have released the 15th Five-Year Plan for the development of the electronic information manufacturing industry, aiming to push revenue at large-scale enterprises above CNY30 trillion (US$4.5 trillion) by 2030 and foster world-class companies in semiconductors, advanced computing, consumer electronics, basic electronics, and energy electronics.

Samsung Electro-Mechanics is investing KRW6.78 trillion (approx. US$5 billion) to expand FCBGA capacity in South Korea and Vietnam. The projects are backed by customer funding and medium- to long-term volume commitments, as demand for high-performance package substrates pushes Korean production lines toward high utilization.

Nittobo is expanding production of its T-Glass glass cloth as demand from AI chip makers tightens a critical part of the global semiconductor supply chain. The move matters beyond Japan because shortages of this insulating material could slow advanced chip production, raise costs, and affect technology markets worldwide.

Skyworks Solutions (Nasdaq: SWKS) has completed its combination with Qorvo, creating a US-based supplier of high-performance radio frequency (RF), power management, and analog and mixed-signal semiconductors. The company expects annual cost synergies of US$500 million or more, and says the deal will add to non-GAAP earnings per share right away.

As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers from 800G to 1.6T and accelerating the transition toward future 3.2T products, a shift reshaping printed circuit board (PCB) manufacturing from substrate materials to processing technologies.

Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid growth due to its potential to replace copper interconnects amid AI infrastructure demand surges.

South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce its reliance on display driver integrated circuits (DDIs) and a highly concentrated customer base, backed by new business from Qualcomm and Renesas and KRW30 billion (approx. US$22.3 million) in planned equipment investment.

China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1 million square meters a year. Analysts say Chinese makers have moved ahead of South Korean rivals by building production lines first, then accelerating product output and customer validation, giving China an early lead in glass substrate commercialization.

Severe floods triggered by days of extreme rain in Thailand have paralyzed transport in Bangkok and several other areas, disrupting local auto and components supply chains and drawing attention to damage at Taiwanese companies with factories in the country. The flooding has also slowed shipments from Taiwan PCB makers in Thailand as road and airport transport remain affected.

Chunghwa Precision Test Tech (CHPT), a supplier of semiconductor test interfaces, posted record revenue for September and the third quarter of 2026 as demand for AI-related chip testing kept capacity utilization high. Revenue for the first nine months of the year also reached a record.