LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea.

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will raise prices on resistors and selected capacitor products beginning June 1, citing mounting cost pressures and robust demand from AI-related applications. The move makes Walsin one of the first Taiwanese MLCC suppliers to formally implement a new round of price increases, and a sign that the inflationary effects of the artificial intelligence (AI) boom are spreading deeper into the electronics supply chain.

xMEMS Labs is preparing to move its MEMS-based µCooling technology toward commercial production in 2027, with AI glasses and data-center SSDs expected to be among the first applications as sustained AI workloads push thermal constraints beyond GPUs.

Foxconn is expanding its footprint in France through two projects spanning artificial intelligence infrastructure and semiconductor packaging, as the Taiwanese electronics manufacturer deepens its role in Europe's efforts to build advanced computing and chip capabilities.