The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring demand for high-end multilayer ceramic capacitors (MLCCs) is prompting suppliers to reallocate production capacity and driving a new round of price increases that extend beyond AI-specific products.
Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate etchants to include copper plating chemicals and chemical mechanical polishing (CMP) slurries, as the companies race to secure key materials for next-generation AI chip packaging.
Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics makers worldwide. The moves, led by major passive component manufacturers, suggest AI-related demand is reshaping a market previously softened by weaker consumer and automotive orders.
Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027, with plans to adopt the technology in its own AI chips. Industry sources said that if the strategy proceeds successfully, leadership in global semiconductor glass-substrate technology could gradually shift towards China.
Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed by AUO and Radiant Opto-Electronics (ROEC) on July 30 and BenQ Materials (BMC) on July 31.
Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.
Rising raw material costs and tightening supply of high-end components for AI applications have triggered an unusual round of price increases across the aluminium capacitor industry, with major suppliers in Japan, China and Taiwan moving to protect margins.
China's printed circuit board (PCB) industry is entering a new investment cycle, with more than CNY70 billion (approx. US$10.3 billion) committed in 2026 as AI servers, high-speed optical modules and edge devices lift demand for advanced boards.
Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.
China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.
With SpaceX's first public earnings report approaching, investors are looking for fresh insight into the company's operations and future satellite deployment plans, viewing the results as an important barometer for the global satellite communications market.
IQE has raised its 2026 revenue outlook as demand for artificial intelligence (AI) infrastructure and data centers continues to strengthen, showing that AI-related growth is spreading beyond GPUs and servers into high-speed optical communications and photonics supply chains.
The rapid growth of AI data traffic is pushing quartz timing components toward three key technical upgrades: lower phase noise, reduced jitter and greater frequency accuracy. At the same time, SpaceX's continuing satellite deployment plans are creating fresh demand for frequency-control components such as filters, particularly benefiting suppliers capable of rapidly producing customized solutions.
HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and testing project, joining BOE and other Chinese display makers in expanding upstream into semiconductors.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics industry. Thailand, Vietnam, and Malaysia are moving beyond traditional consumer device assembly and building a deeper regional ecosystem for printed circuit boards, advanced substrates, and semiconductor-related manufacturing.
