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Friday 3 April 2026
PSMC emerges as key link in Europe's push to bring AI chip research to market

Europe is stepping up semiconductor ties with Taiwan as it seeks to turn research strength into commercial production, with foundries such as Powerchip Semiconductor Manufacturing Corp. (PSMC) playing a growing role in bridging that gap as the artificial intelligence race intensifies.

Friday 3 April 2026
PSMC, CEA-Leti strike multi-year deal to ease AI data, power bottlenecks

Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) and France's CEA-Leti have signed a multi-year agreement on April 3 aimed at easing one of artificial intelligence's most pressing constraints: rising power consumption and data-transfer bottlenecks inside data centers, executives said in an interview with DIGITIMES Asia.

Friday 3 April 2026
2026 USTR Report: landmark 'ART' pact reshapes US-Taiwan trade landscape
The Office of the United States Trade Representative (USTR) has designated Taiwan as a highly cooperative and pivotal trading partner in its 2026 National Trade Estimate (NTE) Report.
Friday 3 April 2026
US faces split Asia: allies build 'sovereignty walls' as digital tensions rise

The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US and its closest Asian allies.

Friday 3 April 2026
Taiwan pushes ahead with AI and tech agenda even as budget deadlock threatens fiscal paralysis
Taiwan sits at a rare intersection of economic momentum and political gridlock. The island's economy expanded 8.68% in 2025, exports hit a record US$640.75 billion, and per capita GDP is closing in on the US$40,000 threshold — largely on the back of booming global demand for AI chips and semiconductor capacity. Yet while Taiwan's technology industry is firing on all cylinders, its legislature remains deadlocked over the government's spending plan.
Friday 3 April 2026
Taiwan tackles CPO testing bottlenecks to scale SiPh for AI data centers
The surge in AI computing power is driving explosive demand for high-speed optical interconnects in data centers. Forecasts show that by 2026, over 50% of data center transceiver sales will come from silicon photonics (SiPh) modules, a sharp rise from 33% in 2024.
Friday 3 April 2026
Memory stocks rattled by TurboQuant, but demand outlook holds
Google Research's TurboQuant memory-compression algorithm has raised concerns that demand for AI-related memory could weaken, but South Korean experts and analysts say the market reaction may be overblown.
Thursday 2 April 2026
Copper price surge drives quarterly lead frame price hikes
Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply, significantly raising raw material costs. At the same time, the inventory reduction cycle within the mature process semiconductor market is nearing completion, prompting customers to ramp up orders.
Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET News.
Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities.
Thursday 2 April 2026
Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning from construction to operational setup for 2nm production. More than 3,000 engineers from Samsung and global equipment suppliers have begun gathering at the site, according to ET News, signaling the start of large-scale ramp-up activities.

Thursday 2 April 2026
Topco maintains stable shipments despite Middle East conflict, builds safety stock as AI demand accelerates
As the US-Iran conflict enters its second month, concerns are mounting over potential disruptions to global energy supplies and petrochemical feedstocks. Against this backdrop, Jeffery C.L. Pan, chairman of Taiwan's Topco Scientific, stated that the company's operations remain stable, with shipments unaffected to date and upstream cost pressures largely contained.
Thursday 2 April 2026
Ajinomoto faces stakeholder pressure to raise ABF prices
UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor interlayer insulating material. This material is marketed under the name Ajinomoto Build-up Film (ABF).
Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips.
Thursday 2 April 2026
Mobile chip inventory correction weighs on OSAT supply chain
As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this demand correction has cascaded from IC design down to foundry, packaging, and testing — expected to significantly dampen order growth for Taiwanese OSAT players such as ASE, SPIL, and KYEC heading into the consumer peak season.
Thursday 2 April 2026
Samsung upgrades Austin fab, signals dual-track US chip strategy
Samsung Electronics is accelerating the introduction of next-generation manufacturing equipment at its semiconductor facility in Austin, Texas, as part of a broad upgrade program aimed at positioning the site for long-term operations. The move is seen as a key step to reinforce the competitiveness of its existing US production lines as part of its North America semiconductor strategy.
Thursday 2 April 2026
South Korea's market volatility hands Taiwan a rare edge in AI
During a lecture hosted by the Chinese National Association of Industry and Commerce (CNAIC), DIGITIMES Chairman Colley Hwang analyzed the East Asian industrial landscape. While headlines often focus on the chip wars between the US and China, Hwang shed light on a quieter, more structural divergence: the widening "resilience gap" between Taiwan and South Korea, as manifested through the lens of currency.
Thursday 2 April 2026
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies covering cleanroom, plant engineering, electromechanical integration, and equipment sectors have seen surging visa applications and staffing demands. This surge has kept intermediaries and legal service providers busy both in Taiwan's Hsinchu Science Park and Arizona, highlighting peak mobilization within the supply chain.
Thursday 2 April 2026
Intel buyback signals shift beyond austerity as chipmaker regains confidence
Intel's US$14.2 billion buyback of its Ireland fab stake signals a shift beyond austerity, reflecting improved finances, renewed confidence in AI-driven CPU demand, and a strategic move to regain full control of key manufacturing capacity amid persistent global semiconductor supply constraints.
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior suggests a far more significant structural shift is underway.

Thursday 2 April 2026
TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects in AI data centers pushes optical technologies closer to commercial deployment.

Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process technologies.
Wednesday 1 April 2026
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that with the panel industry undergoing a full transformation, half of the exhibitors this year are non-display manufacturers. The event focuses heavily on new business opportunities in silicon photonics (SiPh) and advanced packaging amid the arrival of the "light over copper" era.
Wednesday 1 April 2026
Nexchip applies for HK listing amid mature-node expansion
Chinese semiconductor foundry Nexchip has applied to list on the Hong Kong Stock Exchange's Main Board, Guandian.cn reported on March 31, as the company moves to consolidate its position in the mature-node foundry market.
Wednesday 1 April 2026
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment firm Sizone through a combination of share issuance and cash. This move could mark AMEC's entry into the wet process segment, an area where it previously had limited presence.