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Thursday 18 June 2026
Japan lasers in on India's Assam state for chip and infrastructure corridor

Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.

Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elec and Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.

Thursday 18 June 2026
Taiwan chip makers signal durable upcycle as memory prices and AI demand align

Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMES believes that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP development more favorable.
Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of Chinese technology and semiconductor companies are adopting a dual-location strategy, establishing corporate entities in Singapore while locating manufacturing operations in Malaysia in an effort to reduce their association with the "Made in China" label.

Thursday 18 June 2026
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.

Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Korea and iNews24.

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.

Thursday 18 June 2026
Samsung said to open fab data to suppliers in AI factory push

Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.

Thursday 18 June 2026
Taiwan 2026 GDP could top 10%, says Minister of Economic Affairs
Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may be achieved given current trends. He pointed to stronger-than-expected exports from the AI supply chain and traditional industries such as machinery.
Thursday 18 June 2026
SK Group tops KRW2,000 trillion as AI memory demand and Nvidia visit lift valuation

SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, ET News and Yonhap, the group's 19 listed subsidiaries reached a combined market value of KRW2,019.6 trillion, a 2.5% increase from the previous trading day.

Thursday 18 June 2026
WUS and its subsidiary keep complementary AI partnership
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.
Thursday 18 June 2026
Interview: MicroLED and SiPh eye 3.2T AI data race
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the competition between photons and electrons. Micro LED's high bandwidth and heat resistance position it as a key technology for the 3.2T-plus optical communications era.
Wednesday 17 June 2026
Chip supply chains shift: TSMC's capacity crunch reportedly pushes Google, Tesla, BYD toward Samsung

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asia reported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.

Wednesday 17 June 2026
Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.

Wednesday 17 June 2026
InnoScience wins GaN patent battle against Infineon in China
InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two sides' GaN patent fight has stretched from the US and Germany to China, and the ruling makes it even harder for Infineon within China's increasingly cutthroat market.
Wednesday 17 June 2026
Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its latest move to deepen its presence across the semiconductor value chain.

Wednesday 17 June 2026
PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data center deployments on another. However, during PCIM Europe 2026 in Nuremberg, Germany, industry leaders and experts discussed and dismantled this flawed strategy.
Wednesday 17 June 2026
Foxconn teams with power giants to seize AI data center demand

Driven by Nvidia and other tech giants, global AI data center buildouts are undergoing an unprecedented structural shift. The pressure is not only coming from explosive compute demand, but also from upgrades in power, cooling, and supply-chain resilience.

Wednesday 17 June 2026
Poland turns to Taiwan to build up chips as Foxconn seals EV assembly deal

Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains and technology capacity. The plan spans electric vehicles, semiconductors, and industrial policy, and reflects how governments are adapting to geopolitical pressure and shortages in key global sectors.

Wednesday 17 June 2026
EssilorLuxottica, Applied Materials team up on smart eyewear technology
EssilorLuxottica and Applied Materials have agreed to a long-term partnership to speed development of intelligent optical systems for augmented reality and AI-powered smart eyewear, a move that could help shape future consumer devices used by people around the world. The companies said the effort aims to make advanced display glasses lighter, more capable, and easier to manufacture at scale.
Wednesday 17 June 2026
PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research for use in wafer production, in a transaction totaling NT$1.04 billion (approx. US$32.94 million). The move comes as the company steps up investment in equipment and new technologies to seize artificial intelligence (AI) opportunities.
Wednesday 17 June 2026
Amkor alone cheers 10-year TSMC advanced packaging deal in Arizona
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.