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Monday 5 January 2026
Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by early 2028. Production could begin in the second half of 2028, supporting the company's medium- to long-term capacity expansion in the semiconductor sector.
Monday 5 January 2026
TSMC kicks off 2nm production with Samsung in hot pursuit
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as the two chipmakers vie for leadership at the industry's most advanced manufacturing node. The move is closely watched across the semiconductor sector because 2nm technology is expected to underpin the next generation of AI, mobile, and high-performance computing chips, shaping pricing power, customer relationships, and supply-chain diversification.
Monday 5 January 2026
Lee Jae-myung's first China visit signals warming South Korea-China ties
According to Bloomberg and The Korea Economic Daily, South Korean President Lee Jae-myung made a four-day trip from January 4-7, 2026, to Beijing and Shanghai, including a meeting with Chinese President Xi Jinping. The heads of the four major South Korean conglomerates (Samsung, SK Group, Hyundai, and LG Group) also traveled with Lee as part of an economic delegation.
Monday 5 January 2026
Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production on its advanced packaging line in April 2026.
Monday 5 January 2026
TSMC's US fabs expose structural cost gap with Taiwan

The economics of advanced semiconductor manufacturing in the US differ sharply from those in Taiwan, and TSMC's experience in Arizona is underscoring how difficult that gap is to bridge. Analysts say higher depreciation per wafer and elevated labor costs are placing sustained pressure on margins at the company's US fabs, even as production ramps up.

Monday 5 January 2026
Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing CNY35.5 billion (approx. US$5.07 billion) to expand 12-inch wafer capacity and deepen its position in mature-node manufacturing.

Monday 5 January 2026
Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
Monday 5 January 2026
ITC launches formal investigation into Samsung and Google over Netlist patent dispute
The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro, after the US company Netlist filed a complaint claiming DRAM products imported by Samsung and Google violate Section 337 of the US Tariff Act. However, Netlist has faced criticism for its history of prolonged litigation battles with Samsung.
Monday 5 January 2026
Taiwan fortifies silicon shield with 2026 push to set global chip agenda
As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again highlighted the island's geopolitical tensions. US President Donald Trump has stated that China doesn't want to invade Taiwan.
Monday 5 January 2026
DIGITIMES chair warns against head-on competition with China's strength
As global tech companies navigate increasingly complex geopolitical tensions and shifting supply chains, strategic positioning against Chinese competitors has become a critical question. With Beijing ramping up support for domestic industries and the US tightening export controls, technology leaders are reassessing their competitive strategies.
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT) giants ASE and Amkor, rather than allowing customer orders to flow to its largest competitor, Samsung Electronics. The company is instead prioritizing subcontract capacity to relatively neutral OSAT players and plans to further incorporate them into TSMC's ecosystem.
Monday 5 January 2026
Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign ownership, according to a White House executive order and a statement from the US Treasury Department.
Monday 5 January 2026
India roundup: OSAT players claim legacy packaging price parity

Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor is scheduled to announce products at CES.

Monday 5 January 2026
Taiwan power chipmakers bank on AI data centers and auto orders for 2026 growth
Taiwan's power semiconductor suppliers are positioning for steady growth through 2026. The momentum comes from two fronts: artificial intelligence data centers adopting new power architectures and automotive customers adjusting sourcing after supply disruptions linked to Nexperia.
Saturday 3 January 2026
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's strategy of attracting investments to enable next-generation technologies and position Singapore higher up the semiconductor value chain.
Saturday 3 January 2026
Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is largely locked in. Advanced packaging now contributes a growing share of sales. The company is on track to see annual revenue exceed US$250 billion around 2029 or 2030. That widening gap has pushed Japanese companies to focus on panel-level packaging and nanoimprint technologies. Both emerged at SEMICON Japan 2025 as key levers to bypass manufacturing bottlenecks and secure a foothold in the fast-expanding AI accelerator supply chain.
Saturday 3 January 2026
Chang Wah accelerates Asia expansion as chip packaging booms
Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity in Asia, positioning the group's combined distribution and manufacturing model to strengthen its role in the semiconductor back-end supply chain.
Saturday 3 January 2026
Analysis: Chip boom squeezes device makers as surging component costs threaten margins
The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade Statistics (WSTS) forecast, released in December 2024, expects growth to be driven predominantly by logic chips, including GPUs and AI accelerators. Memory markets are poised for the steepest increase.
Friday 2 January 2026
Asus to pause new smartphone launches in 2026, maintain mobile operations
Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that Asus's smartphone unit would operate only through December 31, 2025, after which the company would stop launching new smartphone products.
Friday 2 January 2026
IC substrates and networking PCBs grow; materials and equipment face shortages
The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron and Kinsus, which have gradually emerged from the oversupply bottleneck caused by large-scale post-pandemic capacity expansion. The surge in orders has spread to multiple networking and server PCB manufacturers, including Gold Circuit Electronics (CGE), Allied Circuit Co. (ACCL), and First Hi-tec, driving double-digit year-over-year growth in Taiwan's PCB manufacturing output value in 2025.
Friday 2 January 2026
Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO
Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January 1, 2025, Baidu said Kunlunxin confidentially filed a listing application with the Hong Kong Stock Exchange, formally setting the stage for a potential initial public offering, though key details such as the offering size, structure, and timing remain undecided.
Friday 2 January 2026
Vietnam urges Intel to boost semiconductor backend capacity
The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global chip supply chain.
Friday 2 January 2026
US approval of TSMC equipment exports to China reflects strategy shift
Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved TSMC to export chip manufacturing equipment containing US technology to its wafer fabs in Nanjing and other locations in China over the next year. The approval ensures existing production lines can continue operating normally and meet product delivery schedules.
Friday 2 January 2026
Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving the long-planned project into its execution phase.
Friday 2 January 2026
SanDisk, Micron vie for PSMC's Tongluo fab capacity
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo, Taiwan. PSMC's fate for the facility is expected to be finalized soon as participants weigh their options.