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Monday 17 August 2026
China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing base in Changzhou, expanding beyond VCSELs into high-end indium phosphide, or InP, laser chips for AI optical interconnects.
Monday 17 August 2026
TSMC and Micron boom drives Taiwan 'fab five's 1H26 profits

TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for Taiwan's fab engineering players — including UIS, MIC, L&K Engineering, YKE and Acter. Together, these five companies, which design and build the specialized facilities and infrastructure that chipmakers rely on, make up what the industry calls the "fab five." With expanding reach into the US, ASEAN and Singapore, the "fab five" have maintained high order backlogs.

Monday 17 August 2026
Fallout from Wingtech's Nexperia rupture: the price of rebuilding China's chip supply chain

Wingtech is entering a sharply different phase after dismantling much of its product-integration business and losing effective control over parts of Nexperia's overseas operations. The Chinese technology group posted a steep first-half revenue contraction and swung to a loss, while legal disputes in the Netherlands and Singapore now complicate its effort to rebuild around semiconductors and a more China-centered supply chain.

Monday 17 August 2026
Tata succession clouds outlook for chips, clean energy, data centers

Tata's leadership transition may shape the pace of one of India's biggest industrial bets. The group's planned spending on chips, clean energy, and AI data centers is entering a critical stage, but a shift toward tighter capital discipline could slow expansion and alter priorities worldwide.

Monday 17 August 2026
WaveSplitter returns to profit as AI optics demand lifts 1H revenue

WaveSplitter posted NT$477 million (US$14.95 million) in consolidated revenue in the first half of 2026, up 47% from a year earlier, and returned to profit as demand from AI data centers and the broader market lifted shipments of high-speed optical communications products. Net profit attributable to the parent company reached NT$6.16 million, compared with a loss in the same period of 2025, while earnings per share came to NT$0.19.

Monday 17 August 2026
Hermes Testing's 1H26 profit more than triples on rising AI testing demand
Hermes Testing Solutions (HTSI), a semiconductor testing solutions provider, stated that continued growth in demand for artificial intelligence (AI) and high-performance computing (HPC), coupled with capacity expansion by major global foundries and packaging and testing companies, has driven demand growth across its three main businesses: probe cards and cleaning materials, testing equipment engineering services, and semiconductor equipment and customized products.
Monday 17 August 2026
Kaynes Semicon eyes photonics, quantum security and neuromorphic chips in India tech push
Kaynes Semicon is looking at silicon photonics (SiPh) and co-packaged optics (CPO), post-quantum security, and neuromorphic computing as potential areas for expansion as India prepares the next phase of its semiconductor support program, CEO Raghu Panicker said.
Monday 17 August 2026
Modi pledges more chip plants, mass AI training, and an export push in Independence Day address
Prime Minister Narendra Modi used India's 80th Independence Day address from the Red Fort on August 15 to tie semiconductor manufacturing, artificial intelligence training, and trade policy into a single self-reliance push, framing all three as building blocks toward a "Viksit Bharat," or developed India, by 2047.
Monday 17 August 2026
India roundup: India's electronics push gains momentum as water, China ties and chip incentives collide

India's electronics and AI infrastructure ambitions are accelerating, but mounting environmental opposition, tighter Chinese visa curbs, and intensifying competition for semiconductor investment are exposing new challenges. As Google advances a US$15 billion AI data center, Larsen & Toubro (L&T) restructures its cloud business, and Dixon Technologies expands its smartphone OEM business, states are sweetening incentives to strengthen India's position in global technology supply chains.

Monday 17 August 2026
Fu Chun Shin lifts second quarter margins on stronger electronics demand
Fu Chun Shin Machinery said rising investment in smart manufacturing and AI infrastructure lifted demand for high-precision, high-efficiency, and intelligent equipment across ICT, semiconductor, and electronics supply chains. The plastic injection molding machine maker reported higher gross margin and operating margin in the second quarter, with both measures improving year-on-year.
Monday 17 August 2026
Sigurd tops NT$2B in July revenue as AI testing demand surges
Sigurd Microelectronics, an IC testing and packaging company, reported record July 2026 revenue and said demand from AI and AI connectivity markets drove the result. The company said orders for high-performance computing chips, including CPUs, GPUs, ASICs, and AI accelerators, lifted testing demand for silicon photonics, high-speed networking, memory, silicon capacitors, baseboard management controller chips, and high-end power management ICs used in AI servers and data centers.
Sunday 16 August 2026
Nan Pao posts record second-quarter profit and July revenue as sales rise
Nan Pao Resins Chemical reported record second-quarter net profit attributable to the parent company of NT$877 million, with earnings per share of NT$7.27, as the Taiwan-based materials maker also said July revenue reached an all-time monthly high. The results reflected stronger sales of adhesives and building materials, along with customers placing orders early and building inventory ahead of anticipated price increases.
Sunday 16 August 2026
AI reshapes semiconductor testing as KYEC pushes four-way model

As AI chip value and integration complexity keep rising, King Yuan Electronics (KYEC) President Gauss Chang said semiconductor testing is shifting from being considered "part of the supply chain" to a "part of the process." He said the supply chain is also moving toward a new collaboration model built around four integrated elements: equipment, accessories, testing, and products.

Sunday 16 August 2026
AI product cycle lifts Chroma test demand
AI is sharply increasing demand for test and measurement equipment, turning it from a cost-cutting support tool into a must-have, said Chroma president I-Shih Tseng. He said he expects the industry boom to outlast a short-term investment wave and that second-half 2026 operations will outperform the first half of the year.
Friday 14 August 2026
SK hynix scouts US memory fab sites as customers seek local supply
SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production closer to home.
Friday 14 August 2026
South Korea chip cluster could expand to nine fabs as SK plans new investment
South Korea's planned southwestern semiconductor cluster could eventually expand from four fabs to as many as nine as the government accelerates land, power, and infrastructure work around Gwangju, while local officials say SK Group is expected to unveil a major investment in eastern Jeonnam.
Friday 14 August 2026
Insight: Intel raises US$20B, but its 14A ambitions may need twice as much

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting most from the current surge in server CPU demand and how much more capital Intel may need to reach the 1.4nm generation.

Friday 14 August 2026
MPI posts record 2Q26 revenue, profit as probe card capacity stays fully loaded

Taiwanese test interface provider MPI said that continued strong expansion demand from global artificial intelligence (AI) customers, along with its growing global market share in mid- to high-end test interfaces, drove both revenue and profit to record highs in the second quarter of 2026. The company added that probe card capacity remained fully utilized as demand outpaces supply.

Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company said it is now developing equipment for chip-in-package, glass substrates, and organic interposers, while also moving from panel lamination into wafer lamination, primarily targeting "Taiwan's largest semiconductor manufacturer."
Friday 14 August 2026
Nvidia Feynman pushes TSMC A16 and CPO ramp

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin enters mass production and ramps up. The move is set to drive upgrades at TSMC and could trigger another wave of orders across the global equipment and materials supply chain.

Friday 14 August 2026
Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.

Friday 14 August 2026
Lam Research to spend more than US$3 billion expanding global R&D labs
Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor manufacturing grows more complex.
Friday 14 August 2026
Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback has pushed back the construction timetable for GlaSSEM, its joint venture with Dongwoo Fine-Chem for glass core production in Pyeongtaek, South Korea, and has made equipment ordering dates difficult to pin down.
Friday 14 August 2026
Taiwan tech dividend expansion to accelerate non-tech industry upgrades
Taiwan is seeking to sign an agreement with the US to avoid double taxation, seen as the last major hurdle to unlocking Taiwanese investment in the US. Taiwan's technology dividend is believed to not only support overseas investment but also accelerate the transformation of its domestic non-tech industries.
Friday 14 August 2026
SMIC plans to single out AI chip revenue as demand outpaces its current reporting categories
Semiconductor Manufacturing International Corporation (SMIC) is considering disclosing revenue from artificial intelligence (AI)-related "peripheral chips" as a standalone line item, possibly from the third quarter of 2026 or later, executives said on the company's second-quarter earnings call.