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Friday 23 January 2026
South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme ultraviolet (EUV) photomask pellicle-related equipment for its Taylor fab with South Korean equipment supplier Fine Semitech Corp. (FST).
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile profitability, and cautious guidance suggest near-term pressure remains, keeping investor focus squarely on execution and the pace of recovery, which Intel attributed to tight supply, likely for memory, across the industry.
Friday 23 January 2026
Lip-Bu Tan faces Intel’s first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue to limit near-term revenue and profitability, keeping the company's turnaround highly dependent on execution through 2026.
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments on hold until customer demand is secured, a cautious approach that comes as memory shortages and early-node costs pressure near-term margins.
Thursday 22 January 2026
SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation
Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively reshaped the company's resource allocation. She revealed that standard SiC wafer prices have plunged 60-70% within six months due to market turbulence. In response, SAS is withdrawing from the commoditized power segment for GlobalWafers' SiC wafers and prioritizing three niche markets focused on high-barrier applications.
Thursday 22 January 2026
Nvidia overtakes Apple as TSMC's largest customer

Nvidia CEO Jensen Huang said rising demand for AI computing has pushed the company past Apple to become the largest customer of Taiwan Semiconductor Manufacturing Company (TSMC).

Thursday 22 January 2026
GlobalWafers' Texas plant holds six-phase expansion potential
GlobalWafers chairwoman Doris Hsu said in a January 21, 2026, media interview that with easing inflation pressures and some central bank policy adjustments, the global economy is experiencing moderate growth despite ongoing challenges from geopolitical tensions and trade uncertainties.
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking most-favored-nation (MFN) rates. This makes Taiwan the first country to secure tariff relief under Section 232. Both sides also plan to expand supply chain investment cooperation. Hsu called this a very positive outcome for Taiwan's overall industry and said it has eased market concerns.
Thursday 22 January 2026
GlobalWafers eyes quarterly revenue growth in 2026; chair sees better market than last year
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya, Japan, as well as Denmark, all hitting record revenues in 2025. Niche products like gallium nitride (GaN) stood out for their strong performance. Hsu also outlined GlobalWafers' 2026 strategy and shared her outlook on market conditions.
Thursday 22 January 2026
Chinese AI chipmakers face mixed reactions to Nvidia H200 block
The US has confirmed that under a new set of stringent regulations, Nvidia's H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand. However, the Chinese government has shown no intention of granting approval, causing supply chain plans that were originally preparing to ship to be put on hold. Currently, the main obstacle to entering the Chinese market is the mindset of the Chinese authorities. From the Chinese government's perspective, since domestic AI chips are already usable, there is no need to further allow China's AI development to rely more heavily on the US and Nvidia.
Thursday 22 January 2026
Taiwan advances second-phase quantum strategy, betting on hybrid computing and global partnerships
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates high-performance computing (HPC) with quantum computing (QC). Based in southern Taiwan, the system is intended to accelerate real-world applications through international cooperation, leveraging the country's strong semiconductor manufacturing expertise.
Thursday 22 January 2026
PSMC to upgrade DRAM processes as demand strengthens

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update on its latest operational plans.

Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

Thursday 22 January 2026
Taiwanese firms prepare for silicon photonics and CPO packaging opportunities as AI data center continues growth
As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent requirements of AI data centers. Nvidia has targeted 2026 as the initial commercial launch window for silicon photonics (SiPh) technology, signaling a strategic shift that will reverberate throughout global semiconductor supply chains. Taiwanese packaging and testing firms, among others, are positioning themselves to capitalize on the burgeoning market for ultra-high-bandwidth, energy-efficient AI infrastructure.
Thursday 22 January 2026
US-Taiwan tariff deal clears key uncertainty for chipmakers, says GlobalWafers chair
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agreement.
Thursday 22 January 2026
Nanya expects memory shortage through 1H27 amid surging demand
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust DRAM market into 2026. Customers are overbooking and seeking long-term agreements (LTAs), eyeing to secure sufficient supply.
Thursday 22 January 2026
Rising China-Japan tensions put semi materials in the spotlight

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts to build domestic production capacity—even as Japanese firms continue to dominate the global photoresist market.

Thursday 22 January 2026
Why Intel poached a Qualcomm GPU chief to bet on AI graphics

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.

Thursday 22 January 2026
Taiwan says investment decisions remain with firms, even with US push for local manufacturing
Taiwan's Executive Yuan Vice Premier Li-Chun Cheng and Minister without Portfolio and chief trade negotiator Jen-Ni Yang held a press conference on January 20, 2026, accompanied by Premier Jung-Tai Cho and Minister for Economic Affairs Ming-Hsin Kung, to discuss ongoing negotiations with the US over reciprocal tariffs and Section 232 measures.
Thursday 22 January 2026
Raana Semiconductors raises US$3 million seed round to develop indigenous silicon ingot growth systems
Raana Semiconductors Pvt. Ltd. (RSPL), an India-based company specializing in crystal growth systems and single-crystal materials, has raised US$3 million in a seed funding round, marking its first institutional capital raise. The pure equity round was led by Equirus Innovatex Fund and Artha Venture Fund, with participation from IvyCap Ventures, PointOne Capital, CIIE Initiatives (IIMA Ventures), and angel investor Garimella Laxminarayana. Valuation details were not disclosed, according to Inc42, Saure Energy, and BW Disrupt.
Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Thursday 22 January 2026
India-based Paras Defence enters semiconductor packaging with new subsidiary
Paras Defence and Space Technologies Ltd. announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking the company's expansion into the semiconductor packaging and assembly sector. The move aims to address gaps in India's domestic capability for advanced semiconductor packaging, particularly for defence and strategic electronics applications.
Wednesday 21 January 2026
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked through 2027. Deutsche Bank analysts suggest that the crunch may provide a strategic opening for Samsung Electronics to capture orders from major technology firms.

Wednesday 21 January 2026
Samsung reportedly exploring ASMPT for TCB supply
Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based equipment maker ASMPT in supply discussions.
Wednesday 21 January 2026
AI demand boosts Unimicron and Nan Ya PCB profits in December 2025
The IC substrate industry is accelerating its recovery into a new bull cycle, driven by steady growth in AI-related application demand. At the same time, price increases are gradually taking effect, benefiting companies like Unimicron and Nan Ya PCB, which reported doubled profits for December 2025.