3Peak, a leading Chinese analog chipmaker, plans to acquire Ningbo Aura Semiconductor through new share issuance and/or cash. The move advances 3Peak's push to become a global platform-based provider of analog and mixed-signal solutions.
Rapidus plans to begin construction on a second fabrication plant in Chitose, Hokkaido, in fiscal 2027 to produce 1.4nm and eventually 1nm chips, according to reports from Nikkei and Yomiuri Shimbun. The move underscores Japan's push to return to the front of advanced logic manufacturing, even as Rapidus works to complete its 2nm process and secure the funding required to sustain its roadmap. However, the company has since denied this reported timeline.
Taiwan's investigation into former TSMC senior vice-president Wei-Jen Lo intensified on November 26 as prosecutors carried out search and seizure operations in Taipei and Hsinchu, escalating one of the island's most sensitive technology-security cases in years.
