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Tuesday 3 February 2026
C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750 square feet) production site in Nantun, Taichung, Taiwan. The expansion is intended to support the development of next-generation process equipment for artificial intelligence (AI) advanced packaging without disrupting existing plant operations in Taichung.
Tuesday 3 February 2026
NXP signals modest recovery despite automotive shortfall as shares dip on high market expectations
NXP Semiconductors reported a sequential recovery across most end markets in its fourth-quarter results, yet its core automotive business grew more slowly than anticipated. This performance highlights an uneven semiconductor rebound, where strength in the mobile and industrial sectors must offset persistent instability in the vital automotive segment.
Tuesday 3 February 2026
OpenAI's inference push puts all eyes on Nvidia's AI chip strategy
OpenAI has been exploring alternatives to some of Nvidia's latest artificial intelligence chips, particularly for AI inference workloads. This exemplifies the intensifying competition in the inference segment of the AI chip market and has raised investor concerns about Nvidia's long-term dominance, even as both companies publicly stress the strength of their partnership.
Tuesday 3 February 2026
Nexperia plans Malaysia expansion in face of geopolitical risks and automotive supply concerns
Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor supply chain and affecting multiple global carmakers. To meet customer demand for a "non-China supply chain," the company is reportedly planning to expand its packaging and testing capacity in Malaysia. The move aims to reduce reliance on its current "European wafer, China packaging" model and prevent future shipment interruptions.
Tuesday 3 February 2026
Realtek, MediaTek, Airoha increase prices in response to OSAT and memory price hikes
Rising prices are no longer limited to upstream materials and PCBs; surging memory costs have further pushed up supply chain expenses, prompting synchronized responses across wafer foundries, OSAT providers, and IC design houses to reflect cost and supply-demand changes. Multiple Taiwanese and Chinese IC design companies have clearly initiated price increase mechanisms. Realtek passed on a 10% price increase for products with embedded memory as of January 1, 2026, and will raise prices again two months later, on March 1, by an average of more than 30%.
Tuesday 3 February 2026
Alchip, GUC, and Faraday eye 2026 growth on US CSP chip orders
Alchip, Global Unichip (GUC), and Faraday each hold unique strengths as leading ASIC design service providers. Benefiting from major US cloud service providers' (CSPs) push for in-house chip development, their long-term operations are highly anticipated. Among them, Alchip focuses on high-end AI and sub-5nm advanced processes for US customers; GUC primarily serves TSMC-related projects; while Faraday targets mature to advanced process nodes in artificial intelligence of things (AIoT) and industrial control sectors.
Tuesday 3 February 2026
Germany pivots to Korean chipmakers as Intel retreats

German state governments are stepping up efforts to secure new semiconductor partners in South Korea after Intel shelved plans to build fabs in Europe, leaving gaps in the region's advanced chip supply chain, according to Korean industry reporting by The Guru.

Tuesday 3 February 2026
South Korea eyes X-ray lithography in response to ASML's EUV grip

As global competition in semiconductor technology intensifies and protectionist trends tied to national strategy gain momentum, South Korea's industry is emphasizing the need to localize critical equipment. With chipmakers fully reliant on ASML of the Netherlands for extreme ultraviolet lithography tools, industry participants say South Korea must invest in X-ray lithography, a technology still at an early stage of development, to secure long-term competitiveness and reduce dependence on a single supplier.

Tuesday 3 February 2026
Intel's 14A mass production timeline faces skepticism with rising capacity and confidence challenges, says DIGITIMES analyst
Before Intel released its latest earnings report, market sentiment was unusually upbeat. In a DIGITIMES podcast program, DIGITIMES analyst Luke Lin noted that expectations were buoyed by anticipated US government investment, a phenomenon some investors dubbed the "Trump advisory" effect, which helped push Intel's share price to peak levels.
Monday 2 February 2026
SMIC reportedly sets up advanced packaging research institute in Shanghai
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with SMIC chairman Liu Xunfeng attending the unveiling ceremony, marking a new stage in the company's advanced packaging research and development efforts.
Monday 2 February 2026
Apple ramps up supplier price cuts to protect margins as costs rise
Apple reported strong results for its fiscal first quarter of 2026, but the company's supply chain did not share in the enthusiasm. The key reason is that Apple is feeling the impact of rising prices for critical components while striving to maintain a certain gross margin range. This means increased pricing pressure on suppliers.
Monday 2 February 2026
Chinese process control powerhouse Jingce targets nearly triple profit growth in 2025
Wuhan Jingce Electronic Group forecasts net profit of CNY80 million to CNY90 million (approx. US$11.5 million to US$13 million) for 2025, representing year-over-year growth of 181.97% to 192.21%. Net profit excluding non-recurring items is expected to reach CNY21.66 million to CNY31.66 million, up 113.66% to 119.97%, reversing losses from the previous year.
Monday 2 February 2026
ASE ramps advanced packaging in Taiwan as SPIL scales central hub
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern, central, and southern Taiwan, as well as in China and Malaysia. The company estimates that capital expenditure could reach US$6 billion in 2026, reflecting continued investment in equipment and facilities.
Monday 2 February 2026
Msscorps eyes annual growth with silicon photonics expansion
Msscorps held its year-end gathering on February 1, 2026, during which chairman Chi-Lun Liu highlighted the company's two decades of deep expertise in semiconductor testing and analysis. Having established a global footprint across 12 facilities in Taiwan, China, the US, and Japan's key semiconductor hubs, Msscorps has seen monthly revenues hit record highs since the second half of 2025, signaling the start of a new growth phase.
Monday 2 February 2026
China breaks into the global top 20 with a trio of chipmaking equipment suppliers
China's drive to localize its semiconductor supply chain is reshaping the global chipmaking equipment industry, with three domestic suppliers now ranking among the world's top 20 for the first time — a shift fueled by heavy investment and tighter US export controls.
Monday 2 February 2026
TSMC revises five-year growth plan, turning tech lead into high profits
TSMC chairman C.C. Wei recently confirmed that AI demand is real and the trend will remain unchanged in the coming years. AI accelerators accounted for a "high double-digit" percentage of TSMC's total revenue in 2025.
Monday 2 February 2026
Weekly news roundup: Diversification, memory power, capacity politics
Below are the most-read DIGITIMES stories from the week of January 16 – February 1, 2026.
Monday 2 February 2026
India's 2026–27 Union Budget boosts semiconductors, data centers and rare earths to strengthen supply chains
India's finance ministry on February 1, 2026, unveiled the Union Budget for 2026–27, placing electronics and technology manufacturing at the heart of its growth strategy, with fresh funding for semiconductors, electronics components, and AI-linked infrastructure aimed at strengthening supply chains and boosting India's global manufacturing competitiveness.
Monday 2 February 2026
Nvidia CEO projects TSMC capacity to double, warns of memory shortage, reaffirms OpenAI investment during Taiwan visit
Nvidia chief executive Jensen Huang, on February 1, 2026, underscored Taiwan's central role in the global artificial intelligence supply chain, saying the company "would not be possible without Taiwan," while warning that soaring AI demand is placing unprecedented pressure on semiconductor, memory, and manufacturing capacity worldwide.
Sunday 1 February 2026
The AI "A-List": NVIDIA CEO hosts high-stakes summit with tech giants behind the global AI boom
Amidst escalating global trade tensions, NVIDIA CEO Jensen Huang's "Trillion-Dollar" power summit in Taipei featured a surprising guest: a legendary chairman of Chinese PCB giant. As the sole Chinese executive invited to the inner circle, his presence alongside the heads of TSMC and Foxconn underscores the pragmatic, border-defying alliances required to power the global AI boom.
Saturday 31 January 2026
Nvidia CEO calls ASIC rivalry "illogical" as R&D spending heads toward $45 billion

Nvidia CEO Jensen Huang issued a sharp rebuke to market speculation regarding the rise of custom silicon (ASIC) during an interview in Taipei on January 31, 2026.

Saturday 31 January 2026
Nvidia CEO tells TSMC to "work harder" as 2026 demand surges; reveals 10-year capacity doubling plan

Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem.

Saturday 31 January 2026
Shenzhen Ingchips joins domestic chipmakers in raising prices as cost pressures mount

Shenzhen Ingchips Technology has joined Goke Microelectronics and Cmsemicon in announcing price increases, highlighting mounting cost pressures across China's semiconductor supply chain.

Saturday 31 January 2026
Taiwan's capital markets reach new highs, signaling broader global role

At a Lunar New Year press conference, the Financial Supervisory Commission said that combined revenues of Taiwan's listed companies surpassed NT$50 trillion (approx. US$1.59 trillion) in 2025, while total market capitalization reached NT$101 trillion. By market value, Taiwan now ranks as the world's seventh-largest securities market.

Saturday 31 January 2026
Morris Chang resurfaces as Jensen Huang returns to Taipei
TSMC founder Morris Chang made his first public appearance in more than a year on January 29, 2026, dining with Nvidia chief executive Jensen Huang just hours after Huang arrived in Taipei.