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Friday 11 September 2026
ASE to buy AOI, AVI equipment from Machvision for NT$334M
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection (AVI) systems, from related company Machvision to meet capacity expansion needs. The cumulative pretax transaction value for the past year and future purchases, based on the quotation and negotiation process, came to NT$334 million (US$10.6 million).
Friday 11 September 2026
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the US. Although he did not repeat his previous claim that Taiwan "stole" America's chip industry, Trump said Taiwan's chips should have been subject to heavy tariffs long ago, with tariffs of 100% or even 200%.
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what it calls the industry's first Insertion 2 automated optical test solution. As demand for photonics-integrated testing rises, the company expects equipment requirements to become more diverse and shipments to top 1,000 systems in the next 18-24 months.
Friday 11 September 2026
Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and advanced packaging capacity, according to Futurum Group.
Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and Innolux, the island's two largest panel makers, are accelerating capacity reductions and asset sales while redirecting capital and technology toward higher-growth businesses. For smaller and mid-sized players, however, the path beyond displays remains far less defined.
Friday 11 September 2026
CIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.

Friday 11 September 2026
Taiwan tech minister in Europe to advance semiconductor cooperation

National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe cooperation on advanced semiconductor packaging, silicon photonics (SiPh), and talent exchange, while also strengthening supply chain resilience. The trip included undisclosed government assignments as well as public events.

Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies spanning AI server assembly, cooling, power, substrates, materials, networking, test, and optics reported combined August revenue of NT$2.84 trillion (US$89.74 billion), up 76.5% from a year earlier and 9.9% from July, according to their filings to the Market Observation Post System. Both the total and the growth rate are the highest of the cycle, and the year-on-year rate is a step up from July's 61.3%.
Friday 11 September 2026
MediaTek August revenue beats expectations, boosts 3Q outlook

MediaTek reported August 2026 revenue of NT$64.183 billion (approx. US$2.03 billion), up 32.41% from July and 44.08% year-over-year. Industry sources said the chipmaker's August performance came in well above expectations and puts its third-quarter revenue guidance within reach, with a chance to beat it.

Friday 11 September 2026
Rayzher rides semiconductor fab buildout to record revenue
Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year and a record monthly high. Cumulative consolidated revenue for the first eight months of 2026 reached NT$1.993 billion, up 27.91% from the same period in 2025 and also a record for the period.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
Academia Sinica to open 8-inch quantum chip platform in September 2026

Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking a new stage in Taiwan's in-house quantum chip development and manufacturing efforts. After the cleanroom was completed, the institute finished installing process equipment, connecting factory utility lines, testing equipment functions, and training operators.

Thursday 10 September 2026
ITRI to showcase 3.2T silicon photonics and AI data center cooling
Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration said on the 10th that AI data centers need faster transmission and better cooling. The ministry said government-supported technologies from Taiwan's Industrial Technology Research Institute (ITRI) will be featured at the event, including a silicon photonics optical engine and a 3D aluminum microchannel thermosyphon cooler.
Thursday 10 September 2026
Nanoprinting lithography shifts from round to square, increasing waveguide output
Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands larger template formats and higher throughput.
Thursday 10 September 2026
US Justice Department probes Nvidia-Groq deal over antitrust concerns
The US Department of Justice has opened a probe into Nvidia's deal with AI chip startup Groq, according to reports from The New York Times and Reuters. Regulators are examining whether the transaction was structured to avoid antitrust review, with potential fines possible if wrongdoing is found.
Thursday 10 September 2026
ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out
ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor packaging and testing.
Thursday 10 September 2026
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter and 21.1% year-over-year. The semiconductor equipment maker said second-half operations should outperform the first half as its Thailand plant ramps following a July production increase and product mix improves.
Thursday 10 September 2026
TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated revenue reached NT$514.81 billion (approx. US$16.3 billion) in August, up 10.1% month-over-month and 53.3% year-over-year. Revenue for the first eight months of 2026 totaled NT$3.387 trillion, representing a 39.3% year-over-year increase.

Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment engineering services and customized products. The wafer-testing solutions provider also said its in-house Membrane Probe Card has begun contributing revenue as it moves into customer applications, while the company expands into next-gen test applications for high-speed data transmission, silicon photonics and co-packaged optics (CPO).
Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the global semiconductor equipment market and opening higher-value opportunities for Taiwan's industrial PC (IPC) suppliers.
Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing relationship to 130nm technology as supply conditions tighten across parts of the 8-inch foundry market.

Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation power semiconductors used in electric vehicles, renewable energy systems, and industrial equipment. The company is targeting volume production in 2027 as SiC manufacturers shift toward larger wafers.
Thursday 10 September 2026
Samsung trims foundry partner network as remaining DSPs gain momentum
Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure fabless customers, advance design projects, and help convert them into foundry orders.
Thursday 10 September 2026
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR glasses runs through the display industry rather than the semiconductor background, where most AR lens-making equipment comes from.
Thursday 10 September 2026
Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from major testing interface vendors. The squeeze is also pushing Taiwan foundry leader TSMC and related IC design customers to assess diversified supply channels for early-stage R&D validation.