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Thursday 5 February 2026
Samsung strengthens semiconductor supply chain cybersecurity to prevent tech leaks
As global competition in the semiconductor industry intensifies, the focus is no longer limited to technology and production capacity. Protection of data, intellectual property, and supply chains has become an equally critical battleground.
Thursday 5 February 2026
Renesas posts first annual loss in six years as 1Q26 margin rebounds to 32%
Renesas Electronics forecast a sharp improvement in profitability for the January to March quarter as growth in data center and other industrial infrastructure demand offsets weakness in automotive, after the Japanese chipmaker swung to its first annual net loss since fiscal 2019.
Thursday 5 February 2026
The 3nm surprise: TSMC's C.C. Wei pulls PM Takaichi's own book from his pocket to seal US$17B deal
In a moment that blurred the lines between corporate diplomacy and fan-like devotion, TSMC CEO C.C. Wei turned a high-stakes semiconductor summit into a personal tribute on February 5, 2026.
Thursday 5 February 2026
Asia Photonics Expo 2026 opens in Singapore, spotlighting photonics-semiconductor ties
The third edition of the Asia Photonics Expo (APE) opened on February 4, 2026, at the Sands Expo and Convention Centre, bringing together the global photonics and semiconductor ecosystem for three days of networking, conferences, and industry collaboration through February 6, 2026.
Thursday 5 February 2026
Commentary: How TSMC's C.C. Wei solidifies global alliances from Washington to Tokyo
In the high-stakes theater of global chipmaking, TSMC Chairman C.C. Wei has mastered a rare skill: the art of the well-timed strategic masterstroke.
Thursday 5 February 2026
Skytech delivers self-made PLP equipment, eyes record 2026 growth
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation chip-on-panel-on-substrate (CoPoS) advanced packaging, the company has completed delivery of the world's first 310mm by 310mm panel-level packaging physical vapor deposition (PLP PVD) equipment. The equipment has been successfully introduced into the production line of a major semiconductor packaging and testing plant in Kaohsiung, Taiwan.
Thursday 5 February 2026
Siemens expands EDA stack with AI metrology acquisition of Canopus AI
Siemens has acquired French startup Canopus AI, adding AI-based metrology and inspection software to its electronic design automation (EDA) portfolio as it expands deeper into semiconductor manufacturing workflows.
Thursday 5 February 2026
TSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse
TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of this initiative, with estimated equipment investment reaching US$17 billion.
Thursday 5 February 2026
Qualcomm reports record 1QFY26 results, flags memory constraints in near-term outlook
Qualcomm reported record financial results for its fiscal first quarter of 2026, while guiding lower for the current quarter as memory supply constraints begin to weigh on handset production.
Thursday 5 February 2026
Alphabet's US$185 billion hardware mandate: Breaking the AI supply bottleneck

Alphabet has signaled a transformative shift in its industrial strategy, unveiling a massive, sustained hardware build-out designed to break a persistent supply-side bottleneck.

Thursday 5 February 2026
Texas Instruments to reshore Silicon Labs production in US$7.5 billion wireless play
Texas Instruments (TI) has announced that it has reached an agreement to acquire chip designer Silicon Laboratories for approximately US$7.5 billion, marking the largest deal for TI since its US$6.5 billion purchase of National Semiconductor in 2011. The acquisition underscores TI's strategy to strengthen its presence in wireless connectivity chips for industrial, consumer, and smart-device applications.
Thursday 5 February 2026
Singapore highlights photonics drive for chip innovation at APE 2026

Dr. Patrick Lo, Senior Fellow, Technology Development at GlobalFoundries (former Chief Technology Officer, AMF), outlined how photonic technologies are shaping the next phase of semiconductor innovation during a presentation at the third Asia Photonics Expo (APE 2026). His talk, titled "Integrated Photonics: A New Engine for Singapore's Semiconductor Innovation," focused on the role of optoelectronics in computing and communications.

Thursday 5 February 2026
Infineon's Ams Osram sensor acquisition signals shift toward higher-value systems and AI-linked growth
Infineon's planned purchase of Ams Osram's non-optical sensor portfolio underscores a strategic move to deepen its systems capability, rebalance exposure away from cyclical automotive pressure, and reinforce long-term growth tied to artificial intelligence, industrial automation, and medical applications.
Thursday 5 February 2026
Infineon's fiscal 1Q26 resilience highlights AI-driven growth amid cyclical pressures
Infineon's first quarter of fiscal year 2026 showed that strong demand linked to artificial intelligence (AI) can cushion cyclical weakness in other markets, reinforcing the company's medium-term growth narrative while also bringing higher investment needs and cash flow pressure into focus.
Thursday 5 February 2026
Infineon pivots capacity to AI power as automotive recovery drags
Infineon's decision to accelerate investment to expand AI power capacity is set to lift fiscal 2026 capital spending and intensify fab loading management, even as the company maintains a cautious view of a gradual, uneven recovery in automotive and industrial demand.
Thursday 5 February 2026
Renesas reportedly to sell timing unit to SiTime in US$3 billion deal
According to Bloomberg and Nikkei, citing respective sources, Renesas Electronics is set to divest its clocks and timing device business to US chip design company SiTime for around US$3 billion, in a move aimed at sharpening its focus on microcontrollers for automotive and industrial applications. The potential sale comes amid slowing demand for automotive semiconductors and rising interest in high-speed data center components.
Thursday 5 February 2026
Samsung sees net cash surpass KRW100 trillion, fueling semiconductor investment, M&As
Samsung Electronics has once again pushed its net cash above KRW100 trillion (US$68.97 billion), reaching KRW100.61 trillion at the end of 2025, up 7.8% from the same period in 2024. This marks Samsung's return to the milestone for the first time since 2022, highlighting its increasingly robust financial structure and strong capital deployment capabilities.
Wednesday 4 February 2026
TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand
Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate efforts to diversify production away from China. The shift is being reinforced by rising electricity consumption from AI data centers, which is driving demand for high-voltage, high-power power management components used in servers and related infrastructure.
Wednesday 4 February 2026
VIS sees 1Q26 ASP dip amid product shifts, expects stable full-year pricing
Vanguard International Semiconductor (VIS) held its earnings call on January 3, 2026, projecting wafer shipments to rise 1-3% quarter-over-quarter in the first quarter of 2026 as customer demand stabilizes following year-end inventory adjustments. Assuming an average exchange rate of NT$31.3 per US dollar, the company anticipates a 3-5% decline in average selling price (ASP) and gross margin between 28-30% for the quarter.
Wednesday 4 February 2026
Nvidia expands validation and testing, silicon photonics could be GTC 2026 focus
Taiwan's supply chain has reaped the benefits of Nvidia's AI leadership. In Taiwan, it received NT$6.7 billion (US$211.9 million) in subsidies in 2023 under the Taiwan AI Innovation R&D Center Program. In May 2025, the Nvidia Constellation was announced in Taipei's Beitou-Shilin Science Park. It has now been revealed that Nvidia's silicon photonics validation and testing laboratory at the Tai Yuen Hi-Tech Industrial Park in Zhubei City is continuing to expand.
Wednesday 4 February 2026
NXP abandons low-margin bets to chase the software-defined car
In an earnings call held on February 3, NXP Semiconductors NV reported fourth-quarter revenue of US$3.34 billion, representing a 7% increase year-on-year and a 5% sequential rise. Management characterized the 2025 fiscal year as two distinct halves: initial demand weakness, followed by an acceleration in the second half. The company indicated that its performance in the latter part of the year has allowed it to return to its long-term financial model, leading to an optimistic outlook for 2026.
Wednesday 4 February 2026
Samsung to tear down birthplace of its chip business at Giheung campus for new R&D center

Samsung Electronics is dismantling a key building at its Giheung campus as part of plans to construct a large-scale advanced research center, according to Hankyung. The site, known as SR5, is regarded as the birthplace of the company's semiconductor business and the location where Samsung developed its 65-megabit DRAM in 1992.

Wednesday 4 February 2026
Taiwan's paper-counting academic culture is being challenged—here's why
Taiwan has long measured academic success through publication volume, a metric that has driven intense competition with China in research output. But National Science and Technology Council (NSTC) Minister Cheng-wen Wu is now calling for a different approach—one focused on global impact and technological leadership rather than paper counts.
Tuesday 3 February 2026
Shanghai fast-tracks 'Oriental IC Port,' adds fourth-gen semiconductors to roadmap

China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer interfaces (BCIs) and fourth-generation semiconductors among its priority future industries, signaling early preparation for a new materials era beyond third-generation semiconductors.

Tuesday 3 February 2026
AMD and Broadcom back Powertech's FOPLP; monthly revenue to hit NT$3 billion
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC ecosystem, expecting a significant revenue surge in 2027-2028 as FOPLP capacity reaches full utilization, contributing NT$3 billion (US$95 million) monthly.