AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past US$1 trillion in 2026, four years earlier than previously expected, and expand the market to US$1.5 trillion by 2030. SEMI Global Chief Marketing Officer Terry Tsao said nearly 89 fabs are in the planning or construction pipeline for 2026-2030 to meet surging AI chip demand, with another 50 fabs expected to be planned for 2030-2035.
Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor development, underscoring six years of sustained investment in the approach. Rather than attempting to disrupt the existing semiconductor industry, Ren said the initiative aims to establish a sustainable path for chip evolution amid restrictions on access to leading-edge manufacturing technologies.
Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment in advanced chip production.
Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis and advanced packaging capabilities alongside a front-end pilot line for 2nm logic chips.
Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the South Korean memory maker formally denied pursuing an acquisition of the site.
Mitsubishi Electric is seeking an agreement with Toshiba and ROHM by September on combining semiconductor operations centered on power devices, as the three Japanese suppliers negotiate product scope and corporate control while seeking government support.
Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.
