CONNECT WITH US
Thursday 2 July 2026
Samsung courts AI chipmakers with 2nm roadmap amid firming foundry demand

Samsung Electronics used its annual foundry ecosystem event on July 1 to signal that its contract chipmaking business is regaining momentum, laying out a longer-term manufacturing roadmap alongside signs of firmer near-term demand.

Thursday 2 July 2026
Infineon closes ams OSRAM sensor acquisition, adds EUR230 million in annual revenue
Infineon Technologies completed its acquisition of the non-optical analog and mixed-signal sensor portfolio from ams OSRAM on Tuesday, expanding its position in automotive and industrial sensing and adding roughly 230 employees across three new locations.
Thursday 2 July 2026
Fujifilm India signs MoU to assess semiconductor materials manufacturing in Gujarat

Fujifilm India said it has signed a memorandum of understanding with the Gujarat State Electronics Mission, under the Department of Science and Technology of the Government of Gujarat, to explore opportunities for manufacturing semiconductor materials in India and strengthening domestic supply chain capabilities.

Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip scaling beyond the limits of today's semiconductor designs, as the industry searches for ways to improve performance after decades of shrinking transistor dimensions.

Thursday 2 July 2026
GaAs and InP price hikes hit Taiwan supply chain
Compound semiconductor epitaxy makers are raising prices again for gallium arsenide (GaAs) and indium phosphide (InP) epi wafers, as persistent raw material cost increases, supply chain shortages, and inflation continue to weigh on the industry. Taiwanese suppliers warn that output in the second half of the year remains tied to material restrictions.
Thursday 2 July 2026
Taiwan eyes 2028 carbon trading market launch, but experts warn of risks and timing

Taiwan plans to launch an emissions trading system (ETS) in 2028 as the next phase of its carbon pricing framework — a cap-and-trade market where companies buy and sell permits to emit greenhouse gases. However, environmental researchers and academics caution that the experiences of Japan, South Korea, and the European Union (EU) show that emissions trading markets take years to mature and operate effectively. With Taiwan's own carbon fee only recently taking effect, they argue the government should prioritize policy continuity and give businesses time to internalize carbon costs and implement decarbonization strategies before introducing a cap-and-trade regime.

Thursday 2 July 2026
IBM's 0.7nm chip claim revives debate over semiconductor node naming

As semiconductor manufacturing enters the 2nm era, conventional transistor scaling is approaching its physical limits. On June 25, 2026, IBM unveiled what it described as the world's first sub-1-nanometer chip technology, featuring a 0.7nm (7-angstrom) process node. The research chip integrates nearly 100 billion transistors into an area roughly the size of a fingernail, marking a significant milestone in semiconductor scaling.

Wednesday 1 July 2026
Yageo chairman takes control of Anpec board
After Yageo confirmed its stake in Taiwanese power management IC maker Anpec, attention has turned to whether the group will deepen its involvement in Anpec's operations as part of a broader consolidation strategy. Anpec previously said that, based on the current understanding between the two companies, Yageo invested because it sees Anpec's operating performance as attractive and wants exposure to the semiconductor industry. Yageo also planned to use its distribution channels to help bring products to international markets and had no intention of intervening in operations. However, Anpec's leadership change suggests the two sides have clearly agreed to deepen cooperation.
Wednesday 1 July 2026
Samsung, SK Hynix southwest fab plans put Gwangju's silicon photonics ambitions in focus
Samsung Electronics' and SK Hynix's planned memory investments in South Korea's southwest have mostly been viewed as a push to balance regional development and tap into local renewable energy.
Wednesday 1 July 2026
Tesla taps Intel 18A veteran to lead Terafab chip project in Texas

Tesla has hired Gary Jiang, a nearly 18-year Intel manufacturing veteran, as director of its Terafab chip project in Texas, marking the first publicly identified senior leadership appointment tied to Elon Musk's ambitious semiconductor manufacturing plan.

Wednesday 1 July 2026
Supermicro smuggling probes reportedly push Nvidia to tighten AI server checks further

As the US tightens controls on advanced AI chip exports, smuggling schemes are surfacing across the AI server supply chain, driven by soaring Chinese demand for AI servers from buyers like Alibaba and Tencent willing to pay almost any price. Supermicro was investigated in the first half of 2026, with executives and employees allegedly bypassing US export controls to divert restricted AI servers and technology to China. Taiwan's Albatron was also reported to be involved, and the case has since escalated: Keelung prosecutors detained Albatron Technology general manager Kevin Lu on Tuesday on suspicion of smuggling Supermicro AI servers to restricted markets.

Wednesday 1 July 2026
China's chip material makers riding the AI boom close in on Japan

Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency, challenging the long-standing dominance of Japanese suppliers in a global market valued at US$73.2 billion.

Wednesday 1 July 2026
South Korea's southwest chip hub plan faces supplier gap
South Korea's plan to build a KRW800 trillion (approx. US$51 billion) memory fab cluster in the southwestern Honam region is running into an inconvenient fact: the region has the country's weakest base of semiconductor materials, components, and equipment suppliers, according to government data submitted to lawmaker Koo Ja-keun and cited by Chosun Ilbo.
Wednesday 1 July 2026
Taiwan starts collecting carbon fee, with highest amount from semiconductor firms

Taiwan's carbon fee system has begun collecting payments, with the first batch covering 240 high-emitting companies across 461 factories and generating NT$4.97 billion (US$156.07 million) in initial revenue. Taiwan also plans to roll out an emissions trading system (ETS) in 2028, initially targeting 20 major emitters in the steel, cement, and semiconductor sectors.

Wednesday 1 July 2026
India Semiconductor Mission 2.0 reportedly clears Finance Ministry hurdle as govt highlights first-phase progress

India's proposed second phase of the India Semiconductor Mission (ISM 2.0) has reportedly taken a key step forward, clearing the Finance Ministry's Expenditure Finance Committee (EFC), according to Indian media reports. The development could pave the way for a broader expansion of the country's semiconductor manufacturing ambitions.

Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pushing order visibility beyond 2027.
Wednesday 1 July 2026
AI chip complexity stretches electronic materials order windows to six months, DuPont spinoff warns

As the AI wave drives rapid growth across the global semiconductor industry, the upstream electronic materials supply chain has become a key bottleneck for AI-related shipments. To keep pace with AI investment, Qnity was spun off from US chemical giant DuPont and listed independently in November 2025.

Wednesday 1 July 2026
Naphtha supply risk adds pressure to semiconductor materials
A crude oil shortage tied to the US-Iran war is raising concern about naphtha, a refinery byproduct used deep in industrial supply chains. While a direct semiconductor shortage is not yet seen, higher input costs are already spreading, and global manufacturers may face longer-term pressure if disruptions persist worldwide.
Wednesday 1 July 2026
South Korea's southwest chip hub grows from memory fabs into full semiconductor and AI ecosystem
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor outlining a combined KRW896 trillion (approx. US$581 billion) in investment covering memory chip fabs, AI data centers and advanced packaging.
Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and foundry experience has become a strategic asset.

Wednesday 1 July 2026
Why South Korea may struggle to replicate Taiwan's semiconductor success

South Korea is moving to build a complete semiconductor supply chain modeled on Taiwan's technology corridor, but Gudeng chairman Bill Chiu said the hardest part to replicate is not science parks or fabrication plants, but Taiwan's deeply rooted supply chain culture.

Tuesday 30 June 2026
Asia Neo Tech and Brooks sign 15-year FOUP deal

Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.

Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a relatively limited impact, since the company mainly supplies high-end business notebook cameras.

Tuesday 30 June 2026
TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.

Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.