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Tuesday 9 December 2025
Tata Group and Intel form strategic alliance to assemble chips in India
Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused computing systems in India. The agreement is aimed at expanding domestic chip production and building a more resilient electronics supply chain as India seeks to strengthen its position in the global semiconductor industry.
Tuesday 9 December 2025
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the possibility, but does not guarantee the move will proceed.
Tuesday 9 December 2025
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack is founder and CEO Jianzhong Zhang, whose 14-year career at Nvidia adds another dimension to the company's strategy.
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with TSMC. The company is expanding its global research network and targeting the commercialization of co-packaged optics in 2027. Industry sources say that the timeline will mark the beginning of direct competition with its Taiwanese rival in next-generation packaging.
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips. He also answered questions from domestic and foreign researchers about the US-China tech competition.
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending Moore's Law amid its slowdown. He emphasized how these innovations enabled AI advancements and shaped TSMC's 3D Fabric platform despite early commercial challenges.
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company for a strong finish to 2025. South Korean analysts expect operating profit to reach as much as KRW19 trillion (US$13 billion) in the fourth quarter of 2025, significantly above market expectations.
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip packaging capacity will consolidate around two critical hubs: Taiwan and the United States. The key beneficiaries are expected to be ASE Holdings and Siliconware Precision Industries (SPIL) in Taiwan, and Amkor Technology in the US and South Korea.
Monday 8 December 2025
TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion at home and overseas to meet rising demand for artificial intelligence (AI) chips. United Integrated Services (UIS), Marketech International (MIC), L and K Engineering, Yankey Engineering, and Acter Group report strong profit momentum supported by large project backlogs tied to TSMC's new fabs and advanced packaging lines.

Monday 8 December 2025
Weekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging. Although invisible at the consumer end, Ritek has become an "invisible champion", supplying the tooling, materials, and power backup systems that underpin customers' AI deployment.

Sunday 7 December 2025
South Korea bets on airport GSE to break 90% power chip import lock
South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric vehicles (EVs), data centers, and emerging mobility markets. Airport ground support equipment (GSE) has emerged as a strategic platform to validate and scale domestic power semiconductor technologies.
Saturday 6 December 2025
Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV
A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal line patterning using only deep ultraviolet (DUV) lithography — potentially bypassing US export restrictions on advanced tools. The South China Morning Post reports the technique can create metal pitches under 21nm, a requirement typically met only with ASML's top-tier extreme ultraviolet (EUV) exposure systems, which remain off-limits to Huawei.
Saturday 6 December 2025
Fabship takes chip manufacturing into orbit as industry eyes Space-based fabs

As artificial intelligence (AI) accelerates the global semiconductor race—and as commercial space activity heats up—the idea of moving chip fabrication into orbit is edging from science fiction toward technological reality.

Saturday 6 December 2025
Taiwan taps tech strengths to accelerate smart healthcare push

Taiwan's smart-healthcare sector is gaining momentum, powered by decades of accumulated expertise in electronics and information and communications technology (ICT). Now, in an effort to accelerate the industry's upgrade and foster cross-sector collaboration, the Chinese National Association of Industry and Commerce (CNAIC) is launching a strategic partnership with the Industrial Technology Research Institute (ITRI). Their aim: start from real-world clinical and industry needs, link up technology developers, hospitals, and supply-chain players, and build a scalable model for deploying smart-medical solutions.

Friday 5 December 2025
UMC expands US supply chain with 8-inch wafer MOU with Polar Semiconductor
UMC has finalized plans to invest in the US semiconductor manufacturing sector by signing a memorandum of understanding (MOU) with American foundry Polar Semiconductor on December 4, 2025. The two companies will explore collaboration opportunities for 8-inch wafer production within the US, targeting growing demand from automotive, data center, consumer electronics, aerospace, and defense industries.
Friday 5 December 2025
AMD's Lisa Su dismisses AI-bubble talk while it prepares taxed MI308 exports to China
At WIRED's Big Interview event in San Francisco, AMD CEO Lisa Su rejected claims that the technology sector is drifting into an AI bubble. Pressed on whether the industry is in bubble territory, she responded, "Emphatically, from my perspective, no."
Friday 5 December 2025
Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides
The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that reveals the stakes of the dispute, both companies immediately declared victory.
Friday 5 December 2025
AI power boom exposes Western GaN dilemma as firms still route through China
TSMC's decision to exit the gallium nitride (GaN) foundry market has set off a major restructuring of the global power device supply chain toward China-independent models and sharpened the race for leadership amongst Taiwan and US GaN foundries.
Friday 5 December 2025
CHPT eyes double-digit growth in 2025 as Wei-kuo Hong becomes corporate representative
Testing interface manufacturer Chunghwa Precision Test Tech (CHPT) reported that due to seasonal factors at the end of the year, revenue for November 2025 declined both year over year and sequentially. However, cumulative revenue for the first 11 months still outperformed the same period in 2024. The company expects to achieve its full-year goal of double-digit revenue growth in 2025.
Friday 5 December 2025
Google TPU surge drives Taiwan's advanced testing boom
Google DeepMind's latest AI model, Gemini 3, has made a stunning debut, outperforming ChatGPT, Claude, and other competitors, signaling a new phase in the generative AI landscape. This has drawn attention to the Google-developed TPU chips that train this model, which have also attracted interest from other US-based cloud service providers (CSPs).
Friday 5 December 2025
Solomon showcases latest AI vision tech at iREX 2025
The next wave of humanoid robot development is focusing on physical agents, with the core challenge being robots that not only see but also understand and act successfully. The critical vision-language-action (VLA) multimodal model competition is heating up, attracting global giants like Google, Nvidia, and OpenAI.
Friday 5 December 2025
Lingsen rides AI-driven memory test surge, expanding capacity and adjusting prices
Taiwan's dedicated chip backend house Lingsen Precision Industries is stepping up capacity expansion and price adjustments as AI-fueled demand for memory chip testing accelerates. President Tse-sung Tsai noted that unresolved global tariff policies could present risks into 2026, but said long-term growth momentum for memory testing remains strong as AI adoption widens.
Thursday 4 December 2025
Tong Yang sees 1% revenue rise in November; new plant to finish by end of 2026
Tong Yang reported consolidated self-declared revenue of NT$2.218 billion (approx. US$70.9 million) for November 2025, up 1% from October and marking the highest monthly figure in nearly seven months amid strong peak-season order demand. The company's cumulative revenue for the first 11 months reached NT$23 billion.
Thursday 4 December 2025
Nexperia dispute escalates: Dutch minister cancels China visit, Beijing spotlights ex-Wingtech chair
China's Wingtech Technology and its subsidiary Nexperia are facing renewed turbulence in their control dispute with the Netherlands. Dutch Economic Affairs Minister Vincent Karremans abruptly cancelled a planned China visit, a decision seen as highly sensitive given the timing.