Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin enters mass production and ramps up. The move is set to drive upgrades at TSMC and could trigger another wave of orders across the global equipment and materials supply chain.
Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.
Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision Mechanics, a unit of Eternal Materials, saying customer orders and inquiries jumped sharply around Christmas 2025 and have continued since. Its Japan plant has been running at full capacity since May this year.
Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology has emerged as a crucial next-stage process amid rapid advances in chip stacking, heterogeneous integration, and backside power delivery.
The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years. At the 2026 OCP APAC Summit, however, Ayar Labs CEO Mark Wade shifted the focus from whether CPO works to whether it can scale commercially.
