Nvidia CEO Jensen Huang made his fifth visit to Taiwan in 2025 on November 27, reportedly to pay a personal visit to TSMC founder Morris Chang. Speaking publicly, Huang confirmed he had met with Chang, describing the semiconductor pioneer's health as "very good," and added that he would be leaving Taiwan later that day.
Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E memory. The disclosure highlights a significant shift in how next-generation high-bandwidth memory may be built, as foundries, rather than DRAM makers, begin handling the foundational logic layer of advanced HBM stacks.
3Peak, a leading Chinese analog chipmaker, plans to acquire Ningbo Aura Semiconductor through new share issuance and/or cash. The move advances 3Peak's push to become a global platform-based provider of analog and mixed-signal solutions.
Rapidus plans to begin construction on a second fabrication plant in Chitose, Hokkaido, in fiscal 2027 to produce 1.4nm and eventually 1nm chips, according to reports from Nikkei and Yomiuri Shimbun. The move underscores Japan's push to return to the front of advanced logic manufacturing, even as Rapidus works to complete its 2nm process and secure the funding required to sustain its roadmap. However, the company has since denied this reported timeline.
