Powerchip Semiconductor Manufacturing (PSMC) reported third-quarter 2026 revenue of NT$21.3 billion (US$654.3 million), up 23% quarter-over-quarter, as higher foundry prices, a stronger average selling price (ASP) and improved capacity utilization lifted gross margin from 28% to 48% and drove net profit to NT$6.5 billion. With AI servers fueling demand for memory, power-management ICs and advanced packaging, PSMC expects double-digit revenue growth in the fourth quarter and has indicated that foundry prices will rise another 10% to 20% in 2027.

Infineon Technologies is expanding its work with Nvidia on 800-volt direct current power architectures for AI data centers, with a focus on gallium nitride (GaN) chips in the intermediate bus converter (IBC), the company said on October 21.

As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology is expanding its role in Arizona, from core facility systems and equipment hook-up to materials supply. Chi Yi Hsin Technology said its backlog reached NT$4.476 billion (US$137.5 million) as of the end of September 2026, with projects scheduled for execution through around 2028 and overall order visibility extending to 2030.

Texas Instruments reported strong revenue growth in its third-quarter earnings call due to strong demand across its industrial, automotive, and data center businesses. The company said it is facing a tight supply environment for its chips, but brought up its ramping of production and testing capacity, including through its new Malaysia back-end facility.

Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions cover process materials, piping and valves, wastewater recycling equipment, and semiconductor testing components, raising questions about whether Taiwan's semiconductor supply chain will benefit from the massive expansion.

Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors and gaming for near-term investment, while physical AI and hydrogen are positioned as the next growth drivers.

Intel is accelerating work on its long-delayed US semiconductor manufacturing projects, with equipment installation underway at its Fab 62 facility in Arizona and construction progressing at its Ohio site. The developments come as stronger demand for AI data center processors supports the chipmaker's efforts to expand capacity and strengthen its foundry business.

Lam Research is grooming Indian companies to become its suppliers rather than relying only on its global vendor base, a senior executive said, as the US chip equipment maker deepens its presence in a market where the government now ties incentives to local sourcing.

US Commerce Secretary Howard Lutnick has announced a new investment by industrial minerals company Sibelco to expand semiconductor-related manufacturing in North Carolina, as the Trump administration pushes to bring more of the chip supply chain onto US soil.

Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea, with Tesla and SpaceX approaching materials, components, and equipment suppliers across nearly every segment of the planned supply chain, from basic piping components and process materials to testing components.

Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and that the company's multi-year build-out of 12-inch wafer capacity is now lifting margins rather than absorbing cash. Revenue rose 28% year on year and 11% sequentially to US$6.06 billion for the quarter ended September 30, 2026.

Nvidia used its GTC Berlin keynote on October 21 to argue that AI's bottlenecks now lie in deployment speed, power, and security rather than silicon, unveiling reference designs and software that extend its reach from GPUs to how entire AI factories are built and run.

The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron, STATS ChipPAC, Wistron, and market research firm TechSearch. Covering crucial supply chain segments—including PCBs, IC substrates, OSATs, and EMS providers—the forum addressed pressing technical bottlenecks in AI-driven high-performance computing (HPC).

As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking shape. Minister of Economic Affairs Ming-Hsin Kung recently revealed in an interview with foreign media that Taiwan plans to collaborate with the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) to construct multiple US industrial parks. Texas has been selected as the inaugural location to help Taiwanese AI and semiconductor suppliers build a local manufacturing footprint.

Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration model to win a place in Nvidia's supply chain. The move could meet customer requirements, but it is raising concerns in South Korea over Samsung Foundry's competitiveness, HBM design control, and the long-term benefits of internal collaboration.

Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%. The company expects tight supply and demand to continue through 2028 or longer, while price increases are set to continue in the fourth quarter of 2026 and support stronger operating performance than in the third quarter.

The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in orders as it joins the supply chains supporting leading foundry construction projects in Taiwan and the US. Founded in 2014, the facility engineering integrator is preparing to list on the Taipei Exchange to accelerate its entry into the capital markets.

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via (TGV) technology has emerged as a major focal point for the semiconductor industry due to its ability to enable high-density vertical interconnects and mitigate large-area warpage. TPK Holding is collaborating with a Taiwanese semiconductor packaging giant to co-develop TGV solutions; its pilot line has already begun process of record (POR) adjustments for specific customer specifications, with plans to consider expanding factory investments in Taiwan by 2027.

Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation session scheduled for October 22. According to an internal email circulated by employees, Micron will introduce quarterly profit-sharing bonuses based on employee level in fiscal year 2027. The plan will cover employees at the director level and below.

Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their existing supply partnership from 6-inch to 8-inch substrate technology, positioning both companies to meet future demand across electric vehicles (EVs), renewable energy systems, and AI data center power infrastructure.

Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its imaging-sensor expertise creates synergies between components and creative production, while a partnership with Taiwan Semiconductor Manufacturing Co. (TSMC) will support future manufacturing investment.

AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large share of its domestic MOCVD market but remains unable to supply Samsung Electronics' and SK Hynix's South Korean fabs.

Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor packaging substrate lines, advanced packaging facilities, and AI computing hubs. LG Innotek is reportedly evaluating the acquisition of an LCD plant operated by LG Display, following similar deals in Japan and Taiwan.

Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure for customers worldwide. The project highlights investment in advanced semiconductor capacity as the global economy enters the artificial intelligence era, with production scheduled to begin in 2028.

SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house. Its Q3 earnings call suggests the company now wants to test that philosophy on perhaps the hardest manufacturing problem of all: advanced semiconductor production.