Demand for advanced chips at TSMC is tightening amid the AI boom, with its 3nm process becoming increasingly congested as major customers compete for limited capacity.
The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry.
Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4, into full operation by the end of 2026 as the AI server boom reshapes demand for high-bandwidth memory (HBM) and advanced DRAM.


