Shanghai state-backed foundry GTA Semiconductor has partnered with Infineon Technologies to introduce SONOS-based embedded non-volatile memory (eNVM) into production, positioning itself more firmly in automotive and industrial chip supply chains.
According to the latest report submitted by Taiwan's National Security Bureau to the Legislative Yuan, China is increasingly targeting Taiwan in an effort to circumvent international technological restrictions. Beijing has set its sights on Taiwan's high-tech sectors—particularly artificial intelligence (AI), semiconductors, and precision machinery—seeking to lure companies to establish operations or maintain a presence in China under the framework of its 15th Five-Year Plan.
Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising, driven by surging costs for gallium, a critical upstream metal. After months of sustained increases in raw material prices, industry executives say a reversal appears unlikely.
French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new presence in Canada and gained recognition at the American Physical Society meeting, where it was identified as a potential key player in the emerging quantum computing era.
AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers to seek alternatives, leaving Intel as the only credible challenger with its EMIB platform.
US lawmakers are moving to tighten semiconductor restrictions, with a bipartisan proposal targeting both equipment exports and downstream controls on advanced chips.
Samsung and SK Hynix delivered record performance in 2025, driven by strong investment in AI infrastructure. Yet the gains have not flowed upstream. Materials and component suppliers are facing a second consecutive year of price cuts, with contract terms for 2026 again revised lower.
MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house "MSS HG" platform at the Electronic Production Equipment Exhibition on April 8.
Recent reports suggest that Google has once again made engineering changes to its Tensor Processing Unit, or TPU, pushing the chip's tape-out to around mid-2026. The product in question—known as the v8x and designed by MediaTek—has raised fresh concerns about whether MediaTek can scale its application-specific integrated circuit, or ASIC, business as planned this year.
Anthropic, Google, and Broadcom today announced a massive expansion of their strategic partnership, unveiling a multi-year roadmap that secures approximately 3.5 gigawatts (GW) of next-generation AI computing capacity for Anthropic.
