Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.

The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing a document it has seen.

As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.

Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.

Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.

Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.

Snowflake, the cloud data company at the center of the artificial intelligence boom, said on Wednesday that it would spend US$6 billion over the next five years on Amazon Web Services infrastructure, deepening a partnership aimed at helping corporations move from experimental AI projects to large-scale deployment of autonomous software agents.

During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners working together toward shared goals.

Nvidia's new Taiwan headquarters is expected to begin construction by the end of 2026 and officially open in 2030, and CEO Jensen Huang is propagating that Taiwan "needs more electricity" to fund projects. With the AI cluster revolving around Nvidia, Taiwan Power Company (Taipower) estimates that power demand in the Beitou-Shilin Technology Park (BSTP) area will reach approximately 180MW.

Chunghwa Precision Test Tech. completed its board election at the 2026 annual shareholders' meeting on May 27 as the semiconductor test interface maker prepared for rising AI chip demand and a planned capacity expansion over the next two to three years. The company announced the reappointment of four board members and the retention of three independent directors as it outlined near-term production and market plans.

Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported, citing industry sources.

UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for future operating growth.

Hotai Motor Co. told shareholders on May 27 that Taiwan's auto market was expected to strengthen in 2026 as demand for semiconductors and AI applications supported exports and the broader economy. The company forecast the full-year vehicle market could reach 440,000 units, attributing the outlook to a stabilizing global economy, policy continuity and a pickup in replacement demand.

Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share of revenue continuing to rise. The company has begun expanding capacity for its electronic-grade isopropyl alcohol (IPA) and propylene glycol methyl ether (PM) lines.

Dreame Technology, a Chinese consumer electronics maker, has formed nearly 1,000 affiliated companies in its ecosystem since the end of 2024. This breakneck pace of expansion signals the ambitions of its leadership to unearth growth opportunities across the broader Chinese tech sector, although some media outlets question the sustainability of the business model.

TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.

Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.

Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also said that TAITRA has allocated the entire Taipei International Convention Center (TICC) exclusively to Nvidia for GTC Taipei 2026.

Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.

WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.

Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.

Nvidia CEO Jensen Huang, who is visiting Taiwan for two weeks, stated that the island's manufacturing sector is developing rapidly and needs more electricity.

The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.