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Saturday 11 April 2026
ASE leads US$3.4B advanced testing push in Renwu
Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE collaborated with WinWay and Horng Terng Automation (HTA) to jointly invest in building a high-end semiconductor testing service industrial park that will provide wafer and chip testing services.
Saturday 11 April 2026
Samsung Electro-Mechanics reportedly strengthens role in Nvidia's Groq 3 LPU supply chain with FC-BGA substrate push
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation inference chip integrated into Nvidia's upcoming Vera Rubin AI platform.
Saturday 11 April 2026
Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy
Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push to position itself as a "systems foundry" for the artificial intelligence era.
Saturday 11 April 2026
Analysis: Taiwan's March supply chain data makes the AI acceleration case better than any earnings call
Taiwan's listed AI hardware companies collectively generated $69.7 billion in March 2026 revenue across 13 supply-chain segments — up 63% year-over-year — offering the most comprehensive single-month snapshot yet of where global AI infrastructure spending is actually flowing. The table below covers 49 companies from TSMC's silicon foundry all the way down to the rail kits that slide servers into racks. Read together, the numbers tell a story that goes well beyond any single company's earnings call.
Saturday 11 April 2026
Analysis: Taiwan's AI supply chain posts strong March revenues, signaling the buildout is still accelerating
Taiwan's listed companies powering the global AI server supply chain delivered exceptional March 2026 revenues across virtually every segment, with TSMC posting its strongest single-month revenue on record and server ODMs surging on the back of relentless hyperscaler demand for AI infrastructure. The results, amplified by a seasonal rebound from February's Lunar New Year-compressed working days, confirm that the AI hardware buildout is accelerating rather than plateauing.
Friday 10 April 2026
MAtek sees record March revenue as AI and silicon photonics boost testing demand
MAtek's March revenue surge has implications for global chipmakers and AI infrastructure providers: rising demand for advanced material and failure analysis testing linked to AI chip and silicon photonics development could strain testing capacity worldwide and influence timelines for advanced node adoption, optical communications deployment, and related investment.
Friday 10 April 2026
GlobalWafers' 12-inch line to run full in 2Q26 as wafer utilization rises
GlobalWafers reported March and first-quarter 2026 revenue that underscores transient operational disruptions with global implications: March consolidated revenue reached NT$5.45 billion (US$171.5 million), up 23.8% month-on-month and flat year-on-year, while first-quarter revenue fell amid holiday- and weather-related capacity impacts at overseas plants, prompting cautious market observation.
Friday 10 April 2026
Taiwan accelerates SiPh and materials breakthroughs for next-gen AI computing
Taiwan is stepping up its global semiconductor leadership with a coordinated push into silicon photonics (SiPh) and advanced materials, aiming to meet surging demand for faster, more energy-efficient AI computing while strengthening domestic technological autonomy.
Friday 10 April 2026
Merck's material and equipment push could speed CPO and advanced packaging adoption
Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized solutions to improve yield, resolution, energy efficiency, and inspection speed to support next-generation optoelectronic semiconductor integration.
Friday 10 April 2026
MPI posts record 1Q26 revenue, invests NT$2B in Hsinchu plant expansion
Semiconductor test interface leader MPI reported a new quarterly revenue high in the first quarter of 2026, driven by strong demand for AI-related chip testing and signaling sustained growth for the year.
Friday 10 April 2026
China's export controls spark 140x yttrium price surge, fueling chip equipment fears
Yttrium, a critical rare earth element used in semiconductor manufacturing equipment, has seen its global supply tighten sharply due to China's export restrictions, driving prices up about 140x within a year and raising concerns over impacts on the semiconductor, aerospace, and energy sectors.
Friday 10 April 2026
TSMC smashes records with massive 45% revenue surge in March

Tech giant TSMC has released a blockbuster revenue report for March 2026, signaling an extraordinary acceleration in the semiconductor sector.

Friday 10 April 2026
China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading players ramping investment to capture rising demand from AI, high-performance computing (HPC), and automotive electronics.

Friday 10 April 2026
MetaOptics bets on Taiwan to scale metalens for AI, next-gen optics
MetaOptics, a Singapore-based metalens developer, is partnering with Taiwan's Pin-Jye Nano Technologies to scale production of next-generation optical components as the technology moves from research into early commercialization and gains new relevance in artificial intelligence and advanced sensing applications.
Friday 10 April 2026
Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology is aggressively expanding into the South Korean market starting this year through its enterprise edge large language model (LLM) platform, Edgestar.
Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale manufacturing until mid-2027. Industry sources say that despite nearly complete equipment installation, yields remain below expectations, prompting a postponement of mass production schedules.
Friday 10 April 2026
Column: Corintis uses algorithms to target chip hotspots for precise cooling
As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual, evenly distributed heating, modern chips exhibit sharp, localized hotspots that concentrate extreme thermal loads within small regions.
Friday 10 April 2026
Intel–Google alliance reframes AI infrastructure around CPUs
A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the partnership spans multiple generations of Intel's Xeon processors and includes co-development of custom infrastructure silicon. Financial terms and deployment timelines were not disclosed, but the scope points to a long-term alignment, not a one-off supply deal.
Friday 10 April 2026
MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer side, but also by a strategic push into the telecom operator segment — where the company is securing fresh business across Europe and North America.
Friday 10 April 2026
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According to TSMC's disclosures in an interview with CNBC, demand for such advanced packaging is growing at a compound annual growth rate (CAGR) of 80%.
Friday 10 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government to establish an IC testing facility, which could become the company's second overseas backend semiconductor site outside South Korea after China. Bloomberg also reported that Samsung is planning a phased investment of about US$4 billion in Vietnam, underscoring its continued expansion in Southeast Asia.

Friday 10 April 2026
Samsung and SK Hynix reportedly secure long-term helium contracts with US firms

Industry sources report that the recent supply concerns over semiconductor-grade helium triggered by the US-Iran conflict have eased, as Samsung Electronics and SK Hynix secured long-term contracts ensuring stable access to the critical gas.

Friday 10 April 2026
Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials market long dominated by major US and Japanese players. Praise Victor Industrial (PVI), specializing in polyurethane (PU) material technology and operating three main product lines — semiconductor polishing pads and consumables, medical and sports products, and eco-friendly adhesives — counts Semiconductor Manufacturing International (SMIC), Nexchip, TSMC, UMC, and Micron among its customers. The company plans to go public in May 2026.
Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible revenue impact. Cloud AI vendors are also hoping that adopting SiPh will simultaneously improve both cost efficiency and computational performance limits.
Thursday 9 April 2026
Hon Precision sees surging demand for AI infrastructure components
Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement and semiconductor test-equipment supply chains worldwide. The company's expanding orders for co-packaged optics, satellite communications, and AI accelerator testing equipment point to elevated capital spending across cloud providers.