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Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth memory (HBM), chiplet architectures, and multi-layer 3D stacking on advanced production lines.
Sunday 5 July 2026
AI, HPC test interface demand drives CHPT June revenue to new monthly high

Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive monthly revenue record as demand from the market remained strong. The company also posted record quarterly revenue in both the first and second quarters of 2026, underscoring its sustained growth momentum.

Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence (AI) and high-performance computing workloads increase demand for silicon photonics and co-packaged optics in data centers.
Saturday 4 July 2026
Infineon wins fourth German patent ruling against Innoscience, as GaN fight flares in Shanghai
Germany's District Court Munich I ruled on July 3 that Innoscience infringed Infineon Technologies' gallium nitride (GaN) patents, barring the Chinese chipmaker from importing, selling, or marketing the affected products in Germany and ordering it to pay damages.
Saturday 4 July 2026
Machvision's June revenue hits another record due to AI demand
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
Saturday 4 July 2026
TSMC's median pay trails four smaller IC design houses, filings show

Fabless chip designers dominate the upper ranks of Taiwan's newly disclosed non-managerial employee pay data for fiscal year 2025, with only two capital-intensive manufacturers — TSMC and memory-testing equipment maker Phison — breaking into the top tier typically reserved for asset-light IC design houses.

Saturday 4 July 2026
Samsung and SK Hynix seek substrate price cuts for the second half of 2026
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in a Super Cycle. According to ET News, the talks have intensified pressure across the supply chain as raw material costs stay high and substrate makers warn of margin erosion.
Friday 3 July 2026
South Korea bets on southwest semiconductor cluster, but key hurdles remain
South Korea on June 29 unveiled a large-scale investment plan for the country's Honam region in the southwest, which mainly covers the city of Gwangju and North and South Jeolla provinces, including semiconductor clusters for Samsung Electronics and SK Hynix, AI data centers, and regional infrastructure. The plan is seen as a key move by the South Korean government to respond to surging AI chip demand, excessive industrial concentration in the Seoul capital area, and pressure for balanced regional development.
Friday 3 July 2026
Intel takes aim at TSMC's CoWoS lead with EMIB-T
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
Friday 3 July 2026
How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now spawning a "second fleet."

Friday 3 July 2026
Wistron chair urges Taiwan to shift beyond manufacturing mindset in AI era

Wistron chairman Simon Lin said artificial intelligence (AI) is improving the quality of professional talent, noting that tasks that previously required 100 people may now be completed by as few as four or five. As a result, AI can help address labor shortages caused by declining birth rates, while also creating value at different levels.

Friday 3 July 2026
India and Japan deepen economic security ties at New Delhi summit
Japanese Prime Minister Sanae Takaichi held her first summit with Indian Prime Minister Narendra Modi in New Delhi on July 2, during a three-day visit that both governments framed as the next step in a long-running partnership.
Friday 3 July 2026
Samsung escalates South Korea buildout: maps fresh US$90 billion chip, display, battery push in central region

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials in South Korea's central Chungcheong region.

Friday 3 July 2026
Infineon opens Dresden chip plant ahead of schedule, boosting global supply capacity
Infineon has opened its new Smart Power Fab in Dresden ahead of schedule, adding capacity for chips used in AI data centers, electric vehicles, renewable energy, and industrial systems. The move expands Europe's semiconductor base, strengthens supply chains, and could affect technology markets far beyond Germany and the continent.
Friday 3 July 2026
Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia

Anthropic is exploring a custom AI chip and has held talks with Samsung Electronics as a potential manufacturing partner, joining OpenAI, Google, Amazon, Microsoft and Meta in the race to control AI infrastructure.

Friday 3 July 2026
TSMC wins approval for US$20 billion Arizona expansion
Taiwan's Department of Investment Review (DIR) under the Ministry of Economic Affairs (MOEA) has approved Taiwan Semiconductor Manufacturing Company's (TSMC) US$20 billion capital injection into its US subsidiary TSMC Arizona.
Friday 3 July 2026
Seoul seeks Kumamoto's chip playbook, but Japan's model isn't easy to copy

As South Korea moves to accelerate a new semiconductor cluster in the country's southwest, ruling-party officials have returned to one comparison: Kumamoto.

Friday 3 July 2026
Chinese power chip price hikes lift Taiwanese suppliers
Inflationary pressures are hitting the semiconductor supply chain in 2026 as Chinese power device makers raise prices, while Taiwan-based firms say their flexibility, quality, and service advantages are becoming more visible as the search for non-China supply chains gains momentum.
Friday 3 July 2026
Innoscience says Infineon removed disputed GaN products from Shanghai trade show after patent challenge
Chinese gallium nitride (GaN) chipmaker Innoscience said on July 2 via its official WeChat account that certain GaN products from Infineon Technologies displayed at electronica China 2026 were covered by an ongoing patent dispute and had already been barred from sale under a Chinese court ruling. According to Innoscience, after its representatives identified the products during the exhibition and raised objections, the disputed exhibits were removed from Infineon's booth.
Thursday 2 July 2026
Samsung courts AI chipmakers with 2nm roadmap amid firming foundry demand

Samsung Electronics used its annual foundry ecosystem event on July 1 to signal that its contract chipmaking business is regaining momentum, laying out a longer-term manufacturing roadmap alongside signs of firmer near-term demand.

Thursday 2 July 2026
Infineon closes ams OSRAM sensor acquisition, adds EUR230 million in annual revenue
Infineon Technologies completed its acquisition of the non-optical analog and mixed-signal sensor portfolio from ams OSRAM on Tuesday, expanding its position in automotive and industrial sensing and adding roughly 230 employees across three new locations.
Thursday 2 July 2026
Fujifilm India signs MoU to assess semiconductor materials manufacturing in Gujarat

Fujifilm India said it has signed a memorandum of understanding with the Gujarat State Electronics Mission, under the Department of Science and Technology of the Government of Gujarat, to explore opportunities for manufacturing semiconductor materials in India and strengthening domestic supply chain capabilities.

Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip scaling beyond the limits of today's semiconductor designs, as the industry searches for ways to improve performance after decades of shrinking transistor dimensions.

Thursday 2 July 2026
GaAs and InP price hikes hit Taiwan supply chain
Compound semiconductor epitaxy makers are raising prices again for gallium arsenide (GaAs) and indium phosphide (InP) epi wafers, as persistent raw material cost increases, supply chain shortages, and inflation continue to weigh on the industry. Taiwanese suppliers warn that output in the second half of the year remains tied to material restrictions.
Thursday 2 July 2026
Taiwan eyes 2028 carbon trading market launch, but experts warn of risks and timing

Taiwan plans to launch an emissions trading system (ETS) in 2028 as the next phase of its carbon pricing framework — a cap-and-trade market where companies buy and sell permits to emit greenhouse gases. However, environmental researchers and academics caution that the experiences of Japan, South Korea, and the European Union (EU) show that emissions trading markets take years to mature and operate effectively. With Taiwan's own carbon fee only recently taking effect, they argue the government should prioritize policy continuity and give businesses time to internalize carbon costs and implement decarbonization strategies before introducing a cap-and-trade regime.