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Tuesday 13 October 2026
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools, reinforcing China's chipmaking self-sufficiency efforts. The partnerships coincide with Hua Hong's ambitious 2030 market-share targets for specialty processes, including embedded flash memory, power management, and image sensors.
Tuesday 13 October 2026
Malaysian states team up to back homegrown chip firms
The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a MYR150 million vehicle to accelerate the growth of Malaysian semiconductor and advanced technology companies, Bernama reported on October 10, 2026.
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower) is seeking financial contributions from major industrial customers, including TSMC, to support dedicated power plant development.
Tuesday 13 October 2026
India's Kaynes Semicon seeks foreign partners as its Gujarat chip plant ramps up
Kaynes Semicon, the chip packaging arm of Indian electronics maker Kaynes Technology, is calling for foreign semiconductor companies to form joint ventures in India, as its executives point to India's lack of expertise in key packaging materials just as output at its first plant begins to scale.
Tuesday 13 October 2026
Applied Materials opens R&D center to speed chipmaking for the AI era
Applied Materials has opened its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, positioning the Silicon Valley site as a new hub for semiconductor research and manufacturing development. The company expects spending at the facility to rise over time to about US$5 billion as customer projects ramp up, underscoring how AI demand is reshaping the chip equipment industry.
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's production capacity. Some customers are seeking to extend contracts to three years or longer.
Tuesday 13 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
The AI buildout is still lifting Taiwan's server supply chain faster than almost any other industry, yet September's filings show the lift concentrating into fewer hands. The 49 listed Taiwanese companies tracked across the AI server chain reported combined September revenue of NT$2.95 trillion (US$92.35 billion), up 55.0% from a year earlier and 3.8% from August. Strip out Hon Hai Precision Industry, and the same group's September revenue fell 6.8% from August. For the first nine months, the group has booked NT$21.39 trillion, up 53.9% year-on-year.
Tuesday 13 October 2026
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge to the established foundry model is pivoting toward a more pragmatic industrial path, according to DIGITIMES analyst Luke Lin.
Tuesday 13 October 2026
Terafab and beyond: Musk's push to fuse silicon, robotics, space into one AI system
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration across his expanding industrial stack.
Tuesday 13 October 2026
Samsung to pay chip workers special bonuses in stock, pending shareholder approval
Samsung Electronics plans to pay its semiconductor employees special bonuses entirely in company shares in late March or early April 2027, with two-thirds of the stock subject to selling restrictions for up to two years. The payments, funded by 10.5% of the chip division's operating profit, remain subject to shareholder approval.
Tuesday 13 October 2026
Nan Pao sees breakthroughs in adhesives for semiconductors, foldable displays
Nan Pao Resins Chemical reported September revenue of NT$2.308 billion (US$72.35 million), up 16.5% year-over-year and a record for the same period, as it continued to develop new products and applications, win new customers, and raise its market share. Revenue for the first nine months of 2026 reached NT$19.345 billion, up 12.0% from the same period in 2025 and also a record for the period.
Monday 12 October 2026
Microsoft's Maia 300 rack: 96 accelerators, HBM4, mostly liquid-cooled
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up to 12,288 accelerators into a single superpod. The company says the system is built for cloud-scale agentic inference, and that it co-designed the software, silicon, rack infrastructure, networking, and data centers to run as one platform.
Monday 12 October 2026
How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker
Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially. For global airborne molecular contamination (AMC) filtration leader Ye Siang Enterprise, that demand is now showing up in record revenue.
Monday 12 October 2026
Largan signals early peak-season cut, challenging phone chips in 4Q26
Largan chairman and CEO Adam Lin said October 2026 orders are tracking at roughly the same level as September's, but will begin declining in November as customers cut their forecasts after new phones went on sale. The comments signal that demand across the smartphone supply chain will weaken in the fourth quarter of 2026, creating challenges for handset chipmakers and other suppliers that performed strongly during the third quarter.
Monday 12 October 2026
Sumitomo Bakelite expands packaging material production across Singapore, China
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately triple that for compression-molding granules.
Monday 12 October 2026
HTSI September revenue surges 150% as AI chip testing demand accelerates
Hermes Testing Solutions (HTSI) reported September revenue of NT$514 million (US$16.10 million), up 2.35% month over month and 150.33% year over year, as shipments of customized products, membrane probe cards and cleaning materials increased. The wafer testing solutions provider said the results reflected rising demand for advanced testing capabilities supporting artificial intelligence (AI) and high-performance computing (HPC) chips.
Monday 12 October 2026
South Korean startup Helios targets Taiwan supply chains and Taiwan Strait risk analysis
As US defense procurement restrictions and European Union (EU) supply-chain due diligence requirements advance, South Korean risk-intelligence startup Helios is targeting verification needs in Taiwan and South Korea's AI, semiconductor, and defense industries. The company plans to bring public-information analysis and on-site verification services to Taiwan while strengthening maritime-threat analysis around the Taiwan Strait for corporate and national-security applications.
Monday 12 October 2026
Taiwan exports soar as shipments to the US top US$200 billion in first nine months
Taiwan's exports hit a single-month record high of US$87.22 billion in September 2026, lifting the year-to-date total for the first nine months of the year to US$661.55 billion, according to customs import and export statistics released by Taiwan's Ministry of Finance (MOF) on October 8. Exports to the US totaled US$207.78 billion in the first nine months, a level the ministry called "unprecedented."
Monday 12 October 2026
Taiwan semiconductor industry eyes landmark geothermal power deal exceeding 20MW
Taiwan's geothermal energy market could be approaching a major breakthrough as the semiconductor industry seeks new sources of reliable renewable electricity amid surging AI-driven power demand.
Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys, on October 5. The partnership aims to expand its potential customer base by helping companies develop custom chips.
Monday 12 October 2026
SK Hynix's US$299 billion chip plan faces military base hurdle
SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production capacity: the planned manufacturing site includes military facilities used by US forces, complicating construction timelines as competition intensifies with Micron Technology and Chinese chipmakers.
Monday 12 October 2026
Samsung, SK Hynix accept ASML's 10% price hike in parts, report says
Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries starting in January 2027, The Elec reported on October 11, citing industry sources.
Monday 12 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into focus.
Monday 12 October 2026
Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising for co-packaged optics (CPO) and related transition technologies, with more profitable optical testing expected to help double optical communications revenue by 2027.
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production base for semiconductor package substrates used in artificial intelligence (AI) applications.