Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting from the fab to the materials that feed it.
Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit by chip inflation. Despite the worsening profitability, DX chief Tae-Moon Roh is responding with a strategy centered on expanding market share.
JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance computing lifting capacity utilization and accelerating the shift toward higher-value advanced packaging.
Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus as a next-generation packaging technology that converts traditional round wafer formats into rectangular panels, offering potential gains in both production efficiency and cost.
The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.
Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec Mechanical Engineering, a subsidiary of Kenmec Group, has seen its order backlog surge to nearly NT$6.661 billion (approx. US$209.1 million). Driven by this momentum, both the subsidiary and the group overall are on track to hit historic highs in revenue and order intake in 2026.
Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.
One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.
Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.
