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Wednesday 19 August 2026
Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based alternatives on a tokens-per-second-per-user basis.
Wednesday 19 August 2026
Socionext taps Intel 18A-P process for high-performance compute chiplet development
Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and CoPoS have emerged as the two hottest keywords, while glass-based technologies remain further ahead on the roadmap.
Wednesday 19 August 2026
NSTC's unmanned vehicle revenue tops 40% as semiconductor AOI and CPO fuel growth
Optical imaging technologies company New Smart Technology (NSTC) is moving beyond traditional optical and image inspection into semiconductor high-end automated optical inspection (AOI), co-packaged optics (CPO) optoelectronic modules, and unmanned vehicle vision systems, with a clear change in its revenue structure, according to chairman Stone Shih and president Phil Chen.
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.

Wednesday 19 August 2026
Modi to inaugurate Semicon India 2026 as government courts global chipmakers
Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi, with the three-day event running through September 19 under the theme "Silicon to Systems: Building the Ecosystem," according to ETV Bharat and the Statesman.
Wednesday 19 August 2026
Rattled supply chains: Over half of Taiwan firms feel the squeeze of US-Iran conflict

More than half of Taiwanese companies surveyed by TAITRA reported being negatively affected by the US-Iran conflict, with rising costs emerging as the biggest concern as geopolitical tensions disrupt energy, raw material, and supply chain conditions.

Wednesday 19 August 2026
Samsung and SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term financial instruments by the end of the second quarter of 2026 as AI-driven memory demand lifted prices, revenue, and profit. The surge has shifted attention from earnings growth to how South Korea's two largest memory chipmakers will deploy their expanding financial firepower.

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned by Mercury in the Juan National Industrial Complex in Incheon, South Korea. The site, covering 221,683 square feet, will become Hanmi Semiconductor's eighth and largest production base.

Wednesday 19 August 2026
Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed Shikhar Malhotra as its chairman, according to tele.net.in. Malhotra, who also chairs HCL Capital and serves on the board of HCL Corporation, will lead the venture as it works toward commissioning its outsourced semiconductor assembly and test (OSAT) facility in Jewar, Uttar Pradesh.

Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue

Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to DRAM, NOR flash and controller names.

Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early commercial milestone as it expands into chip packaging.

Tuesday 18 August 2026
Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end assembly.

Tuesday 18 August 2026
Daxin Materials accelerates semiconductor push with 12 products in mass production
Daxin Materials is expanding its semiconductor footprint, with semiconductor materials accounting for nearly 23% of revenue in the second quarter of 2026. The company expects the segment to reach 25% to 26% of full-year revenue, driven by 12 products already in mass production and a further 14 under customer validation.
Tuesday 18 August 2026
South Korea's Gwangju chip hub faces looming water crunch as experts push underground storage and AI management
Samsung Electronics and SK Hynix are preparing to invest in four memory fabs in southwestern South Korea, but alongside power infrastructure, the semiconductor industry's uninterrupted demand for water is emerging as another major burden on the region.
Tuesday 18 August 2026
AI drives power semiconductors into at least a two-year shortage
The cloud AI data center boom is not close to bursting, according to chip supply-chain players. They say that analog ICs, including power semiconductors, will stay tight for years. They also expect price hikes to continue, with more than one round likely ahead.
Tuesday 18 August 2026
South Korea-India venture Indichem targets semiconductor materials supply chain without China
A new joint venture between South Korean and Indian chemical firms is betting that semiconductor materials can be made without touching China at any stage, positioning itself as an alternative supply route just as the US-China conflict pushes chipmakers to rethink where their raw materials come from.
Monday 17 August 2026
SK keyfoundry expands 8-inch capacity as China demand strains supply

SK keyfoundry has approved KRW90 billion (approx. US$64 million) in capital spending to expand its 8-inch foundry capacity, a rare move for a company that has long prioritized maintaining existing production lines.

Monday 17 August 2026
TSMC overseas fabs see profit flip in 1H26, Arizona surges 663% YoY

Since 2020, when TSMC began its overseas manufacturing buildout, the company has tracked financial results at its foreign subsidiaries across the first half of 2025, full-year 2025, and the first half of 2026. The Arizona fab, long seen as difficult to make profitable, has expanded sharply, while Japan's JASM has turned from loss to profit, China operations have remained stable, and Germany's ESMC is still in the red as it remains under construction.

Monday 17 August 2026
China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing base in Changzhou, expanding beyond VCSELs into high-end indium phosphide, or InP, laser chips for AI optical interconnects.
Monday 17 August 2026
TSMC and Micron boom drives Taiwan 'fab five's 1H26 profits

TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for Taiwan's fab engineering players — including UIS, MIC, L&K Engineering, YKE and Acter. Together, these five companies, which design and build the specialized facilities and infrastructure that chipmakers rely on, make up what the industry calls the "fab five." With expanding reach into the US, ASEAN and Singapore, the "fab five" have maintained high order backlogs.

Monday 17 August 2026
Fallout from Wingtech's Nexperia rupture: the price of rebuilding China's chip supply chain

Wingtech is entering a sharply different phase after dismantling much of its product-integration business and losing effective control over parts of Nexperia's overseas operations. The Chinese technology group posted a steep first-half revenue contraction and swung to a loss, while legal disputes in the Netherlands and Singapore now complicate its effort to rebuild around semiconductors and a more China-centered supply chain.

Monday 17 August 2026
Tata succession clouds outlook for chips, clean energy, data centers

Tata's leadership transition may shape the pace of one of India's biggest industrial bets. The group's planned spending on chips, clean energy, and AI data centers is entering a critical stage, but a shift toward tighter capital discipline could slow expansion and alter priorities worldwide.

Monday 17 August 2026
WaveSplitter returns to profit as AI optics demand lifts 1H revenue

WaveSplitter posted NT$477 million (US$14.95 million) in consolidated revenue in the first half of 2026, up 47% from a year earlier, and returned to profit as demand from AI data centers and the broader market lifted shipments of high-speed optical communications products. Net profit attributable to the parent company reached NT$6.16 million, compared with a loss in the same period of 2025, while earnings per share came to NT$0.19.