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Monday 3 August 2026
Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography
Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme ultraviolet systems, offering a new route beyond ASML's EUV architecture.
Monday 3 August 2026
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.
Monday 3 August 2026
MA-tek sells Shanghai unit, expands AI market push in Japan and the US

MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.

Monday 3 August 2026
AI infrastructure orders extend PCB expansion race
Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL) materials are already in short supply, and land, plant space, and machinery are also becoming scarce resources.
Monday 3 August 2026
Renesas plans to phase out Takasaki factory production and expand R&D focus

Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.

Monday 3 August 2026
xLight bets on EUV light source, eyes ASML deal
The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization stress and manufacturing costs. xLight says it aims to ease that pressure by reinventing light transmission and turning it from a single-machine function into a utility-scale service.
Monday 3 August 2026
TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant, Sony, and other local semiconductor facilities.
Monday 3 August 2026
MA-tek sells 80% stake in Shanghai subsidiary to accelerate global expansion
Semiconductor testing company Materials Analysis Technology (MA-tek) approved the sale of an 80% stake in its Chinese subsidiary MA-tek Technology Testing (Shanghai), as it moves to accelerate its global footprint in the US, Japan, Europe, and Southeast Asia. The transaction is expected to complete all procedures and close by the end of 2026.
Monday 3 August 2026
Apple says advanced-node capacity tightens amid 2nm race

Apple reported its best-ever third-quarter results for fiscal 2026, but its guidance for the fourth quarter showed much slower growth than in the prior quarter. CEO Tim Cook said the shortage of advanced-node capacity for mobile SoCs is the biggest limit on the company's expansion.

Monday 3 August 2026
Taiwan manufacturing business climate improves in June, headlined by electronics sector
Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research (TIER), which released its individual industry business climate indicators for June on July 31.
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.

Monday 3 August 2026
Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.

Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.
Monday 3 August 2026
Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After previously urging Apple, AMD, Nvidia and Qualcomm to support Intel Foundry as part of a broader US manufacturing revival, Gelsinger is now backing xLight, a start-up seeking to challenge one of ASML's most entrenched advantages in extreme ultraviolet (EUV) lithography.
Monday 3 August 2026
Samsung's GaN rumored setbacks threaten foundry launch, leaving it racing to close reliability gap
Samsung Electronics' gallium nitride (GaN) foundry effort has reportedly suffered another setback, with high-temperature reliability failures potentially pushing mass production into 2027. The delay follows earlier problems securing device customers and abandoning a government-backed project, underscoring the technical and strategic challenges of entering a market already served by established rivals.
Monday 3 August 2026
Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices
AI-driven chip shortages, rising memory costs and intensifying foundry competition dominated the technology sector, with Intel reviving DDR4 platforms, Qualcomm raising prices, Samsung challenging TSMC at 2nm and Beijing accelerating domestic chip adoption. Below are the most-read DIGITIMES stories from the week of July 27- August 2, 2026.
Monday 3 August 2026
Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer manufacturing, while giving SK Group additional resources for its AI semiconductor strategy. The deal also highlights how rising AI demand is reshaping wafer valuations, investment priorities, and industry consolidation.
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design tools, packaging facilities and AI infrastructure investments, aiming to strengthen domestic capabilities and reshape global technology supply chains.

Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions provider. FICG also signed an MOU with JTC, Singapore's government agency for industrial master planning and infrastructure development.
Sunday 2 August 2026
Memory costs overtake smartphone chip costs as SoC shipments are set to fall 14%
Memory costs have moved ahead of smartphone system-on-chip (SoC) costs, and Counterpoint Research said the shift was already reshaping handset pricing and demand. The research firm expects global smartphone SoC shipments to fall 14% in 2026, with the entry-level segment taking the biggest hit and declining by more than 30%.
Sunday 2 August 2026
ESMT posts record second-quarter profit on higher contract memory prices
Elite Semiconductor Microelectronics Technology (ESMT) reported a record second-quarter 2026 profit as contract prices rose for niche memory products, lifting results sharply from the previous quarter and a year earlier. The Taiwanese chipmaker said net income reached NT$5.908 billion, while earnings per share hit NT$20.21, both all-time highs.
Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in high-value products, new technologies and AI-related initiatives.
Saturday 1 August 2026
Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned medicine, electronics, DRAM and foundry manufacturing. His life traced nearly 30 years of booms and busts in Taiwan's memory and semiconductor industries.

Saturday 1 August 2026
Posiflex revenue rises 46% in the second quarter on Europe and Asia demand
Posiflex Technology reported a sharp sequential rebound in the second quarter of 2026, with consolidated revenue climbing 46% to NT$5.183 billion (US$160.3 million). The industrial PC maker said net profit after tax increased 58% from the prior quarter to NT$467 million, or NT$4.34 per share, even as higher memory and CPU costs weighed on margins.
Saturday 1 August 2026
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest, and ASE are sharing the stage with Microsoft, Nvidia, and Google.