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Thursday 17 September 2026
Taiwan to pilot ETS by end-2026, experts urge three safeguards

Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor and technology manufacturers align with international systems. Ministry of Environment adviser and former deputy environment minister Wen-Chen Shih said the ETS design must address three key areas.

Thursday 17 September 2026
20 of China's OSATs push into advanced packaging amid EUV curbs
China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's largest outsourced semiconductor assembly and test (OSAT) suppliers to specialist packaging houses and chiplet startups, increasingly targeting AI and high-performance computing (HPC).
Thursday 17 September 2026
Samsung reportedly starts Tesla chip trial production at Taylor fab

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving the US fab into 2nm wafer production and yield verification ahead of full-scale operations.

Thursday 17 September 2026
TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain

Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion (US$73.1 million) production plant in the Poseung District of Pyeongtaek, Gyeonggi Province.

Thursday 17 September 2026
Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows
Taiwanese machine tool manufacturers are taking part in two major manufacturing trade shows in Europe and the US this September. The participation reflects a shift in Taiwan's machine tool industry from supplying standalone equipment and components toward integrated processes and smart manufacturing solutions.
Thursday 17 September 2026
Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek. MediaTek has also stated during an earnings call that EMIB-T yields have reached levels capable of supporting stable mass production, expressing confidence in the project's 2027 production plans.
Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA) device development path for advanced process nodes below 3nm that does not rely on extreme ultraviolet (EUV) lithography as its core technology.
Thursday 17 September 2026
Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened on September 17, Lam Research, Applied Materials, and Fujifilm announced India plans worth a combined INR144 billion (US$1.50 billion), covering silicon components, chip equipment, and process chemicals rather than chip production itself.

Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated power systems. Its strategy for the next decade centers on improving power density: delivering more power in less space while managing heat, efficiency, and reliability.

Thursday 17 September 2026
Fujifilm to invest US$83 million in semiconductor materials plant in India

Japan's Fujifilm plans to set up a greenfield semiconductor materials manufacturing facility in India with a total investment of approximately INR8 billion (US$83.33 million), the company said in a statement on September 16, 2026. Construction of the first phase is scheduled to begin in fiscal year 2026, with commercial production targeted for fiscal year 2028.

Thursday 17 September 2026
Applied Materials announces 10-year investment plan ahead of SEMICON India
US-based semiconductor equipment maker Applied Materials will invest INR36 billion (US$375 million)) in the Indian state of Karnataka over the next 10 years, Karnataka Industries Minister M B Patil said on September 15, 2026. The project, to be located in the Bengaluru Signature Business Park (BSBP) area, is expected to create around 1,000 jobs, according to Moneycontrol and PTI.
Thursday 17 September 2026
Lam Research plans US$1 billion India manufacturing expansion
Lam Research plans to invest INR100 billion (approx. US$1.04 billion) in India over the next several years, adding its first silicon component manufacturing facility in the country and expanding its advanced research and development operations.
Thursday 17 September 2026
SK Hynix shifts supply chain planning for AI capex boom

AI-driven capacity expansion is pushing up demand for semiconductor equipment, and SK Hynix is strengthening supply chain management for equipment and components while shifting to a longer-term strategy.

Thursday 17 September 2026
South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

South Korea's semiconductor boom is spilling over from corporate profits into government tax revenue. Corporate tax revenue for fiscal 2027 is projected to reach KRW216.7 trillion (about US$160 billion), up 113.9% from the 2026 supplementary budget, topping KRW200 trillion for the first time and, after 15 years, overtaking income tax as the country's largest tax source.

Thursday 17 September 2026
Charts: Taiwan's chip packaging growth runs deeper than ASE

Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked by DIGITIMES posted combined January-August 2026 revenue of NT$768.9 billion (approx. US$24.1 billion), up 27.1% from a year earlier. Without ASE Technology Holding, the rest of the group still grew 25.4%.

Thursday 17 September 2026
TSMC's C.C. Wei says to solve problems, put customers first
TSMC chairman C.C. Wei and co-COO Y.J. Mii joined a forum on September 15, 2026, where Wei shared lessons from school, R&D and corporate management with National Taiwan University students via video, while Mii led a deeper discussion on advanced process technology and AI tools.
Thursday 17 September 2026
Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.

Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

Wednesday 16 September 2026
Taiwan, South Korea should stop comparing, says DIGITIMES chairman

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve their semiconductor and manufacturing advantages has become a focal point. DIGITIMES and IC975 chairman Colley Hwang said the two sides should look for complementary strengths, work together to help Vietnam, Malaysia, and other countries develop, and first increase corporate exchanges to build a positive environment for cooperation.

Wednesday 16 September 2026
India's Eastern state clears SiCSem's SiC unit in SEZ
The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar, a project with an investment of INR34.06 billion (US$355 million) and expected to employ about 1,270 people directly.
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser, and higher-performing, bolstering the value of the advanced packaging end of the chip process.
Wednesday 16 September 2026
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and Answers for the AI Era" forum on September 15.
Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon photonics testing is shifting from component-performance verification toward wafer-yield protection and earlier risk screening.

Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market. Samsung's share of the global smartphone AP market rose to 9% in the second quarter of 2026, up 2 percentage points from the previous quarter and 3 percentage points from a year earlier, marking a second straight quarterly increase.

Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive focus for supply chains in the US, Japan, South Korea, Taiwan, and China. Players are now positioning themselves around four key steps — glass materials, via drilling, via metallization, and multilayer substrate lamination — to capture opportunities for 2027 and 2028.