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Wednesday 15 July 2026
JCET forecasts higher first-half profit on AI-driven chip demand
China's JCET expects stronger first-half earnings as global demand tied to artificial intelligence (AI) infrastructure lifts semiconductor activity. The outlook signals continued momentum in chip packaging and testing, a sector closely watched by investors because it reflects broader technology spending trends that affect supply chains across Asia, the US, and Europe.
Wednesday 15 July 2026
Intel qualifies High-NA EUV for Panther Lake; ASML preps TSMC and Samsung for next wave
ASML confirmed on July 15 that Intel Foundry has become the first company in the industry to ship a high-volume logic product manufactured using High-NA EUV lithography, marking a significant milestone in the commercial readiness of the Dutch equipment maker's most advanced lithography technology.
Wednesday 15 July 2026
SK Siltron begins 300mm wafer production at KRW2.3 trillion Gumi plant

SK Siltron has begun volume production and customer shipments from a KRW2.3 trillion (approx. US$1.54 billion) expansion of its Gumi wafer plant in South Korea, Newsis reported, as the company ramps up supplies of 300mm silicon wafers used to manufacture advanced memory chips.

Wednesday 15 July 2026
Tongfu Microelectronics forecasts sharp first-half profit rise on AI and memory demand
Tongfu Microelectronics said its first-half profit is likely to climb sharply, reflecting broader gains in semiconductor demand that could matter for global chip supply chains, AI infrastructure builders, and memory market watchers. The company pointed to stronger utilization, higher sales of mid- to high-end products, and investment returns as key drivers of the expected increase.
Wednesday 15 July 2026
AI drives memory shortage through 2027, PSMC lifts 2Q26 margin to 28%
AI-driven demand for memory, power management chips, and advanced packaging has continued to tighten supply and demand in the foundry market. Powerchip Semiconductor Manufacturing (PSMC) reported second quarter 2026 revenue of NT$17.291 billion (approx. US$537.8 million), up 27% quarter-over-quarter and 53% year-over-year, while gross margin jumped to 28%, up 18pp from the first quarter; operating margin reached 21%, turning positive from the same period in 2025, and net profit after tax came to NT$3.291 billion, an EPS of NT$0.76.
Wednesday 15 July 2026
PSMC lifts DRAM foundry prices 45% as 3D AI Foundry targets 20% revenue share
Major cloud service providers (CSPs) have front-loaded purchases of future DRAM capacity, and the global memory supply-demand gap is expected to last through 2027. Powerchip Semiconductor Manufacturing (PSMC) said on a July 14, 2026, online earnings call that it raised DRAM wafer start prices in July by about 45% from June, with the increase expected to flow into revenue and profit from November, while 8-inch and 12-inch logic foundry prices also rose 10-15%.
Wednesday 15 July 2026
Wingtech Technology warns of first-half 2026 loss amid control limits at Nexperia
Wingtech Technology said its first-half 2026 results are likely to swing to a loss, reflecting the impact of restricted control over its Nexperia unit in Europe. The outlook matters for global electronics supply chains, where any prolonged disruption at a major semiconductor supplier could affect customers, investors, and component availability worldwide.
Wednesday 15 July 2026
ASML raises 2026 sales outlook as AI-fueled logic and memory demand accelerates
Dutch lithography giant ASML reported total net sales of EUR9.3 billion for the second quarter of 2026, exceeding its own guidance, as customers accelerated capacity expansion plans amid continued AI-driven demand for advanced logic and memory chips.
Wednesday 15 July 2026
Jensen Huang's Akihabara visit honors partners behind Nvidia's 33-year rise
Nvidia CEO Jensen Huang is scheduled to attend an event in Tokyo's Akihabara district on July 15, marking the 30th anniversary of the partnership between Nvidia GeForce Japan and gaming company Sega. The appearance drawing the most attention will be Huang's reunion with former Sega president Shoichiro Irimajiri, turning the brief visit into what many have described as a journey of gratitude.
Wednesday 15 July 2026
Global semiconductor equipment sales set to hit record US$165.9B in 2026
Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association SEMI's mid-year forecast. This growth is expected to continue in the coming years as AI reshapes the chip industry's investment landscape.
Wednesday 15 July 2026
TYLSemi exits stealth with US$43M to accelerate open chiplet platform for custom AI chips

TYLSemi, a semiconductor startup founded by former executives of AlphaWave, the connectivity chip specialist acquired by Qualcomm, has emerged from stealth with US$43 million in early-stage funding to help companies develop custom AI chips through an open, chiplet-based approach.

Wednesday 15 July 2026
US becomes top helium source for Taiwan, South Korea and Japan as Qatari supply falters

The US has become the leading source of helium and other noble gases for Taiwan, South Korea and Japan as disruptions to Qatari production and China's temporary export ban reshape supply routes for materials used in semiconductor manufacturing, according to a Nikkei Asia analysis of customs data and related reporting.

Wednesday 15 July 2026
Intel sends its most advanced 18A node into orbit with Starfire space chip

Intel has unveiled Starfire, a space-grade processor that leverages its leading-edge 18A manufacturing process for satellites and other systems designed to survive beyond Earth's atmosphere. The move extends Intel's most advanced node — the centerpiece of its foundry turnaround — into a defense-and-space niche long dominated by specialist radiation-hardened suppliers. It stakes the design on a selling point that rivals cannot easily match: domestic US production.

Wednesday 15 July 2026
Tower Semiconductor bets on Japan to ride the AI data center shift from copper to light
Tower Semiconductor is placing a roughly US$3 billion wager that the artificial-intelligence buildout will force data centers to move data with light rather than electricity, anchoring the bet in Japan with backing from Tokyo.
Wednesday 15 July 2026
Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace, but one that masks sharply divergent performance beneath the surface.
Wednesday 15 July 2026
South Korea moves to secure power for new chip cluster

South Korea is accelerating plans to supply electricity to a new semiconductor cluster in the country's southwest by 2030, potentially expanding the domestic energy-storage market as chip fabs and AI data centers add to power demand.

Wednesday 15 July 2026
China's 1H26 IC exports jump 96% on AI hardware demand
China's IC exports surged in the first half of 2026, underscoring strong demand for AI, data center, and HPC hardware that lifted electronics supply-chain momentum. The General Administration of Customs said on July 14 that IC exports reached US$177.28 billion in the first half of 2026, up 96.1% year-over-year.
Tuesday 14 July 2026
Treading the market slowdown: IT panel demand cools as Taiwan display makers pivot to AI

As early inventory stocking by brand customers winds down, China's 618 Shopping Festival delivers weaker-than-expected sales, and LCD TV panel prices begin to retreat, demand for monitor and notebook (NB) panels is cooling in the third quarter. Despite the slowdown, panel makers remain reluctant to cut prices amid elevated production costs, and IT panel prices are expected to remain flat in July as buyers and suppliers enter a period of pricing negotiations.

Tuesday 14 July 2026
Six-inch SiC substrate price rebounds as supply tightens

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new orders becoming increasingly hard to absorb.

Tuesday 14 July 2026
Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx. US$110.62 million) to CNY850 million, up 231.16% to 275.31% from CNY226 million a year earlier, according to a forecast filed with the Shenzhen Stock Exchange. Diluted earnings per share are seen at CNY0.2290-0.2595, versus CNY0.0706 in the same period of 2025.
Tuesday 14 July 2026
Bosch starts sample production at its first US chip plant after securing up to US$225 million

German automotive supplier and chipmaker Bosch has begun sample production at its first US semiconductor factory after finalizing an agreement for up to US$225 million in federal funding. Commercial production of silicon carbide chips at the Roseville, California, site is expected to begin in 2026.

Tuesday 14 July 2026
Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel

US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.

Tuesday 14 July 2026
TSMC and Vanguard drive Taiwan's silicon foundry revenue up 54% YoY in June

Taiwan's silicon foundry industry posted a strong performance in June 2026, with aggregate revenue reaching US$15,131.2 million, up 5.9% from May and 54.0% from a year earlier — underscoring the sector's continued ride on AI and advanced-node chip demand.

Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneously bets on AI compute and storage.

Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.