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Thursday 26 March 2026
Innos set for late April listing on TPEx, riding advanced packaging boom
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications driving demand in the semiconductor industry, the probe card market is anticipated to grow rapidly, supporting strong revenue growth and sustained high gross margins for the company in 2026.
Thursday 26 March 2026
Arm's self-developed chip sparks cross-industry clash, TSMC-backed GUC faces impact
Arm has officially unveiled its first fully self-designed physical chip, the Arm AGI CPU, targeting data center mass production. The announcement came at the Arm Everywhere conference in San Francisco, sending shockwaves through an already fiercely competitive AI chip market.
Thursday 26 March 2026
Nuvoton and Tower agree on framework to restructure joint Japanese foundry operations
Nuvoton and Tower have agreed to restructure their joint Japanese operations, a move that could reallocate fabs and services and affect global semiconductor supply chains and customer relationships. The deal separates the partners' 12‑inch and 8‑inch businesses to sharpen strategic focus and ensure continuity across operations and customers worldwide.
Thursday 26 March 2026
SEMICON China opens with focus on AI chips and advanced packaging
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
Thursday 26 March 2026
Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul Economic Daily, citing data from the Financial Services Commission, Samsung plans to invest KRW465.4 billion (approx. US$308.8 million) in its Xi'an plant in 2025, a 67.5% increase over the KRW277.8 billion invested in 2024.
Thursday 26 March 2026
China's Naura and AMEC lead China's push into advanced chip packaging
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Thursday 26 March 2026
Analysis: Tesla's Terafab being near Samsung's Taylor fab illustrates Musk's strategy shift
Elon Musk recently announced the launch of the "Terafab" project, selecting Austin, Texas, as its first site, with plans to build a fully integrated semiconductor supply chain covering compute chips, logic chips, memory, packaging, and photomasks. While key details such as capital expenditure, production timelines, and partners remain undisclosed, the site's proximity to Samsung Electronics' Taylor fab has drawn intense market attention.
Thursday 26 March 2026
Nvidia and Emerald AI partner with utilities to build grid-responsive AI data centers
Nvidia and Emerald AI said on Tuesday that they are joining forces with a group of major US power producers — including AES Corporation, Constellation Energy, Invenergy, NextEra Energy, Nscale Energy & Power, and Vistra — to develop a new generation of "AI factories" designed to come online faster and operate as active participants in the power grid.
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions.
Wednesday 25 March 2026
Yesiang pioneers regenerative filters and CaaS subscription, eyes double-digit growth in 2026
Yesiang, a global leader in advanced process micro-contamination control filters, is set to enter a double-digit revenue growth trajectory by 2026 through its innovative regenerative chemical filters and Clean Air as a Service (CaaS) subscription model. Chairman and CEO James Chuang highlighted that with major wafer foundries aggressively expanding sub-2nm advanced processes, Yesiang's new regenerative filter product, slated for mass production in April, will strengthen the company's industry moat and drive significant revenue gains.
Wednesday 25 March 2026
Micron's Singapore expansion could trigger global transformer shortage and delay AI data centers
Micron Technology's planned Singapore expansion, driven by soaring AI memory demand, requires hundreds of transformers, signaling supply constraints that could affect global AI and semiconductor infrastructure timelines and costs for data-center buildouts, energy storage projects, and heavy electrical equipment suppliers, potentially reshaping procurement and construction schedules worldwide and logistics planning.
Wednesday 25 March 2026
ASML employees stage walkout against 1,700 job cuts
Over 1,000 employees at ASML's headquarters in Veldhoven, the Netherlands, staged a lunchtime walkout on March 24, 2026, to protest the company's plan to cut 1,700 jobs as part of an organizational restructuring. The layoffs represent about 3.8% of ASML's total workforce.
Wednesday 25 March 2026
Beyond TSMC: Colley Hwang reveals Taiwan's massive US$3 trillion tech ecosystem at AI Expo

While the world's attention often fixates solely on TSMC as the singular pulse of global technology, Colley Hwang, Chairman and founder of DIGITIMES, presented a much more formidable reality today at the opening of AI Expo Taiwan: a US$3 trillion electronic ecosystem that has become the indispensable backbone of the AI revolution.

Wednesday 25 March 2026
Denso proposes acquisition of Rohm to strengthen automotive and power control
Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a takeover. This move appears to show Denso's intention to strengthen its position in the automotive semiconductor and power control sectors.
Wednesday 25 March 2026
Samsung's 2nm yield surpasses 60%, tripling in 6-month span
Samsung Electronics has reportedly raised the yield of its 2nm wafer foundry process above 60%, a significant jump from around 20% in the second half of 2025. Industry analysts say this improvement not only cuts manufacturing costs but also boosts Samsung's chances of securing new orders.
Wednesday 25 March 2026
Taiwan plans national security law revisions after TSMC data breach involving former SVP
Following the case of former TSMC senior vice president Wei-Jen Lo taking sensitive company data, Taiwan's Ministry of Justice has proposed amendments to strengthen the National Security Act and close legal loopholes. The incident, involving alleged theft of TSMC's sub-2nm process technology and Lo's subsequent employment at Intel in the US, has been classified by the government as a violation concerning core national technologies.
Wednesday 25 March 2026
With Hua Hong partnership, STMicro builds 'China for China' supply chain
STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped to local customers, marking a significant step in the company's "China for China" strategy.
Wednesday 25 March 2026
Commentary: How Taiwan's chip talent flow is shifting—lessons from SMIC and Terafab
Tesla CEO Elon Musk has launched the "Terafab" 2nm wafer fab project and initiated a global recruitment drive targeting high-level semiconductor talent, including engineers from Taiwan. This move recalls the talent migration wave over 20 years ago when Richard Chang led a team to establish Semiconductor Manufacturing International (SMIC) in China.
Wednesday 25 March 2026
Analysis: Qualcomm restructures Asia operations, giving Taiwan greater strategic weight
At a spring banquet in Taiwan, Qualcomm used the occasion not only to recap highlights from its recent appearances at major industry exhibitions, but also to underscore the growing importance of 6G standards in an AI-driven era. More consequentially, ST Liew—Vice President of Qualcomm Technologies and President for Taiwan, Southeast Asia, and Australia/New Zealand—announced a structural shift: Qualcomm's Taiwan operations will be elevated into a standalone region, reporting directly to the APAC president, on par with markets such as Japan and South Korea.
Wednesday 25 March 2026
Broadcom expects optical communication supply chain capacity issues to ease by 2027
The Optical Fiber Communication Conference (OFC 2026) concluded on March 19, with Broadcom holding a media briefing to discuss the latest technologies and product announcements from the event. Addressing concerns about capacity bottlenecks across the optical communication supply chain, Broadcom acknowledged that many segments currently face tight supply conditions. However, the company noted that supply chain partners are actively expanding capacity, and more suppliers are joining the market. Broadcom projects that production capacity constraints will gradually be resolved by 2027.
Wednesday 25 March 2026
TSMC SVP Lora Ho to retire, set to join Acer as independent director
Acer is set to elect new board members at its 2026 shareholders' meeting, with Taiwan Semiconductor Manufacturing Company (TSMC) senior vice president Lora Ho included in the list of nominees for the new board. Industry observers expect her nomination to be approved at Acer's shareholder meeting on May 29.
Wednesday 25 March 2026
SK Hynix files for potential US listing and ramps EUV investment as AI demand accelerates
SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of a broader push to tap global capital markets.
Wednesday 25 March 2026
Arm unveils AGI CPU aimed at scaling agentic AI, promising higher rack performance and lower data center costs
Arm on March 24, 2026, announced the Arm AGI CPU, its first mass-produced chip product, designed specifically for AI data centers and built on TSMC's 3nm process. The company presented the chip as a response to accelerating demand for processors capable of handling agentic AI workloads at scale.
Wednesday 25 March 2026
Global semiconductor market rebounds in 2025 with AI-led expansion
According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above 20%. This follows a downturn in 2023 and reflects a strong AI-driven recovery. The data processing segment, led by companies such as Nvidia, recorded the fastest expansion, while all major end markets — including automotive, industrial, and consumer — returned to growth, pointing to a broad-based recovery rather than the uneven rebound seen in 2024.
Wednesday 25 March 2026
How one recycler firm turns TSMC's chip waste into steel mill gold
Every advanced chip leaves behind a chemical trail. The solvents, acids, and sludge generated in semiconductor fabrication are growing faster than the fabs themselves — and for most of the world, they remain an expensive, hazardous liability. In Taiwan, one company has turned that problem into a business.