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Tuesday 3 March 2026
Samsung reportedly moves up foundry break-even target to 2026
Samsung Electronics has reportedly brought forward the timeline for turning its foundry business profitable to 2026, accelerating an earlier target of 2027 and raising expectations that the long-struggling unit could soon become a new growth engine for the company's semiconductor operations.
Tuesday 3 March 2026
US Congress and industry clash over new semiconductor security mandates
The US House Foreign Affairs Committee has advanced legislation that would grant Congress the authority to review and block advanced chip sales to adversarial nations, mirroring the oversight typically reserved for arms deals. This move, alongside the proposed Chip Security Act, has sparked a sharp divide between national security hawks in Washington and semiconductor industry leaders regarding the future of American technological leadership and export control strategies.
Tuesday 3 March 2026
Rohm outsources back-end processes to India's Suchi Semicon
Rohm and Suchi Semicon have announced a strategic manufacturing partnership intended to strengthen semiconductor production capacity in India and support both domestic and international markets. The collaboration pairs Rohm's expertise in device technology and its global semiconductor presence with Suchi Semicon's back-end manufacturing capabilities and operational experience to create a reliable, scalable manufacturing framework responsive to changing industry requirements.
Tuesday 3 March 2026
Former TSMC executive under investigation for leaking core chip technology
Wei-Jen Lo, former senior vice president of corporate strategy development at TSMC, retired in 2025 and subsequently accepted an invitation from Intel to serve as executive vice president. Judicial authorities have officially launched an investigation and completed evidence collection regarding allegations that Lo leaked sensitive information. Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC), stated that after the incident, prosecutors consulted the Hsinchu Science Park Bureau to help verify that the sub-2nm process technology taken by Lo constitutes a national core key technology.
Tuesday 3 March 2026
US moves to bar federal purchases of China-linked chips

The US is moving to bar federal agencies from buying certain semiconductors tied to major China-based chipmakers, widening procurement restrictions even as memory shortages and rising prices strain electronics supply chains.

Tuesday 3 March 2026
Rapidus to partner with Canon on 2nm image-processing chips, raising supply and investment implications
Rapidus will co-develop 2nm image-processing semiconductors with Canon for cameras and surveillance devices, Nikkei reported, and will trial-produce chips at Rapidus's Chitose, Hokkaido, facility with Synopsys also participating.
Tuesday 3 March 2026
TSMC to lead SiPh equipment and materials localization in Taiwan
Taiwan President Ching-te Lai stated on March 2 that one of the government's core policy goals for 2026 is to boost the economy by fully promoting the country's AI major infrastructure projects. Silicon photonics (SiPh) is reportedly a key focus within this plan. Cheng-Wen Wu, chairman of the National Science and Technology Council (NSTC), confirmed that the government has decided to actively invest in localizing SiPh equipment and materials. TSMC has pledged to assist Taiwan's traditional industries in developing related equipment and materials, opening new opportunities for these sectors.
Tuesday 3 March 2026
MediaTek invests US$90M in SiPh startup Ayar Labs
MediaTek has announced that its holding company, Digimoc Holdings, will acquire 1,722,759 preferred shares of US-based silicon photonics (SiPh) startup Ayar Labs at US$52.24 per share, totaling approximately US$90 million. This investment represents about a 2.4% stake in Ayar Labs. Industry observers see this move not only as a foundation for deeper collaboration between MediaTek and Ayar Labs in the SiPh field but also as a strategic step for MediaTek to gain greater influence in the cloud AI ecosystem going forward.
Tuesday 3 March 2026
Nvidia invests in Lumentum to advance AI optics technology
Nvidia has announced a strategic partnership with Lumentum Holdings, accompanied by a US$2 billion investment aimed at boosting US-based manufacturing and R&D for advanced optics technologies. The deal includes multiyear purchase commitments and access rights to next-generation laser components, with a focus on accelerating development for AI data centers.
Monday 2 March 2026
Renesas names new India president to accelerate growth amid fierce engineering talent competition
Renesas has named two senior executives to lead its businesses in India and China, moves the company says are intended to accelerate growth in those markets.
Monday 2 March 2026
Trade tensions deepen Nvidia and TSMC's strategic grip on AI infrastructure
As expected, Nvidia delivered another strong earnings beat for the fourth quarter of its fiscal 2026, reinforcing the view that global demand for AI computing remains resilient despite mounting geopolitical pressures. For the fiscal year, the company posted more than US$120 billion in profit with a gross margin of 71.1%, underscoring the extraordinary profitability of AI infrastructure even as export controls and trade tensions intensified during the first year of US President Donald Trump's administration.
Monday 2 March 2026
Google signs multibillion-dollar AI chip deal with Meta to escalate Nvidia rivalry
According to The Information, Meta has signed a multibillion-dollar, multi-year agreement to rent artificial intelligence chips from Google, marking a significant shift in the competitive landscape of AI hardware and signaling growing efforts by major technology companies to reduce dependence on Nvidia's dominant processors. Under the agreement, Meta will use Google's tensor processing units (TPUs) to train next-generation AI models, including future versions of its Llama systems. The deal expands Meta's computing options at a time when demand for AI infrastructure is surging and access to advanced chips has become a strategic constraint across the industry.
Monday 2 March 2026
Intel Foundry Chief joins Qualcomm; Chandrasekaran takes dual tech and fab role
Backed by the US government and positioned under a "Made in USA" mandate, Intel has seen another senior leadership change. In a surprise move, Kevin O'Buckley, head of Intel Foundry, is leaving after just two years to join Qualcomm.
Monday 2 March 2026
Huawei takes 8,192-chip Atlas 950 global, escalates AI data center fight with Nvidia

Huawei has unveiled its Atlas 950 SuperPoD at Mobile World Congress (MWC) 2026 in Barcelona, marking the first overseas showcase of its most advanced AI supercomputer and positioning it directly against Nvidia's AI data center systems.

Monday 2 March 2026
Rapidus raises US$1.7 billion to support 2nm mass production by 2027
Japan's state-backed chip venture Rapidus announced on February 27 that it has secured a total of JPY267.6 billion (about US$1.7 billion) in new funding from both government and private-sector investors, marking a key step in its push to mass-produce 2nm logic chips by 2027.
Monday 2 March 2026
Radiant Optoelectronics pursues AR and metalens growth, aims for 2028 breakthrough
Backlight module supplier Radiant Optoelectronics has invested over NT$10 billion (US$318.16 million) in acquisitions under company chairman Yu-Chao Wang's leadership while advancing three new business lines targeting future growth. Despite a 40% profit decline in 2025, the company remains committed to innovation and expects to ramp up new ventures through 2027 toward significant revenue contributions by 2028.
Monday 2 March 2026
Rohm integrates TSMC GaN process to scale production and meet AI server demand by 2027
Rohm has reached an agreement to integrate its internal development and manufacturing capabilities for gallium nitride (GaN) power devices with process technology from Taiwan Semiconductor Manufacturing Company (TSMC), with the goal of creating an end-to-end production system within the Rohm Group.
Monday 2 March 2026
Meta reportedly scraps advanced in-house AI chip, deepens reliance on Nvidia and AMD

Meta's push to design its own AI chips has reportedly hit major technical and strategic setbacks, forcing the company to scrap its most ambitious in-house training processor and lean more heavily on external suppliers, according to The Information.

Monday 2 March 2026
Arizona in the black: a milestone for TSMC—and Washington

Taiwan Semiconductor Manufacturing Co. (TSMC) has reached a critical financial turning point in its high-stakes expansion into the American desert, reporting the first-ever annual profit for its Arizona subsidiary.

Monday 2 March 2026
Commentary: Nvidia sparks silicon photonics race, yet copper still anchors data centers?
As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and power consumption as core bottlenecks in data transmission and switching, elevating the role of optical interconnects and silicon photonics (SiPh). With support from AI chip leader Nvidia, the notion of optics gradually replacing copper has moved to the center of industry debate.
Monday 2 March 2026
Weekly news roundup: semiconductor power shifts and AI momentum
Below are the most-read DIGITIMES Asia stories from the week of Feb 3 - Mar 1, 2026.
Monday 2 March 2026
India roundup: An emerging chip trio in Asia

A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise, and India's talent. Alongside this, companies including Foxconn, Polymatech Electronics, Nvidia, AMD, Kaynes Semicon, and IBM are deepening India investments, reflecting rising localization, supply-chain ambitions, and expanding AI, packaging, and materials ecosystems despite policy and trade uncertainties.

Monday 2 March 2026
TSMC bolsters local equipment supply chain with subsidies and five-year rebate program
TSMC is accelerating supplier upgrades and has made growing the share of Taiwan-sourced equipment components a long-term strategic objective. As of February 2026, it had worked with 12 suppliers across 22 continuous improvement processes (CIP) programs, halving validation and development timelines and generating NT$2 billion (US$63.7 million) in annual output value.
Sunday 1 March 2026
Taiwan's Fitipower eyes stronger year as AI and edge chips gain traction
Fitipower, a Taiwanese driver IC and semiconductor supplier, offered a cautiously optimistic outlook for 2026 during its February 25 investor briefing. Chairman Young Lin said the company expects full-year performance to surpass 2025, with growth increasingly coming from non-display IC applications, including AI SoCs and edge computing solutions.
Friday 27 February 2026
ASE's Tien Wu: betting on American trust in a divided chip world

In the high-stakes world of global semiconductors, where microscopic precision meets massive geopolitical shifts, Dr. Tien Wu stands as a rare figure: a leader who balances the exacting standards of a $22 billion tech giant with a deeply humanistic philosophy.