Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test times and the high cost of downstream failures raise the importance of screening optical engines before final package integration, according to Chroma ATE.
China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper advances in etching, thin-film deposition, cleaning, metrology, advanced packaging and core components.
