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Wednesday 7 January 2026
Apple reportedly locks in NAND through 2026 ahead of DRAM price spike
Apple has secured enough NAND flash memory to sustain production through the first quarter of 2026. But the iPhone maker is facing steep price increases for DRAM as artificial intelligence demand shifts leverage toward chipmakers, according to Morgan Stanley.
Wednesday 7 January 2026
Sigurd hits revenue highs on AI momentum, ramps up expansion with NT$6 billion capex plan
Benefiting from strong demand for artificial intelligence (AI) smartphones and AI servers, IC testing giant Sigurd Microelectronics announced that its December 2025 revenue surpassed NT$1.8 billion (approx. US$57.21 million). The figure not only marked a record high for a single month, but also propelled the company's fourth-quarter 2025 and full-year revenues to new all-time highs.
Wednesday 7 January 2026
TSMC's secret behind countering quake risks
TSMC sustained minor losses from the December 27, 2025, earthquake near Yilan, thanks to comprehensive seismic management implemented after the 1999 earthquake. These measures safeguarded costly equipment and support stable semiconductor output despite a magnitude 7.0 quake.
Wednesday 7 January 2026
TSMC names Gina Proctor Treasurer of Arizona subsidiary

TSMC appointed Gina Proctor as treasurer of its TSMC Arizona Corporation subsidiary effective January 6, 2026, according to a regulatory disclosure filed in Taiwan.

Wednesday 7 January 2026
Samsung speeds Pyeongtaek P5 fab toward 2028 output

Samsung Electronics is accelerating construction of its P5 semiconductor line in Pyeongtaek, South Korea, as it moves toward a 2028 production target. The project is a central component of the company's plan to expand memory production amid rising AI-driven demand. Samsung is currently mobilizing thousands of workers daily and has launched simultaneous bidding for utility infrastructure to compress the traditional build timeline.

Wednesday 7 January 2026
Taiwan seeks deeper Europen cooperation in 6G, smart manufacturing
As the Russia-Ukraine war continues into its fourth year, Taiwan is looking to strengthen its partnership with Europe. The government aims to expand cooperation across investment, scientific research, and trade.
Wednesday 7 January 2026
Column: US political economy enters new era of industrial revival and strategic decoupling
The global economic landscape underwent three major transformations in 2025: the Great Rebalancing, the evolution of the AI supercycle, and a US industrial revival driven by national security considerations.
Tuesday 6 January 2026
CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale production of 18A chips at Fab 52 in Chandler, Arizona, a milestone seen as critical to reviving its mobile PC business. The debut also served as a direct response to lingering market doubts over Intel's process-node execution, signalling renewed confidence in its next-generation manufacturing roadmap.​
Tuesday 6 January 2026
TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall
Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages, equipment maintenance, corporate culture, and labor laws as factors lagging behind Taiwan operations, with a sharp profit collapse expected by the third quarter of 2025.
Tuesday 6 January 2026
Honda delays China factory restart as Nexperia dispute continues to disrupt supply

Honda Motor said on January 5 that it would delay the reopening of three factories operated by its Chinese joint venture, GAC Honda, after a key automotive chip supplier, Nexperia, halted shipments. The restart, originally scheduled for January 5, has been pushed back two weeks to January 19.

Tuesday 6 January 2026
Samsung to restart construction of Pyeongtaek P5 chip plant

Samsung Electronics will resume structural construction at its Pyeongtaek P5 semiconductor plant next month. The company halted the project last year during a downturn in the memory market, but is now expanding capacity as demand for high-bandwidth memory (HBM) used in AI recovers.

Tuesday 6 January 2026
DCC Technology rebrands as Nexora, subsidiary targets military and aerospace
Field-programmable gate array (FPGA) designer DCC Technology recently held a shareholders' meeting and approved a company name change. After completing administrative procedures, the company officially announced its new name as Nexora. The name combines tech themes like "Next" and "Aurora" to signify "the next dawn," symbolizing a commitment to innovation built on a solid technical foundation while looking toward long-term industry development.
Tuesday 6 January 2026
China accelerates semiconductor self-sufficiency through foundry M&A: updates on Hua Hong, SMIC
China's semiconductor sector is entering a new phase of domestic consolidation, as leading foundries Hua Hong Semiconductor and SMIC move to tighten control over key manufacturing assets. The deals reflect Beijing's drive to localise chip production, strengthen mature-node capacity, and curb reliance on external supply chains amid sustained US-China technology tensions.
Tuesday 6 January 2026
Taiwan leverages AI export surge to boost tourism, domestic demand
At the start of 2026, Taiwan's electronic components and AI server industries continue to post strong export momentum, driven by surging demand for artificial intelligence (AI), high-performance computing (HPC), and cloud services. Production indices are expected to register double-digit year-over-year growth, with key indicators like demand, raw material inputs, and pricing all trending upward.
Tuesday 6 January 2026
China Mobile, CNBM anchor Huaxin Micro-Nano's 8-inch MEMS expansion
China's drive to localize high-value sensor manufacturing gained momentum this week, as China Mobile and China National Building Material (CNBM) Group became core shareholders of Anhui Huaxin Micro-Nano Integrated Circuit Co., an emerging domestic MEMS foundry specializing in 8-inch wafers.
Tuesday 6 January 2026
Chinese chipmakers confront yield challenges despite localization push
China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese manufacturers are advancing rapidly, significant technical bottlenecks remain in the mass production of advanced processes.
Tuesday 6 January 2026
Chang Wah interview: strong lead frame growth despite precious metals shortage
Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's leading packaging lead frame supplier, Chang Wah Technology, to see rising demand for high-end products in the second half of 2025. The company has also accelerated capacity expansion plans across Taiwan, China, and Malaysia.
Monday 5 January 2026
TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron

Taiwan's High Prosecutors' Office has filed a supplementary indictment against three additional suspects and the Japanese chip equipment maker Tokyo Electron (TEL) following new evidence in the investigation of a 2nm technology leak.

Monday 5 January 2026
Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by early 2028. Production could begin in the second half of 2028, supporting the company's medium- to long-term capacity expansion in the semiconductor sector.
Monday 5 January 2026
TSMC kicks off 2nm production with Samsung in hot pursuit
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as the two chipmakers vie for leadership at the industry's most advanced manufacturing node. The move is closely watched across the semiconductor sector because 2nm technology is expected to underpin the next generation of AI, mobile, and high-performance computing chips, shaping pricing power, customer relationships, and supply-chain diversification.
Monday 5 January 2026
Lee Jae-myung's first China visit signals warming South Korea-China ties
According to Bloomberg and The Korea Economic Daily, South Korean President Lee Jae-myung made a four-day trip from January 4-7, 2026, to Beijing and Shanghai, including a meeting with Chinese President Xi Jinping. The heads of the four major South Korean conglomerates (Samsung, SK Group, Hyundai, and LG Group) also traveled with Lee as part of an economic delegation.
Monday 5 January 2026
Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production on its advanced packaging line in April 2026.
Monday 5 January 2026
TSMC's US fabs expose structural cost gap with Taiwan

The economics of advanced semiconductor manufacturing in the US differ sharply from those in Taiwan, and TSMC's experience in Arizona is underscoring how difficult that gap is to bridge. Analysts say higher depreciation per wafer and elevated labor costs are placing sustained pressure on margins at the company's US fabs, even as production ramps up.

Monday 5 January 2026
Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing CNY35.5 billion (approx. US$5.07 billion) to expand 12-inch wafer capacity and deepen its position in mature-node manufacturing.

Monday 5 January 2026
Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.