Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a relatively limited impact, since the company mainly supplies high-end business notebook cameras.

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.

Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMES that future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China, Hong Kong, and Macau, launching a second round of raids targeting Supermicro's Taiwan branch and two listed Taiwanese technology companies.

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.

China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.

Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMES analyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyond silicon carbide (SiC) and gallium nitride (GaN).

With growing demand for AI server cooling and power management solutions, power semiconductor design company Potens reported that revenue from its server-related business has risen from 4.5% of total revenue in 2025 to 13.5%, a significant jump that reflects strong momentum in the segment. The company also remains optimistic about continued expansion in the AI, automotive, and motor control markets. Order transfers from Western manufacturers seeking to reduce reliance on China are also materializing.