ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.
For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the country's industrial economy. That is beginning to change, as a mix of federal industrial incentives, a flagship semiconductor packaging plant in Assam, and deepening ties with Japan give the region a modest but real foothold in India's electronics ambitions.
Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new entrants such as Rapidus to compete carefully on cost.
Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan Innovation Board. While Liu did not identify the company, industry observers believe the most likely candidate is Socle Technology Corp (Socle).
Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year at the event as he looks to deepen AI cooperation with global tech giants. Industry watchers expect the trip to help Samsung expand its ties with major customers and partners.
France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges, cooperation is now showing up in steel, silicon, and server racks. Foxconn, SiPearl, and a growing list of AI data center projects are turning bilateral goodwill into industrial output.
TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for signs that AI demand, flagship smartphone launches, and broader wafer orders can offset inflation, materials shortages, and mounting manufacturing complexity. The market is watching for another upgrade to revenue, spending, and margin targets.
Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers continued to expand. The Taiwan-based semiconductor inspection and analysis company also said on July 6 that its board had approved a cash capital increase to support expansion of its AI chip analysis platform, silicon photonics interconnect testing equipment, and mass production of its self-developed tools.
ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates. While first-half shipments came in below plan, chairman Chien-Hui Lee said the business has room to grow more strongly in the fourth quarter.
Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network and improve gross margins under its Fab Right strategy.
Global PMX said on July 6 that demand tied to semiconductor advanced-process equipment and AI server liquid-cooling systems remained strong, helping lift June 2026 consolidated revenue to NT$750 million (US$23.47 million), up 30.66% from a year earlier. The automotive powertrain and safety component maker also reported higher revenue for the second quarter of 2026 and the first half of the year.
