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Monday 24 August 2026
TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August or September. The company is also working with leading outsourced semiconductor assembly and test (OSAT) providers on the project, while its new Thailand production base aims to complete trial runs by year-end and begin volume production in early 2027.
Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck for the AI sector. Applied Materials group vice president and Taiwan president Eric Yu pointed out that semiconductor technology competition in the AI era can no longer focus solely on performance and transistor counts. How to support more computing with less energy will become the core of the next stage of semiconductor innovation.
Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of Everlight Chemical and Chairman of the Taiwan Chemical Industry Association (TCIA), noted that Taiwan boasts the world's largest tier-one customer demand alongside the most stringent process specifications. This unique position, he stated, presents a "once-in-a-century golden opportunity" for local semiconductor material development.
Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips and data centers providing a stronger-than-expected tailwind, CEO Atsuyoshi Koike told Reuters.

Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising global demand for AI chips. For readers worldwide, the move underscores how chip supply chains are adapting to support data centers, connected devices, and next-generation computing.
Monday 24 August 2026
India weighs new capital subsidies to build domestic polysilicon capacity
India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar supply chain.
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its position as the world's largest semiconductor materials consumer for a 16th straight year.
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value physical materials, Taiwan's Industrial Technology Research Institute (ITRI) said on August 21. Kuo-chan Chiou, director of ITRI's Material and Chemical Research Laboratories, said the island's materials supply chain is strengthening its capabilities as competition intensifies among Taiwan, Japan, and the US.

Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.

Monday 24 August 2026
Taiwan semiconductor materials team up to build local supply chain

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies continue to evolve. Despite geopolitical headwinds, stronger local supply-chain resilience is accelerating the push toward materials self-sufficiency.

Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its overseas fabs, particularly the Arizona plant, warrant the closest attention. Because TSMC's quarterly and semiannual filings do not explicitly separate individual subsidiary revenue, Lin uses the parent company's procurement volume from these overseas entities as a proxy for equivalent revenue.
Monday 24 August 2026
India-based Raana Semiconductors in talks to raise US$10.4 million Series A for crystal-growth expansion
According to Inc42, Indian semiconductor startup Raana Semiconductors is in advanced discussions to raise about INR100 crore (US$10.44 million) in a Series A funding round, as the company seeks to expand its work in semiconductor and advanced-material crystal growth.
Monday 24 August 2026
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell, SK Hynix, Micron, Samsung, and Taiwan's chipmakers. Below are the most-read DIGITIMES stories from the week of August 17-23, 2026.
Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned that capacity for the next three years is already largely booked, underscoring pressure on Taiwan's materials makers to accelerate R&D and local production.
Monday 24 August 2026
AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint expects more than 130 million GPUs and AI ASICs to shift toward advanced-packaged on-compute memory over the next five years, as the industry braces for nearly US$2 trillion in compute revenue and an intensifying battle over packaging capacity.
Monday 24 August 2026
Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting from the fab to the materials that feed it.

Monday 24 August 2026
India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer yields and labor rules to materials, equipment, rare earth magnets and emerging technologies, the country is expanding its ambitions as it seeks a deeper role in the global chip supply chain.
Monday 24 August 2026
Samsung DX hits first quarterly loss on chip inflation

Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit by chip inflation. Despite the worsening profitability, DX chief Tae-Moon Roh is responding with a strategy centered on expanding market share.

Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August 20 at a semiconductor industry forum in Taipei. He said demand for AI cluster interconnects continues to expand, driving exponential growth in the output value of optical communications.
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.
Friday 21 August 2026
China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving economies of scale.
Friday 21 August 2026
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized to the market for the pace of memory chip price increases, saying the rapid rise is fueling chip inflation across the industry.
Friday 21 August 2026
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation Exhibition, held from August 19 to 22.