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Monday 27 April 2026
Quanta bets on speed and scale to power next growth wave
Quanta Computer is doubling down on speed, scale, and execution as it heads into 2026, with leadership expressing strong confidence that surging AI server demand will drive another year of record growth, even amid global uncertainty. At Quanta's 38th anniversary celebration, Vice Chairman C.C. Leung emphasized the company's ability to meet increasingly demanding customer expectations. Orders are not only growing in volume, he noted, but also require faster delivery and lower costs. Despite operating at full capacity, he stressed that the company continues to seek even more orders and growth opportunities.
Monday 27 April 2026
Denso weighs Rohm bid withdrawal as support stalls

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal for chipmaker Rohm, after failing to secure the company's support.

Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).
Monday 27 April 2026
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Monday 27 April 2026
South Korea and Vietnam deepen tech and supply chain cooperation amid global uncertainty
South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi, as both countries seek to reinforce supply chain resilience amid global volatility.
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new fabrication and advanced packaging projects, while expanding design partnerships. At the same time, regulatory pressure on Apple, weakening smartphone demand, and solar policy tensions highlight challenges alongside growing global supply-chain integration.

Monday 27 April 2026
Cerebras files for IPO after AI chip breakthrough, G42 partnership shapes supply chain
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a net profit of US$87.9 million in 2025, compared to US$290 million revenue and a net loss of US$484.8 million in 2024.
Monday 27 April 2026
Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues to move forward but remains marked by repeated setbacks alongside visible progress. While construction activity and regulatory milestones indicate momentum, leadership exits and complex site conditions underline the challenges of executing a greenfield fab at global scale.
Sunday 26 April 2026
ASML cuts management layers due to restructuring; TSMC stance affects High-NA outlook

ASML is moving to eliminate a wide range of management roles as part of a broader effort to simplify its organization and improve execution, according to internal documents viewed by Business Insider.

Sunday 26 April 2026
Nvidia and OpenAI both make US$20 billion bets on AI chip startups: what's the common factor?
2026 has become a major year for IPO fundraising among leading AI players. At the end of 2025, Nvidia CEO Jensen Huang spent US$20 billion to acquire the IP and talent of AI chip startup Groq. In April 2026, The Information reported that OpenAI will purchase more than US$20 billion worth of chips from AI chip startup Cerebras. These two amounts are nearly identical; Nvidia for acquisition, OpenAI for procurement. Although seemingly isolated events, they are symmetrical moves.
Sunday 26 April 2026
Samsung bets its HBM leverage can hold Nvidia's LPU orders — but TSMC is pushing back
The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform. This move not only eliminates a strong competitor but also sparks a fierce battle between Samsung Electronics and TSMC over LPU foundry orders.
Saturday 25 April 2026
LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand
Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028.
Saturday 25 April 2026
China's Horizon Robotics aims at Tesla with new self-driving platform

As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon Robotics is mounting an ambitious strategic push — one that places it in more direct competition with Tesla.

Friday 24 April 2026
Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases.
Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market.
Friday 24 April 2026
Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through the global semiconductor supply chain, threatening shortages of a critical chipmaking material: photoresists.

Friday 24 April 2026
TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment.
Friday 24 April 2026
SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.

Friday 24 April 2026
Texas Instruments eyes further price hikes amid strong data center, industrial chip demand
Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications. TI stressed that while industrial demand has yet to reach its previous peak, the current recovery trend is positive, signaling continued growth prospects ahead.
Friday 24 April 2026
Texas Instruments says edge AI opportunities extend beyond robots
In an April 23 interview, Amichai Ron of Texas Instruments (TI) warned that edge AI will reshape devices worldwide, extending far beyond robotics and driving greater semiconductor demand as AI integrates into long-lived products, implying that global markets must prepare for increased connectivity, sensorization, and chip requirements, along with regulatory and logistical adjustments.
Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing to accelerate investments in advanced packaging.

Friday 24 April 2026
Intel keeps capex steady as it shifts spending toward capacity expansion
Intel is holding its 2026 capex broadly flat year over year, not because of reduced ambition, but because of a strategic reallocation of spending toward equipment that directly boosts chip output. Executives signaled that existing factory space is sufficient for now, allowing the company to prioritize tools and productivity gains to meet rising AI-driven demand. This measured approach reflects confidence in near-term demand—particularly for server CPUs—while maintaining financial discipline amid macroeconomic uncertainty and rising input costs.
Friday 24 April 2026
CPUs regain central role in AI as Intel highlights growing importance alongside rising ASIC demand
Intel executives are placing renewed emphasis on the central role of CPUs in artificial intelligence (AI), arguing that shifting workloads are elevating their importance even as specialized chips gain traction. Management said the transition from model training to real-world deployment is driving stronger demand for server CPUs, reinforcing confidence in Intel's competitive position. At the same time, the company is expanding into custom silicon, or ASICs, as part of a broader strategy to address evolving AI infrastructure needs.