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Monday 10 August 2026
Sony, TSMC to spend US$6.3 billion on Japan image sensor venture, Nikkei says

Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint venture to mass-produce next-generation image sensors in Kumamoto, Japan, with commercial production starting as early as 2029, Nikkei reported on August 10. Sony would own about 60% of the venture and TSMC about 40%.

Monday 10 August 2026
TSMC July revenue jumps 44.7% to record US$14.5B, 2026 growth forecast tops 40%

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July 2026, up 5.6% from June and 44.7% from a year earlier, extending strong growth fueled by artificial intelligence and high-performance computing demand.

Monday 10 August 2026
SuperAlloy boosts profit and expands into semiconductor green supply chains

SuperAlloy Industrial said after its August 7 board meeting that second-quarter 2026 results showed steady improvement in core profitability, even though foreign exchange losses tied to a weaker yen weighed on net income. The Taiwan-based manufacturer is also moving into the semiconductor front-end equipment supply chain in a bid to build a second growth engine alongside high-end automotive and green materials.

Monday 10 August 2026
OCI rides AI, space solar boom as SpaceX deepens polysilicon ties
South Korean solar polysilicon supplier OCI Holdings is capitalizing on its increasingly scarce position as a non-China supplier, benefiting not only from growing solar demand from US AI data centers but also from a supply partnership with SpaceX that is extending its reach from terrestrial solar projects into space applications.
Monday 10 August 2026
Taiwan sees limited chip impact from new US polysilicon tariff

The US signed a presidential proclamation on August 6 (ET) imposing a 15% tariff on polysilicon and related products from all countries, with the new measures set to take effect on December 4, 2026. Taiwan's Executive Yuan said the decision was expected to have limited impact on the island's solar sector and highlighted exemptions available to semiconductor-related firms with US investments.

Monday 10 August 2026
Ex-SK Hynix employee gets 18 months for leaking chip secrets to Chinese firms

The Seoul High Court has upheld an 18-month prison sentence for a former SK Hynix employee who leaked trade secrets tied to CMOS image sensor (CIS) technology to Chinese companies while seeking new employment, including with Huawei chip unit HiSilicon.

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week of August 3-10, 2026.
Monday 10 August 2026
Samsung unveils 200MP image sensor as Oppo targets first adoption

Samsung Electronics has launched its next-generation 200-megapixel CMOS image sensor, the ISOCELL HPC, and reports said Oppo is set to be the first smartphone brand to use it. The sensor is the industry's first mobile CIS to support 16-bit RAW output, marking a new specification for flagship phone cameras.

Monday 10 August 2026
India roundup: Chip push broadens as localization and capacity remain works in progress
India is accelerating its bid to build a broader semiconductor and electronics ecosystem, combining new packaging capacity, longer-term tax incentives and deeper localization with efforts to expand its chip workforce and sovereign AI capabilities. Investments by ASIP, Dixon, Rashi and global technology partners highlight a strategy increasingly focused on higher-value manufacturing.
Monday 10 August 2026
Aurotek profit jumps on embodied AI and semiconductor automation demand
Aurotek Corporation reported stronger second-quarter and first-half 2026 results on August 6 as demand rose for embodied AI solutions, semiconductor foundry and advanced packaging equipment, high-end AI server manufacturing equipment, and service robots used in logistics and inspection. The Taiwan-based supplier said the mix of higher-value products lifted profitability across its business lines.
Sunday 9 August 2026
Commentary: From free flow to tight control — how tech talent became a national security asset

Tech talent has moved from being simply a hiring priority to a matter of national security. As major economies increasingly tie talent to competitiveness and national security, control over its cross-border movement is tightening. That shift is visible today: Taiwan's Ministry of Justice Investigation Bureau is probing 17 companies accused of illegally recruiting tech talent in Taiwan, China is preparing to tighten exit controls on key technical workers, and the US continues expanding semiconductor and AI export controls and research security reviews.

Sunday 9 August 2026
Greenfiltec posts first-half loss as activated carbon costs squeeze margins
Greenfiltec reported first-half 2026 consolidated revenue of NT$311 million, up 18.35% from a year earlier, but the Taiwan-based airborne molecular contamination (AMC) filter supplier swung to a net loss of NT$140 million. The company said higher shipments of high-end filters for semiconductor customers lifted sales, while surging activated carbon costs cut into profitability.
Sunday 9 August 2026
Rohm sees AI server demand lift first-quarter profit 4,825%
Rohm Semiconductor reported sharply higher first-quarter results on August 5, 2026, as recovering demand for automotive power semiconductors and strong AI-linked data center business drove growth. For the quarter ended June 2026, the Japanese chipmaker posted revenue of JPY135.7 billion, up 16.8% from a year earlier, while operating profit surged 4,825.6% to JPY9.6 billion.
Sunday 9 August 2026
Ajinomoto rides advanced packaging boom as ABF demand surges

Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in semiconductor package substrates, highlighting how advanced packaging is shifting more value upstream into specialized materials.

Saturday 8 August 2026
TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and was set to ride the AI boom into profitability in 2026, has passed away. His passing has revived memories of a 1999 attempt to block UMC's aggressive bid for Powerchip, when Huang sought help from TSMC founder Morris Chang and eventually saw Vanguard International Semiconductor (VIS) invest in Powerchip to counter UMC.

Saturday 8 August 2026
Interview: Lightmatter maps CPO future with Nvidia NVLink, Taiwan supply chain
The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's advantages after joining the Nvidia NVLink ecosystem, its technology roadmap and the importance of close collaboration with Taiwan's supply chain.
Saturday 8 August 2026
Nova Technology posts record second-quarter and first-half profit on strong order recognition
Nova Technology posted record second-quarter and first-half 2026 profit as orders from semiconductor, memory, and advanced packaging customers continued to drive revenue recognition. The Taiwan-based supplier of semiconductor and panel process systems said the trend should keep supporting order intake and revenue recognition from its backlog in the coming months.
Friday 7 August 2026
WinWay revenue jumps as AI test socket orders drive growth
WinWay Technologies said orders from AI customers and stronger demand for advanced testing products lifted shipments in the second quarter of 2026, with revenue rising for a fourth straight quarter on a sequential basis. The semiconductor test interface maker said it expects momentum to continue into the third quarter of 2026 as order visibility improves and new capacity comes online.
Friday 7 August 2026
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation image sensors.
Friday 7 August 2026
VisEra Technologies sees stronger 2H26 on recovering demand across three end markets
TSMC-affiliated optical sensing chipmaker VisEra Technologies said at its earnings conference on August 6 that business momentum rebounded significantly in the second quarter of 2026, driven by stable shipments of smartphone CMOS image sensors (CIS).
Friday 7 August 2026
Eris Technology posts record July revenue as subsidiary YS Tech plans listing
Power semiconductor group Eris Technology said its July 2026 consolidated revenue reached NT$291 million, up 29.78% year-on-year and setting a new monthly high. The company also reported that cumulative revenue for January through July totaled NT$1.776 billion, an increase of 19.02% from the same period in 2025.
Friday 7 August 2026
Wah Hong speeds AI cooling and semiconductor materials push with Taoyuan pilot line

Wah Hong Industrial Co. said that in the first half of 2026, it accelerated development of high-value-added products, new technologies and new application markets while continuing to protect its core businesses. The Taiwan-based materials maker also reported that net profit rose nearly 12% year over year, while earnings per share increased 16.83% during the period.

Friday 7 August 2026
South Korea welcomes Trump polysilicon rules as boost to non-China suppliers
US President Donald Trump's new import rules on polysilicon, ingots, wafers, and solar products could ripple through global clean energy and semiconductor markets, affecting pricing, sourcing, and investment decisions far beyond the US. South Korean producers welcomed the measure, while analysts said it targets low-cost Chinese supply and could reshape competition.
Friday 7 August 2026
Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026. Some customers have recently received notices of varying adjustments from the Singapore-based subsidiary of China's JCET.

Friday 7 August 2026
Interview: Nvidia exec on progress of CPO production and pluggable optics
Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments at scale, in a DIGITIMES interview ahead of the OCP APAC Summit on August 11-12, 2026. He said the biggest shift in AI factories is that the computing unit is no longer a single server but the entire data center, while Nvidia's announcement that co-packaged optics (CPO) switch has entered mass production signals a new round of upgrades for the optical communications industry and the AI networking market.