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Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with prototypes potentially ready by the end of this year, The Elec reported, citing semiconductor industry sources.

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced semiconductor capacity and AI server infrastructure creates new demand for precision-engineered components. Companies traditionally focused on powertrain, transmission, and safety systems are leveraging decades of manufacturing expertise to secure positions in semiconductor equipment and AI liquid-cooling supply chains, creating new growth engines beyond their core automotive businesses.

Monday 13 July 2026
Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to partner with Intel to manufacture its chips. While Apple could benefit from expanding its chip suppliers, the episode also shows the power of Intel's government backing as the US seeks to reshore its semiconductor industry.

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip scheduled to be manufactured at Samsung's Taylor, Texas, fab using the company's 2nm process.

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture that can deliver power from both sides of the chip. Industry observers say Intel and Samsung Electronics are both taking on harder-to-manufacture technologies in the ultra-advanced process race as they try to catch up with TSMC.

Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated revenue reached NT$442.68 billion (approx. US$13.8 billion) in June, up 6.2% month-over-month and 67.9% year-over-year. For the first six months of 2026, revenue totaled NT$2.4 trillion, representing a 35.6% year-over-year increase.
Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging. The expansion is meant to meet surging global demand for high-compute chips and advanced packaging technology.
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the power, water and site development needed to support the expansion.
Monday 13 July 2026
SK Group chair: US investment plan will far exceed US$35B

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the amount he said the group is already putting into the country—though he did not disclose the plan's size, timing or components.

Monday 13 July 2026
Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.

Monday 13 July 2026
Applied Materials India eyes larger role in global chip equipment development
Applied Materials India is preparing to take on broader ownership of selected semiconductor equipment product initiatives, as the US-based chipmaking equipment supplier expands its R&D and validation base in Bengaluru.
Monday 13 July 2026
US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030

A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global markets, according to a new report. The findings suggest the manufacturing push backed by Washington's CHIPS Act may depend on sustained funding and closer industry cooperation to avoid bottlenecks.

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including FormFactor, Advantest, Tokyo Electron (TEL), Teradyne, MPI, Keysight, Anritsu, ficonTEC, ADS Tech (ADST), All Ring Tech, GMT Global, Chroma ATE, Hon Precision, and WinWay Technology are rushing to secure a foothold in the emerging "four-stage optoelectronic testing" market.
Monday 13 July 2026
Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total capacity. He said the memory market has entered a broad shortage, and that Nanya may add a fifth strategic partner, while 2027 capital expenditure could climb to as much as NT$200 billion (approx. US$6.2 billion), 4x the spending in 2026.
Monday 13 July 2026
Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the supply chains of automakers, industrial firms, and device makers worldwide. The remarks also hint at how shifting global demand could influence where next-generation semiconductors get built.

Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local chipmaking capabilities, reduce dependence on imports, and deepen India's role in a sector that supports electronics production worldwide, from phones to data centers.
Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing. The semiconductor testing company said the project would be its largest overseas expansion and was aimed at addressing a growing US gap in backend packaging and testing capacity.
Monday 13 July 2026
India roundup: India's chip strategy tests its ability to build a competitive ecosystem

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.

Monday 13 July 2026
MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity
Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over year, marking a record high for four consecutive months. Second-quarter 2026 revenue reached NT$1.64 billion, a record high for a single quarter, while first-half 2026 revenue totaled NT$3.07 billion, an increase of 17.47% from the same period in 2025.
Monday 13 July 2026
Musk assembles Intel, SpaceX talent for Tesla wafer fab ambitions

Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns into reality.

Sunday 12 July 2026
Column: Compute is no longer the AI bottleneck. Memory is — and suppliers know it
After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked. This analysis examines the sustainability of the AI semiconductor boom, the outlook for memory and ASICs, and the geopolitical risks reshaping global supply chains.
Sunday 12 July 2026
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the next major battlegrounds in AI infrastructure.
Sunday 12 July 2026
Hermes Testing's June revenue more than doubles as advanced chip test demand surges
Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering services. The test interface supplier said the growth was driven by continued strength in high-end semiconductor testing activity.
Saturday 11 July 2026
Record chip profits mask a widening divide inside Samsung
Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand are lifting overall earnings, while TVs, home appliances, and other end-device businesses remain under pressure.