CONNECT WITH US
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
Tuesday 9 June 2026
Onsemi launches Elite Pairing Studio to simplify power design
Onsemi has introduced an online design tool to help engineers match SiC MOSFETs and gate drivers more quickly. The company said the platform could reduce early-stage trial-and-error in power electronics, with potential implications for AI data centers, electric vehicles, industrial systems, and electrification infrastructure worldwide.
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand strains supplies of advanced memory chips.
Tuesday 9 June 2026
Jensen Huang deepens LG alliance as Nvidia expands its AI ambitions in South Korea
After concluding a meeting with SK Group on the morning of June 8, Nvidia CEO Jensen Huang traveled to LG Group's headquarters, the LG Twin Towers in Seoul's Yeouido district, for a formal meeting with LG Chairman Koo Kwang-mo. The discussions underscored a widening strategic partnership between the two companies across robotics, AI infrastructure, mobility technologies, and advanced AI development.
Tuesday 9 June 2026
Yesiang begins shipping recycled filters as 2nm demand lifts AMC market
Taiwan's Yesiang has started volume shipments of a newly certified recycled advanced micro-contamination (AMC) filter as semiconductor makers push deeper into 2nm and smaller nodes. The development could matter globally because tighter contamination control is becoming a critical yield factor for advanced chips, while cleaner manufacturing also aligns with lower-waste sourcing trends.
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of record sales, the firm announced. For the first five months of 2026, revenue reached NT$2.51 billion, up 19.01% from the same period in 2025, with the company's leadership attributing growth to demand for outsourced materials analysis and failure analysis services driven by high-end AI chip development and advanced process transitions.
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Monday 8 June 2026
Exclusive: The semiconductor battle behind AI data centers and EVs
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
Monday 8 June 2026
Wingtech sues Nexperia's Dutch entities as cross-border control dispute deepens
Wingtech has launched a lawsuit in China against Nexperia's Dutch entities and related parties, intensifying a dispute that could affect semiconductor supply chains, corporate governance, and cross-border investment rules for customers and investors worldwide. The case adds another layer to a legal battle already spanning China and the Netherlands.
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Monday 8 June 2026
Hitachi and Intel strike collaboration on physical AI and industrial infrastructure
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used worldwide. The partnership targets efficiency, resilience, and faster industrial innovation, with potential implications for factories, power networks, and other critical operations globally.
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.

Monday 8 June 2026
Onsemi promotes 800 VDC power architecture for future AI infrastructure
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.
Monday 8 June 2026
T3EX expands Northeast Asia air freight to serve electronics and chip supply chains
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global shipping remains highly volatile amid geopolitical tensions and adjustments to energy prices and routes.
Sunday 7 June 2026
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to step up sales of its 5nm and 8nm processes to support near-term utilization, according to ZDNet Korea.

Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain capacity rather than orders. He said the company already has visibility into a large volume of 2027 orders as customers rush to secure supply.
Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technology Promotion Agency, according to reports by Nikkei and Reuters.
Friday 5 June 2026
OECD data show China-based semiconductor makers receive outsized industrial support
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024.
Friday 5 June 2026
Samsung's biggest union loses majority status after bonus talks
Samsung Electronics is facing a new shift in labor relations after the Samsung Electronics branch of the Samsung Group Super-Enterprise Union reportedly lost its status as a majority union following a sharp drop in membership after bonus negotiations. The move weakens the union's representation and could further fragment future labor talks and union power at Samsung Electronics.
Friday 5 June 2026
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.
Friday 5 June 2026
NXP chief says factories will lead robot adoption globally
Industrial factories are likely to become the first major market for robots at scale, according to Rafael Sotomayor, NXP President and CEO, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.