AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China, Hong Kong, and Macau, launching a second round of raids targeting Supermicro's Taiwan branch and two listed Taiwanese technology companies.

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.

China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.

Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMES analyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyond silicon carbide (SiC) and gallium nitride (GaN).

South Korea is pushing to establish a second national semiconductor production base in Gwangju and South Jeolla in the country's southwest, with Samsung Electronics and SK Hynix planning to build two memory fabs each as part of a KRW800 trillion (approx. US$517.87 ​billion) national chip ecosystem project, Yonhap reported.

With growing demand for AI server cooling and power management solutions, power semiconductor design company Potens reported that revenue from its server-related business has risen from 4.5% of total revenue in 2025 to 13.5%, a significant jump that reflects strong momentum in the segment. The company also remains optimistic about continued expansion in the AI, automotive, and motor control markets. Order transfers from Western manufacturers seeking to reduce reliance on China are also materializing.

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring the park's role in a global supply chain centered on advanced chips. New approvals for testing, materials, and equipment research point to rising demand for services that support production at below 2nm nodes.