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Friday 14 August 2026
SK hynix scouts US memory fab sites as customers seek local supply
SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production closer to home.
Friday 14 August 2026
South Korea chip cluster could expand to nine fabs as SK plans new investment
South Korea's planned southwestern semiconductor cluster could eventually expand from four fabs to as many as nine as the government accelerates land, power, and infrastructure work around Gwangju, while local officials say SK Group is expected to unveil a major investment in eastern Jeonnam.
Friday 14 August 2026
Insight: Intel raises US$20B, but its 14A ambitions may need twice as much

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting most from the current surge in server CPU demand and how much more capital Intel may need to reach the 1.4nm generation.

Friday 14 August 2026
MPI posts record 2Q26 revenue, profit as probe card capacity stays fully loaded

Taiwanese test interface provider MPI said that continued strong expansion demand from global artificial intelligence (AI) customers, along with its growing global market share in mid- to high-end test interfaces, drove both revenue and profit to record highs in the second quarter of 2026. The company added that probe card capacity remained fully utilized as demand outpaces supply.

Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company said it is now developing equipment for chip-in-package, glass substrates, and organic interposers, while also moving from panel lamination into wafer lamination, primarily targeting "Taiwan's largest semiconductor manufacturer."
Friday 14 August 2026
Nvidia Feynman pushes TSMC A16 and CPO ramp

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin enters mass production and ramps up. The move is set to drive upgrades at TSMC and could trigger another wave of orders across the global equipment and materials supply chain.

Friday 14 August 2026
Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.

Friday 14 August 2026
Lam Research to spend more than US$3 billion expanding global R&D labs
Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor manufacturing grows more complex.
Friday 14 August 2026
Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback has pushed back the construction timetable for GlaSSEM, its joint venture with Dongwoo Fine-Chem for glass core production in Pyeongtaek, South Korea, and has made equipment ordering dates difficult to pin down.
Friday 14 August 2026
Taiwan tech dividend expansion to accelerate non-tech industry upgrades
Taiwan is seeking to sign an agreement with the US to avoid double taxation, seen as the last major hurdle to unlocking Taiwanese investment in the US. Taiwan's technology dividend is believed to not only support overseas investment but also accelerate the transformation of its domestic non-tech industries.
Friday 14 August 2026
SMIC plans to single out AI chip revenue as demand outpaces its current reporting categories
Semiconductor Manufacturing International Corporation (SMIC) is considering disclosing revenue from artificial intelligence (AI)-related "peripheral chips" as a standalone line item, possibly from the third quarter of 2026 or later, executives said on the company's second-quarter earnings call.
Friday 14 August 2026
Applied Materials sets 2028 capacity target as it commits new manufacturing hires
Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it is hiring and training manufacturing and customer-support staff so it can double its quarterly system output from current levels by 2028, and is already planning a further capacity expansion to support demand growth "by 2030," according to CFO Brice Hill on the August 13, 2026 call.
Friday 14 August 2026
Hua Hong's fabs were already full — price is what finally made them profitable
Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a record US$717.5 million, up 26.8% from a year earlier and 8.6% sequentially, and gross margin widened to 16.5% from 10.9% in the same quarter of 2025 — enough, for the first time in five quarters, to cover operating costs rather than merely offset them.
Friday 14 August 2026
Applied Materials' growth is rotating from China volume to DRAM tooling
Applied Materials just posted its 13th consecutive quarter of year-on-year gross margin expansion, and it did so while its largest single country market shrank. Fiscal third-quarter revenue reached US$9.115 billion, up 25% from a year earlier, with GAAP operating margin at 33.7% — both records — even as China fell to 28% of revenue from 35% a year ago. The quarter is less a China story than a mix story: equipment spending is moving toward memory and the leading edge, and Applied is priced for that shift.
Friday 14 August 2026
SMIC's pricing power arrives as AI pushes mature-node work into China
China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor Manufacturing International Corporation (SMIC) reported revenue of US$3.01 billion for the three months ended June 30, 2026, up 20.0% sequentially and 36.1% from a year earlier, and gross margin of 25.3% against 20.1% in the March quarter. The margin, not the revenue line, is the news: it is the first quarter in this cycle in which SMIC has been able to convert a full order book into price.
Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment for the giant wafer fab Terafab, he also showed a concept image of the facility after completion.
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the Design Technology (DT) team at Samsung Electronics' System LSI division, has pointed out that software has already leveraged AI to cut headcount and generate significant gains, but hardware has yet to see clear benefits.
Friday 14 August 2026
Cerebras raises 2026 outlook as hardware sales weaken
AI chip startup Cerebras Systems raised its full-year 2026 core revenue and gross margin outlook after reporting second-quarter results, but the company also disclosed declining hardware sales and a sharp swing in profitability metrics. The update came as investors focused on whether growth was shifting away from hardware and toward cloud services.
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at its first cleanroom. Power and water supplies have already been secured, according to Maeil Business Newspaper.
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward sizes that are increasingly inefficient to manufacture on conventional 300mm wafers.
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting the semiconductor industry lies not only in technological advancement itself, but also in the capacity to deploy standardized manufacturing processes at greater scale and speed.
Friday 14 August 2026
ABF substrate boom lifts Eternal Precision prices 20%

Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision Mechanics, a unit of Eternal Materials, saying customer orders and inquiries jumped sharply around Christmas 2025 and have continued since. Its Japan plant has been running at full capacity since May this year.

Friday 14 August 2026
Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
Friday 14 August 2026
Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding urgency to the development of pellicles capable of handling higher optical and thermal requirements.
Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology has emerged as a crucial next-stage process amid rapid advances in chip stacking, heterogeneous integration, and backside power delivery.