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Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.
Monday 14 September 2026
AI's energy demand ignites global nuclear rush, straining Taiwan's restart
A worldwide nuclear comeback, fueled by artificial intelligence data centers and semiconductor demand, is tightening supply chains and labor markets just as Taiwan considers restarting idle reactors.
Monday 14 September 2026
India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures arrive days before SEMICON India 2026, the country's flagship semiconductor conference, opens in New Delhi on September 17.
Monday 14 September 2026
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC), strengthening the company's position in China's semiconductor foundry market.

Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO). But large-scale deployment will depend on more than optical-engine performance. Precision alignment, serviceability, manufacturing yield, and whether the supply chains for light sources, packaging, testing, and materials can advance in step are becoming equally critical.
Monday 14 September 2026
AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon cycle.
Monday 14 September 2026
AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year revenue growth.
Monday 14 September 2026
India's chip show nearly doubles in two years, with suppliers leading the build-out
The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies, up 52% from 351 in 2025 and 97% from 271 in 2024. Moreover, the sharpest growth is not in chipmakers, but in areas that fabs purchase only once construction is real: cleanroom and utility contractors, specialty gas and chemical suppliers, and metrology and inspection tool vendors.
Monday 14 September 2026
Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted openings in IPC and IoT; memory inventories tightened as HBM4 and server demand strained DRAM and NAND supply; and Micron, Taiwan Mobile, Samsung Electronics, ASML, Synopsys and Eaton advanced plans tied to AI, advanced-node manufacturing and higher-density data centers. Below are the most-read DIGITIMES stories from September 7–13, 2026.
Monday 14 September 2026
India roundup: India says it cannot build electronics without China
India is accelerating its semiconductor and electronics ambitions, courting Taiwan, easing China restrictions, expanding local manufacturing and chip infrastructure, while global technology companies deepen investment despite rising costs and regulatory risks.
Saturday 12 September 2026
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Saturday 12 September 2026
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for semiconductor materials Hidenori Abe told DIGITIMES that the company sees five major materials challenges: warpage, plating, coating, bonding, and polishing.
Friday 11 September 2026
ASE to buy AOI, AVI equipment from Machvision for NT$334M
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection (AVI) systems, from related company Machvision to meet capacity expansion needs. The cumulative pretax transaction value for the past year and future purchases, based on the quotation and negotiation process, came to NT$334 million (US$10.6 million).
Friday 11 September 2026
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the US. Although he did not repeat his previous claim that Taiwan "stole" America's chip industry, Trump said Taiwan's chips should have been subject to heavy tariffs long ago, with tariffs of 100% or even 200%.
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what it calls the industry's first Insertion 2 automated optical test solution. As demand for photonics-integrated testing rises, the company expects equipment requirements to become more diverse and shipments to top 1,000 systems in the next 18-24 months.
Friday 11 September 2026
Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and advanced packaging capacity, according to Futurum Group.
Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and Innolux, the island's two largest panel makers, are accelerating capacity reductions and asset sales while redirecting capital and technology toward higher-growth businesses. For smaller and mid-sized players, however, the path beyond displays remains far less defined.
Friday 11 September 2026
CIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.

Friday 11 September 2026
Taiwan tech minister in Europe to advance semiconductor cooperation

National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe cooperation on advanced semiconductor packaging, silicon photonics (SiPh), and talent exchange, while also strengthening supply chain resilience. The trip included undisclosed government assignments as well as public events.

Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies spanning AI server assembly, cooling, power, substrates, materials, networking, test, and optics reported combined August revenue of NT$2.84 trillion (US$89.74 billion), up 76.5% from a year earlier and 9.9% from July, according to their filings to the Market Observation Post System. Both the total and the growth rate are the highest of the cycle, and the year-on-year rate is a step up from July's 61.3%.
Friday 11 September 2026
MediaTek August revenue beats expectations, boosts 3Q outlook

MediaTek reported August 2026 revenue of NT$64.183 billion (approx. US$2.03 billion), up 32.41% from July and 44.08% year-over-year. Industry sources said the chipmaker's August performance came in well above expectations and puts its third-quarter revenue guidance within reach, with a chance to beat it.

Friday 11 September 2026
Rayzher rides semiconductor fab buildout to record revenue
Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year and a record monthly high. Cumulative consolidated revenue for the first eight months of 2026 reached NT$1.993 billion, up 27.91% from the same period in 2025 and also a record for the period.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
Academia Sinica to open 8-inch quantum chip platform in September 2026

Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking a new stage in Taiwan's in-house quantum chip development and manufacturing efforts. After the cleanroom was completed, the institute finished installing process equipment, connecting factory utility lines, testing equipment functions, and training operators.

Thursday 10 September 2026
ITRI to showcase 3.2T silicon photonics and AI data center cooling
Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration said on the 10th that AI data centers need faster transmission and better cooling. The ministry said government-supported technologies from Taiwan's Industrial Technology Research Institute (ITRI) will be featured at the event, including a silicon photonics optical engine and a 3D aluminum microchannel thermosyphon cooler.