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Tuesday 28 July 2026
Zeiss races to break ASML's EUV optics bottleneck for the AI chip boom
Zeiss Semiconductor Manufacturing Technology is expanding production capacity in Germany to relieve a critical constraint on ASML's lithography output, with AI data center investment accelerating demand for advanced logic and memory chips.
Tuesday 28 July 2026
Apple, Micron's clash over CXMT puts White House in the middle
Apple and Micron are fighting over whether the smartphone maker can buy memory chips from Chinese manufacturer ChangXin Memory Technologies (CXMT) for non-US devices, a move opposed by Micron. Both companies are lobbying the administration of US President Donald Trump, which could force him to make an uncomfortable choice between his goals of cheaper prices or domestic chip production.
Tuesday 28 July 2026
EYEQ Lab completes 200mm SiC line validation with yield above 90%

South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide (SiC) line in Busan, achieving an average yield above 90%, ET News reported, citing industry sources.

Tuesday 28 July 2026
China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises
Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts. The contract could bolster the company's revenue base, but execution risks, capacity expansion, and market swings will determine how much benefit reaches investors and customers worldwide.
Monday 27 July 2026
CXMT tops A-share market cap on IPO debut
Chinese DRAM maker ChangXin Memory Technologies (CXMT) listed on the STAR Market of the Shanghai Stock Exchange on July 27, with its market capitalization briefly topping CNY3.6 trillion (approx. US$533.1 billion) on the first day of trading, surpassing Industrial and Commercial Bank of China and becoming the largest listed company in the A-share market.
Monday 27 July 2026
WIN Semiconductors sees optical communications ramp accelerate AI revenue contribution

Gallium arsenide (GaAs) foundry WIN Semiconductors (WIN) expects infrastructure revenue to continue growing in the third quarter of 2026, driven by demand from low Earth orbit (LEO) satellites and other aerospace applications, while shipments of smartphone power amplifiers (PAs) and Wi-Fi products are expected to remain broadly flat or post modest growth.

Monday 27 July 2026
India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million) to establish a semiconductor packaging and testing facility in Madhya Pradesh, as the country expands efforts to build a domestic chip manufacturing ecosystem, according to Reuters, The Economic Times, and Data Quest.
Monday 27 July 2026
Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion plans spanning semiconductors, autonomous driving and robotics.

Monday 27 July 2026
Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below are the most-read DIGITIMES stories from the week of July 20-26, 2026.
Monday 27 July 2026
IDMs target AI margins, boosting Taiwan power suppliers
International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is creating a longer runway for power semiconductors. Industry sources said the move could benefit Taiwanese suppliers in midrange products, with pricing gains extending into the second half of 2025 and, in some cases, 2027.
Monday 27 July 2026
Samsung bolsters energy team as chip projects test power supply
Samsung Group is recruiting current and former government energy officials for its in-house think tank as electricity infrastructure emerges as a key issue for its semiconductor expansion in Yongin and the proposed Honam chip cluster.
Monday 27 July 2026
Disco lifts first-half profit forecast on steady AI equipment demand
Japanese semiconductor equipment maker Disco expects net profit for the six months ending September 30, 2026, to rise 32% year over year to JPY73.8 billion (approx. US$461 million), supported by continued demand for equipment and consumables used in AI-related semiconductor production.
Sunday 26 July 2026
Optical PD volume production lifts WIN Semiconductors' Q2 revenue 39% YoY
WIN Semiconductors, a gallium arsenide (GaAs) foundry, reported consolidated revenue of NT$5.26 billion (US$178 million) for the second quarter of 2026, up 14.5% sequentially and 39% year over year, driven by improved product mix, higher shipment volumes and the ramp-up of new products.
Sunday 26 July 2026
KKR plans gradual exit as LCY Group accelerates semiconductor materials expansion
TSMC supplier LCY Group President Bowei Lee said private equity firm KKR & Co. plans to gradually divest its holdings in businesses affiliated with the Taiwanese chemical group, a move he believes will give the company greater flexibility to accelerate its expansion in semiconductor materials.
Sunday 26 July 2026
Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment pledge.
Saturday 25 July 2026
89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past US$1 trillion in 2026, four years earlier than previously expected, and expand the market to US$1.5 trillion by 2030. SEMI Global Chief Marketing Officer Terry Tsao said nearly 89 fabs are in the planning or construction pipeline for 2026-2030 to meet surging AI chip demand, with another 50 fabs expected to be planned for 2030-2035.

Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end wafer processing, chiplet integration, packaging, testing and manufacturing data through its Innovative Integration for Manufacturing (IIM-1) model.
Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity, and international standards.
Saturday 25 July 2026
Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking
Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract manufacturers increasingly view direct ownership of chip capacity as central to supply-chain security rather than a purely financial bet.
Saturday 25 July 2026
South Korean leaders meet Nvidia as AI partnerships expand
South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry partners, highlighting South Korea's efforts to strengthen its artificial intelligence ecosystem and expand international collaboration.
Saturday 25 July 2026
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The companies said the initiative aims to support future computing platforms by improving performance, increasing interconnect density, and enhancing power efficiency.
Friday 24 July 2026
Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor development, underscoring six years of sustained investment in the approach. Rather than attempting to disrupt the existing semiconductor industry, Ren said the initiative aims to establish a sustainable path for chip evolution amid restrictions on access to leading-edge manufacturing technologies.

Friday 24 July 2026
German chip suppliers deepen ties with Samsung, SK Hynix

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment in advanced chip production.

Friday 24 July 2026
India's chip plants face harder test: finding repeat customers
India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components, according to analysts.
Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout has entered a new phase after five years of construction, with the company's first 4nm fab now ramping production and contributing to profits. The second fab is set to enter equipment move-in in the fourth quarter of 2026, the third fab is scheduled for move-in in September 2027, and the fourth has already begun site preparation.