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Monday 9 November 2026
AI chip testing demands lift Taiwan's wafer testing specialist HTSI as October revenue surges 62%
Taiwanese semiconductor wafer testing solutions provider Hermes Testing Solution Inc. (HTSI) reported sustained revenue growth in October, supported by steady demand for high-power thermal management modules, cleaning materials and engineering services.
Monday 9 November 2026
Megaspeed chip smuggling probe puts Nvidia NCP certification under scrutiny
Nvidia CEO Jensen Huang appears to have become a target of Chinese intelligence activity, while his admission of an extramarital affair has drawn attention to his relationship with a former female executive at Singapore data-center operator Megaspeed. The episode highlights chip-transshipment risks and export-control loopholes in Singapore and Malaysia.
Monday 9 November 2026
Samsung, SK Hynix race to secure EUV tools as ASML warns of shortages
Samsung Electronics and SK Hynix are competing to secure extreme ultraviolet (EUV) lithography equipment from ASML as the Dutch supplier warns that its planned capacity will fall short of customer demand in 2027 and 2028, raising concerns about the availability of critical tools for advanced DRAM expansion.
Monday 9 November 2026
Exclusive: Gallium oxide prepares to tackle power semiconductor market with 6-inch mass production and 8-inch breakthroughs
Gallium oxide (Ga2O3) is approaching a pivotal industrial inflection point. On one hand, wafer sizes are scaling up to seamlessly integrate with existing semiconductor manufacturing lines. On the other hand, material prices are expected to decline substantially starting in 2027. The convergence of these two trends is unlocking commercial viability for this new high-voltage power material, which targets ultra-high-voltage applications above 3,000V and grid infrastructure in the 10kV class.
Monday 9 November 2026
Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation on November 6 to build advanced semiconductor packaging capabilities in India, anchored by a planned INR62 billion (US$658.77 million) OSAT facility in Madhya Pradesh.
Monday 9 November 2026
Samsung, SK Hynix, Micron forge rare alliance to pave way for unmanned chip fabs
Samsung Electronics, SK Hynix and Micron are reportedly collaborating on charging standards for mobile robots used in semiconductor fabs, seeking to accelerate factory automation and lay the groundwork for unmanned manufacturing. The initiative is unusual as it brought together major industry rivals to standardise robotic components, equipment, communications and system interfaces, potentially drawing broader attention across the semiconductor industry.
Monday 9 November 2026
Samsung's Texas fab may begin trial runs in December
Samsung Electronics may begin trial runs across its Taylor, Texas, foundry in mid-to-late December 2026 as it installs and tests manufacturing equipment ahead of planned commercial production in 2027.
Monday 9 November 2026
Musk's Terafab reportedly targets memory output on par with Samsung's DRAM capacity
Terafab, the chipmaking venture backed by Tesla and SpaceX, is reportedly planning memory output that would rival the world's largest DRAM maker. Japanese and Korean equipment and materials suppliers are already being courted to help build it, though suppliers and analysts question whether the schedule and the demand will hold.
Monday 9 November 2026
China's lithography ambitions gain ground as SMEE claims 90% local sourcing in chipmaking tools
Shanghai Micro Electronics Equipment (SMEE) has showcased a new generation of domestically developed lithography systems spanning front-end wafer fabrication and advanced packaging, marking further progress in China's semiconductor equipment localisation. The company claims more than 90% of key components in its front-end systems are sourced domestically, with the equipment advancing into volume production.
Monday 9 November 2026
Commentary: AI investment doubts rise, but chip demand keeps surging
Concerns over an overheating AI market have resurfaced, fueled by delays in data center construction, power and permitting bottlenecks, and the potential deferral of hundreds of billions of dollars in capital expenditure.
Monday 9 November 2026
UKSC highlights three UK semiconductor strengths for Taiwan
Andy McLean, CEO of the UK Semiconductor Centre (UKSC), told DIGITIMES that strong AI growth is driving demand for energy-efficient processors, high-speed connectivity technologies such as photonics, and advanced power management. He said the UK's strengths in optics and other technologies make this a unique moment to advance its semiconductor industry.
Monday 9 November 2026
US Department of Defense commits US$75 million to Halo SiC wafer expansion
The Department of Defense's Office of Strategic Capital (OSC) has offered Halo Industries, a semiconductor startup based in Santa Clara, California, a conditional loan commitment of US$75 million. The funding is expected to attract an equal amount of private capital to expand silicon carbide (SiC) semiconductor wafer manufacturing for defense, AI infrastructure, and high-voltage power electronics, reducing US reliance on overseas critical semiconductor materials.
Monday 9 November 2026
UK chip leader believes US midterms won't disrupt global semiconductor ties
Democrats' sweeping victory in the US midterm elections has raised concerns that the country could slow AI development and data-center construction, but UK technology industry leaders say political change will not alter the semiconductor sector's fundamentally global cooperation model.
Monday 9 November 2026
Taiwanese ICT manufacturer Wah Hong accelerates AI cooling as memory hikes hit electronics
Higher memory prices caused by tight supply weakened demand for consumer electronics, while investment in Wah Hong Industrial's thermal management division weighed on overall third-quarter performance. The company is accelerating development in AI cooling, semiconductor materials, and other high-value applications to reduce its exposure to market cycles.
Monday 9 November 2026
China's YMTC targets 70% domestic chipmaking tools, but advanced NAND still has foreign dependency
China's semiconductor equipment localisation is accelerating, with chipmakers increasing domestic procurement and local suppliers expanding into advanced manufacturing. Yangtze Memory Technologies (YMTC) is emerging as a key example of this shift.
Monday 9 November 2026
India's semiconductor expansion faces testing capacity risks as OSAT investments advance
India's push to expand semiconductor assembly and packaging capacity risks outpacing the development of its chip testing infrastructure, potentially increasing costs and prolonging reliance on overseas facilities.
Monday 9 November 2026
Sino-American Silicon Products posts record revenue in first three quarters of 2026 on AI, energy demand
Sino-American Silicon Products (SAS) is focusing on computing power and electricity, as construction of artificial intelligence (AI) data centers accelerates, demand for high-bandwidth memory (HBM) surges, and the global energy transition continues to advance. By leveraging its dual-track strategy of manufacturing and services, the company is capitalizing on market opportunities, driving consolidated revenue for the first three quarters of 2026 to a record high for the same period.
Monday 9 November 2026
Podcast highlights: Apple hoards supplies via long-term contracts; Intel reverts 18A to Intel 3
Recent earnings reports from Apple and Intel highlight growing supply-chain strain driven by soaring memory costs and massive AI infrastructure build-outs. DIGITIMES analyst Luke Lin identified two supply-chain signals: Apple is locking in capacity through aggressive long-term procurement, while Intel is taking the unusual step of converting 18A capacity back to the older Intel 3 node to chase urgent server CPU demand.
Monday 9 November 2026
GSEO revenue drops 20% in October 2026 on China holiday, delayed launches
Optical lens maker Genius Electronic Optical (GSEO) reported October 2026 consolidated revenue of NT$2.126 billion (approx. US$64.9 million), down 20.41% from September and 5.78% from the same month in 2025, as China's National Day holiday and delayed customer product launches reduced shipments.
Monday 9 November 2026
India roundup: India electronics manufacturing expands amid AI-driven supply constraints
India's electronics sector is drawing fresh investment in semiconductors, optical connectivity and manufacturing capacity, even as AI-driven component shortages threaten production, while consumer brands pursue expansion into new markets.
Monday 9 November 2026
Exclusive: From quantum breakthroughs to industrial reality, UKSC weighs Britain's ambitions at London showcase
From quantum computers built on conventional silicon to semiconductor light sources promising a new generation of secure communications, the breadth of innovation on display at the UK's National Quantum Technologies Showcase offered a striking glimpse into an industry pushing beyond the established boundaries of computing.
Monday 9 November 2026
Weekly news roundup: AI compute race intensifies as DRAM rivals diverge and chipmakers expand investments
This week's coverage highlights accelerating competition across AI infrastructure, semiconductor manufacturing and advanced memory. Sweden launched the NVIDIA-based Sferical One supercomputer as leaders urged transformational AI adoption. DRAM makers remain divided over 4F-squared scaling, while CXMT reported sharply higher revenue and outlined 2027 growth plans. Panasonic's Taiwan plant suffered a fatality-risking explosion, Musk may reconsider Terafab control, SK Hynix expanded its AI investment portfolio, and MediaTek hired former Intel packaging chief Navid Shahriari.
Monday 9 November 2026
TSMC reaffirms foundry focus after report of 3D DRAM plans for Nvidia
Taiwan Semiconductor Manufacturing Co. (TSMC) has pushed back on a report that it is weighing a move into advanced memory chip manufacturing, saying it remains focused on its contract chipmaking business. Industry figures in Taiwan said a large-scale entry into DRAM production looked unlikely in the near term.
Saturday 7 November 2026
US-China trade truce gains breathing room as BIS extends 50% Affiliates Rule suspension into 2027
The US Department of Commerce's Bureau of Industry and Security (BIS) has extended the suspension of its 50% Affiliates Rule until January 10, 2027, from the previous November 9, 2026 deadline.
Saturday 7 November 2026
Quantum computing company IonQ raises 2026 revenue forecast above US$500 million on commercial growth
IonQ raised its 2026 revenue forecast to US$505 million-US$515 million after reporting record third-quarter revenue of US$173.8 million, as its quantum computing business expanded across data centers, defense programs, and enterprise deployments. The results marked a 336% year-over-year increase and reflected the company’s shift from laboratory research toward commercial quantum applications in the US and global markets.