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Monday 8 June 2026
Exclusive: The semiconductor battle behind AI data centers and EVs
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
Monday 8 June 2026
Wingtech sues Nexperia's Dutch entities as cross-border control dispute deepens
Wingtech has launched a lawsuit in China against Nexperia's Dutch entities and related parties, intensifying a dispute that could affect semiconductor supply chains, corporate governance, and cross-border investment rules for customers and investors worldwide. The case adds another layer to a legal battle already spanning China and the Netherlands.
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Monday 8 June 2026
Hitachi and Intel strike collaboration on physical AI and industrial infrastructure
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used worldwide. The partnership targets efficiency, resilience, and faster industrial innovation, with potential implications for factories, power networks, and other critical operations globally.
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.

Monday 8 June 2026
Onsemi promotes 800 VDC power architecture for future AI infrastructure
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.
Monday 8 June 2026
T3EX expands Northeast Asia air freight to serve electronics and chip supply chains
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global shipping remains highly volatile amid geopolitical tensions and adjustments to energy prices and routes.
Sunday 7 June 2026
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to step up sales of its 5nm and 8nm processes to support near-term utilization, according to ZDNet Korea.

Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain capacity rather than orders. He said the company already has visibility into a large volume of 2027 orders as customers rush to secure supply.
Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technology Promotion Agency, according to reports by Nikkei and Reuters.
Friday 5 June 2026
OECD data show China-based semiconductor makers receive outsized industrial support
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024.
Friday 5 June 2026
Samsung's biggest union loses majority status after bonus talks
Samsung Electronics is facing a new shift in labor relations after the Samsung Electronics branch of the Samsung Group Super-Enterprise Union reportedly lost its status as a majority union following a sharp drop in membership after bonus negotiations. The move weakens the union's representation and could further fragment future labor talks and union power at Samsung Electronics.
Friday 5 June 2026
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.
Friday 5 June 2026
NXP chief says factories will lead robot adoption globally
Industrial factories are likely to become the first major market for robots at scale, according to Rafael Sotomayor, NXP President and CEO, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.
Friday 5 June 2026
Sambanova challenges GPU dominance in AI inference at Computex
SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall — and to demonstrate, live on stage, an alternative architecture it calls disaggregated inference running in a production data center.
Friday 5 June 2026
Huawei's Tau Law stirs debate over China's post-Moore's Law chip path

Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed at improving chip performance through optimisation across components, circuits, chips, and systems, even under mature process technologies.

Friday 5 June 2026
Infineon India moves up the value chain as AI data centers boost power-chip demand
Infineon Technologies' India operations are moving beyond traditional engineering support into global ownership roles, as rising demand from AI data centers reshapes the power semiconductor market, according to Vinay Shenoy, managing director of Infineon Technologies India.
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core 12-inch wafer foundry platforms.
Friday 5 June 2026
Global semiconductor market to hit US$1.5 trillion in 2026 as memory surges 250%, WSTS forecasts
The global semiconductor market is on track to nearly double in 2026, reaching US$1.51 trillion — a 90% year-over-year increase — driven overwhelmingly by an extraordinary surge in memory chip demand, according to the World Semiconductor Trade Statistics (WSTS) Spring 2026 forecast released on June 2.
Friday 5 June 2026
Nvidia's Jensen Huang to meet South Korean business leaders beyond HBM sector

Nvidia CEO Jensen Huang is visiting South Korea on June 5 for meetings with major Korean business leaders, as the company's cooperation with local companies broadens beyond high-bandwidth memory into robotics, automobiles, gaming, and cloud infrastructure.

Friday 5 June 2026
Infineon sees early quantum computing gains as finance leads adoption
Infineon Technologies said its long-running work in quantum computing is beginning to pay off, with early demand strongest in finance, chemistry, and life sciences. For global readers, the company's comments signal that quantum systems are moving closer to commercial relevance, even as the market remains early, crowded, and dependent on wider industry cooperation.
Friday 5 June 2026
Foxconn deepens AI push with Intel on inference racks
Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal highlights Intel's bid to regain ground in artificial intelligence (AI), while broadening Foxconn's role in the global AI supply chain.