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Friday 5 June 2026
Global semiconductor market to hit US$1.5 trillion in 2026 as memory surges 250%, WSTS forecasts
The global semiconductor market is on track to nearly double in 2026, reaching US$1.51 trillion — a 90% year-over-year increase — driven overwhelmingly by an extraordinary surge in memory chip demand, according to the World Semiconductor Trade Statistics (WSTS) Spring 2026 forecast released on June 2.
Friday 5 June 2026
Nvidia's Jensen Huang to meet South Korean business leaders beyond HBM sector

Nvidia CEO Jensen Huang is visiting South Korea on June 5 for meetings with major Korean business leaders, as the company's cooperation with local companies broadens beyond high-bandwidth memory into robotics, automobiles, gaming, and cloud infrastructure.

Friday 5 June 2026
Infineon sees early quantum computing gains as finance leads adoption
Infineon Technologies said its long-running work in quantum computing is beginning to pay off, with early demand strongest in finance, chemistry, and life sciences. For global readers, the company's comments signal that quantum systems are moving closer to commercial relevance, even as the market remains early, crowded, and dependent on wider industry cooperation.
Friday 5 June 2026
Foxconn deepens AI push with Intel on inference racks
Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal highlights Intel's bid to regain ground in artificial intelligence (AI), while broadening Foxconn's role in the global AI supply chain.
Friday 5 June 2026
Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market
Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly shaped by Nvidia's dominance in AI training and inference.
Friday 5 June 2026
Arm says Taiwan powers its rise as agentic AI lifts PC growth
Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.
Friday 5 June 2026
TSMC CEO says rising profits mean greater social responsibility, clarifies bonus considerations
Taiwan Semiconductor Manufacturing Company (TSMC) held its shareholders meeting on June 4, during which CEO C.C. Wei addressed recent talk surrounding its employee bonus system. He opened the meeting by preemptively clarifying the issue, saying there are misconceptions in the public discussion.
Friday 5 June 2026
TSMC says AI demand is straining entire supply chain, not just chipmakers
TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment, and upstream suppliers.
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute chip IP "ART" now in testing and aimed at the power- and area-sensitive edge AI device market. The company says it expects to launch a commercial product in about two years.
Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices.
Thursday 4 June 2026
TSMC chairman dismisses rival cluster pushes, says Taiwan's supply chain remains unmatched
TSMC chairman C.C. Wei spoke at a media briefing on June 4, 2026, after the company's shareholders' meeting. South Korea's push to build a semiconductor cluster, Arizona's efforts to establish a supply chain ecosystem, and Nvidia CEO Jensen Huang's recent trip to South Korea were all topics of discussion.
Thursday 4 June 2026
TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus
TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year in which the world's largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.
Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea.

Thursday 4 June 2026
TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and operating burden. Chairman C.C. Wei said the company's long-term edge still rests on technology, manufacturing efficiency, and customer trust.
Thursday 4 June 2026
Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom
Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026, up 21.3% compared with the same period in 2025, surpassing the NT$1 trillion mark. This performance not only underscores the park's strong expansion momentum but has also reinforced its position at the core of the global high-tech supply chain.
Thursday 4 June 2026
TSMC sees no sign of capex slowdown as demand stays strong
TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US, and growing interest in robots and autonomous vehicles.
Thursday 4 June 2026
Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, Nikkei Asia reported.

Thursday 4 June 2026
EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route for China to extend AI chip performance in the post-Moore's Law era.
Thursday 4 June 2026
Exclusive: How China's subsidized SiC boom is driving global prices to the floor
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping the global compound semiconductor industry.
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a compound semiconductor material whose ability to handle high voltages and large currents has made it a critical enabler of the industry's shift toward 800-volt high-voltage direct current (HVDC) power systems.
Thursday 4 June 2026
SK and TSMC deepen HBM, advanced packaging tie-up
SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed how to shape the future of the AI ecosystem. The meeting underscored closer ties between the two companies, which plan further to strengthen cooperation in next-generation HBM and advanced packaging.
Thursday 4 June 2026
BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to The Elec.

Thursday 4 June 2026
Taiwan courts the world's AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its world-leading chip ecosystem.