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Tuesday 14 July 2026
Quartz component makers raise prices as material costs bite

Quartz component suppliers are raising prices as higher raw material costs from gold wire and ceramic bases squeeze margins. Industry sources said ceramic base prices could climb by double-digit percentages, in some cases even doubling, pushing makers to pass on some of the increases.

Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now expected in the first or second quarter of 2027. The overhaul is aimed at meeting listing requirements on corporate governance, independence, and the rule that senior executives cannot hold concurrent cross-company roles.
Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking a shift from laboratory research to engineering validation, small-batch tape-outs and early industrialisation.

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.

Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with prototypes potentially ready by the end of this year, The Elec reported, citing semiconductor industry sources.

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced semiconductor capacity and AI server infrastructure creates new demand for precision-engineered components. Companies traditionally focused on powertrain, transmission, and safety systems are leveraging decades of manufacturing expertise to secure positions in semiconductor equipment and AI liquid-cooling supply chains, creating new growth engines beyond their core automotive businesses.

Monday 13 July 2026
Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to partner with Intel to manufacture its chips. While Apple could benefit from expanding its chip suppliers, the episode also shows the power of Intel's government backing as the US seeks to reshore its semiconductor industry.

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip scheduled to be manufactured at Samsung's Taylor, Texas, fab using the company's 2nm process.

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture that can deliver power from both sides of the chip. Industry observers say Intel and Samsung Electronics are both taking on harder-to-manufacture technologies in the ultra-advanced process race as they try to catch up with TSMC.

Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated revenue reached NT$442.68 billion (approx. US$13.8 billion) in June, up 6.2% month-over-month and 67.9% year-over-year. For the first six months of 2026, revenue totaled NT$2.4 trillion, representing a 35.6% year-over-year increase.
Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced packaging. The expansion is meant to meet surging global demand for high-compute chips and advanced packaging technology.
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the power, water and site development needed to support the expansion.
Monday 13 July 2026
SK Group chair: US investment plan will far exceed US$35B

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the amount he said the group is already putting into the country—though he did not disclose the plan's size, timing or components.

Monday 13 July 2026
Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.

Monday 13 July 2026
Applied Materials India eyes larger role in global chip equipment development
Applied Materials India is preparing to take on broader ownership of selected semiconductor equipment product initiatives, as the US-based chipmaking equipment supplier expands its R&D and validation base in Bengaluru.
Monday 13 July 2026
US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030

A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global markets, according to a new report. The findings suggest the manufacturing push backed by Washington's CHIPS Act may depend on sustained funding and closer industry cooperation to avoid bottlenecks.

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including FormFactor, Advantest, Tokyo Electron (TEL), Teradyne, MPI, Keysight, Anritsu, ficonTEC, ADS Tech (ADST), All Ring Tech, GMT Global, Chroma ATE, Hon Precision, and WinWay Technology are rushing to secure a foothold in the emerging "four-stage optoelectronic testing" market.
Monday 13 July 2026
Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total capacity. He said the memory market has entered a broad shortage, and that Nanya may add a fifth strategic partner, while 2027 capital expenditure could climb to as much as NT$200 billion (approx. US$6.2 billion), 4x the spending in 2026.
Monday 13 July 2026
Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the supply chains of automakers, industrial firms, and device makers worldwide. The remarks also hint at how shifting global demand could influence where next-generation semiconductors get built.

Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local chipmaking capabilities, reduce dependence on imports, and deepen India's role in a sector that supports electronics production worldwide, from phones to data centers.
Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing. The semiconductor testing company said the project would be its largest overseas expansion and was aimed at addressing a growing US gap in backend packaging and testing capacity.
Monday 13 July 2026
India roundup: India's chip strategy tests its ability to build a competitive ecosystem

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.