CONNECT WITH US
Thursday 25 June 2026
Taiwan electronics production jumps 93% in first five months of 2026 on AI boom
Taiwan's Ministry of Economic Affairs (MOEA) released industrial production statistics for May 2026 on June 24, reporting that Taiwan's computer, electronic products, and optical products sector—led by servers, switches, semiconductor testing equipment and components, and solid-state drives—saw production increase 36.62% year over year. This was attributed to the rapid expansion of artificial intelligence (AI) applications, continued strong demand for computing power, and aggressive capacity expansion in the semiconductor industry. Cumulatively, from January to May, production increased 93.17% compared with the same period in 2025, ranking first among all industrial sectors.
Thursday 25 June 2026
IntelliEPI targets record 2026 revenue amid InP substrate shortages
Compound semiconductor epitaxial wafer maker IntelliEPI said AI-driven high-speed transmission demand continues to lift the indium phosphide (InP) market, and it expects revenue to keep rising in 2026 and set another record. The company's biggest challenge remains a shortage of InP substrates, prompting it to rely mainly on Japanese suppliers while helping German manufacturers accelerate mass production of InP substrates.
Thursday 25 June 2026
EU clears EUR76M in German aid for Munich quantum chip-testing plant
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing equipment facility in Munich, the Commission announced. The approval is the latest step in Brussels' push to reduce Europe's reliance on foreign chip technology and strengthen its industrial autonomy.
Thursday 25 June 2026
China specialty foundry Hua Hong Grace rides 40nm low-power process and Wuxi 12-inch ramp
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process has entered stable mass production while its Wuxi 12-inch line continues to ramp.
Thursday 25 June 2026
Sigurd expands AI testing capacity as demand keeps facilities full
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
Thursday 25 June 2026
ASE sees AI demand stretching packaging capacity into 2030
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company had built over the past few years was absorbed almost immediately.
Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to diversify supply-chain risk make deeper global investment inevitable.
Thursday 25 June 2026
Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the global AI race is rapidly expanding beyond GPU compute, with optical interconnects, silicon photonics, and CPO emerging as the next major battleground.
Thursday 25 June 2026
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
Thursday 25 June 2026
China moves to build helium reserve as Nippon Sanso sets over 30% price hike

Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across its helium product line by an average of more than 30% starting July 2026, citing persistent tightness in global supply driven in part by rising geopolitical risks in the Middle East.

Thursday 25 June 2026
TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
Thursday 25 June 2026
ByteDance's reported AI chip orders mark breakthrough for Chinese GPU maker Iluvatar CoreX
ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet for China's domestic AI chip industry.
Thursday 25 June 2026
IC design firms race to secure packaging capacity
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
Thursday 25 June 2026
Techzone builds circular economy to tap rising semiconductor expansion demand
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand driven by semiconductor capacity expansion. Together with its subsidiaries Han-Yang Technology Renewable Energy and Sunlight Environment, the company has a combined annual treatment capacity of 239,000 tons.
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
Wednesday 24 June 2026
Qualcomm, ByteDance talks signal new phase in China AI chip diversification
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
Wednesday 24 June 2026
IBM targets Anderon venture to anchor quantum wafer supply
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon, the independent subsidiary is set to begin production this year, a decade after IBM began exploring applications of quantum computing.
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.

Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond the standard Galaxy S27 and S27 Plus models and into the premium Galaxy S27 Ultra and Galaxy Z Fold 8, according to The Bell.

Wednesday 24 June 2026
Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask Technology, also known as New Ray Mask, where Chiu serves as chairman, has begun IPO listing guidance, marking another step in his shift from foundry operations to China's chip materials supply chain.
Wednesday 24 June 2026
China's chip-equipment push starts to weigh on Japanese suppliers

China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with five major Japanese suppliers posting a combined 12% drop in China sales for the fiscal year ended March 2026, Nikkei reported.

Wednesday 24 June 2026
AI server VRM shifts drive power shortages and stretch lead times past 6 months
The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads pushing the industry from doubler-based designs to direct native multi-phase control. Industry insiders say the growing shortage of power components has three main causes: inventory corrections over the past three years that have left stockpiles too low, AI-related applications are surging rapidly, and a shift away from Chinese supply chains is gaining momentum amid geopolitical shifts.
Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private placement to expand chip equipment capacity, strengthen wafer reclamation services, and accelerate high-end semiconductor tool R&D.
Wednesday 24 June 2026
Samsung's Texas fab gains momentum with the arrival of ASML engineers

Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML Korea, the Dutch lithography equipment giant's South Korean unit, have been dispatched to the Taylor facility and are expected to remain on site for roughly six to eight weeks, according to Korean industry publication DealSite.

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.