A recent survey found that 36% of nearly 120 US manufacturers have already reshored or are actively reshoring production, while more than 60% have capital investment plans for doing so. Taiwan's investment in the US is also rising, and Taiwanese firms' moves will become clearer after the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) completes plans by the end of 2026 for overseas science parks in Texas and Arizona and begins soliciting investment.

South Korea and the US have hit an impasse in final-stage investment talks over commercial viability safeguards, with South Korean President Lee Jae-myung saying that some parts are hard to accept. The deadlock is raising concerns that the months-long negotiations over South Korea's investment plans in the US could collapse.

Samsung Electronics has formed a dedicated organization to develop and deploy robots in its semiconductor fabs, with equipment preventive maintenance (PM) expected to be the first target as the chipmaker pushes automation into work that still depends heavily on engineers.

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project in Bao'an, Shenzhen, with total investment expected to be at least CNY12 billion (approx. US$1.79 billion). The new site is designed to add four factories and expand the company's ability to develop, manufacture, and deliver high-end flip-chip ball grid array (FCBGA) products for AI, high-performance computing (HPC), and advanced packaging customers.

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator (FD-SOI), while China is building a domestic supply chain spanning substrates, foundry capacity, and chip design.

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon photonics (SiPh), silicon germanium (SiGe), and advanced packaging capacity in the Hokuriku region, as demand from AI data centers accelerates.

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with ByteDance reportedly preparing to spend CNY100 billion (US$14.9 billion) a year on large-scale chip substrate purchases by 2030. Supply chain sources say the scramble for packaging substrate capacity is intensifying across Huawei HiSilicon, Hygon Information Technology, ByteDance, and major outsourced semiconductor assembly and test (OSAT) players, even as the industry races to expand output.

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land and 12,215.54 square meters of building space in the Nantun District, Taiwan, for NT$1.17 billion (approx. US$36.82 million), to be used for future capacity expansion. The purchase marks the company's seventh land acquisition in 2026, with the acquisitions mainly involving ready-to-use factory buildings and land, in a move suggesting it is preparing for co-packaged optics (CPO).

South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management chips improve conditions across mature-node manufacturing.

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on AI servers and high-performance computing applications, driving brisk orders in the first half of 2026 and strong utilization rates. Capacity is now close to fully booked, and customers have also begun laying out long-term orders for the next one to two years.

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China and orders for panel-level advanced packaging equipment, according to Star Market Daily, Securities Times, and East Money.