India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.

SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.

As Taiwan's equity markets continue to surge on enthusiasm surrounding artificial intelligence (AI), concerns about a potential AI-driven bubble have grown louder among investors and analysts.

At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.

Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.

When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X — night markets, fried food, and family. By the time he hosted more than 30 executives at a brick-walled restaurant six days later, the week had traced something much larger than a Computex schedule. It had mapped, dinner by dinner and post by post, the anatomy of the world's most consequential AI supply chain.

The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication plant here in Sunnyvale, California, employing 8,000 people at its peak. Then, like much of America's chip manufacturing base, it moved to Asia — to Taiwan, to Korea, to the supply chains that would come to define the global electronics industry for the next three decades.

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.

The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing a document it has seen.

As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.

Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.

Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.

Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.

Snowflake, the cloud data company at the center of the artificial intelligence boom, said on Wednesday that it would spend US$6 billion over the next five years on Amazon Web Services infrastructure, deepening a partnership aimed at helping corporations move from experimental AI projects to large-scale deployment of autonomous software agents.

During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners working together toward shared goals.

Nvidia's new Taiwan headquarters is expected to begin construction by the end of 2026 and officially open in 2030, and CEO Jensen Huang is propagating that Taiwan "needs more electricity" to fund projects. With the AI cluster revolving around Nvidia, Taiwan Power Company (Taipower) estimates that power demand in the Beitou-Shilin Technology Park (BSTP) area will reach approximately 180MW.

Chunghwa Precision Test Tech. completed its board election at the 2026 annual shareholders' meeting on May 27 as the semiconductor test interface maker prepared for rising AI chip demand and a planned capacity expansion over the next two to three years. The company announced the reappointment of four board members and the retention of three independent directors as it outlined near-term production and market plans.

Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported, citing industry sources.

UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for future operating growth.

Hotai Motor Co. told shareholders on May 27 that Taiwan's auto market was expected to strengthen in 2026 as demand for semiconductors and AI applications supported exports and the broader economy. The company forecast the full-year vehicle market could reach 440,000 units, attributing the outlook to a stabilizing global economy, policy continuity and a pickup in replacement demand.

Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share of revenue continuing to rise. The company has begun expanding capacity for its electronic-grade isopropyl alcohol (IPA) and propylene glycol methyl ether (PM) lines.

Dreame Technology, a Chinese consumer electronics maker, has formed nearly 1,000 affiliated companies in its ecosystem since the end of 2024. This breakneck pace of expansion signals the ambitions of its leadership to unearth growth opportunities across the broader Chinese tech sector, although some media outlets question the sustainability of the business model.

TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.