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Tuesday 6 October 2026
TSMC Texas-Terafab buzz drives Taiwan contractors to move fast
TSMC has not officially announced anything, but Taiwan's semiconductor facility engineering supply chain is already rushing to Texas after reports that the company is discussing a collaboration with Elon Musk's "Terafab" plan. DYC chairman Chung-Ping Hsieh said his company only received the news last week and has already begun mapping out a Texas strategy, while some faster-moving Taiwan contractors have even set up local offices.
Tuesday 6 October 2026
AMD to expand Taiwan supply chain investment as AI demand drives capacity needs
AMD CEO Lisa Su said the company plans to further increase investment in Taiwan's semiconductor supply chain as demand for CPUs, GPUs, and AI computing continues to outpace available capacity.
Tuesday 6 October 2026
China's 15th five-year plan elevates PCB role in AI supply chains
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have released the 15th Five-Year Plan for the development of the electronic information manufacturing industry, aiming to push revenue at large-scale enterprises above CNY30 trillion (US$4.5 trillion) by 2030 and foster world-class companies in semiconductors, advanced computing, consumer electronics, basic electronics, and energy electronics.
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking to address energy and performance bottlenecks as high-speed computing shifts increasingly from copper to optical interconnects.
Tuesday 6 October 2026
TSMC tops global FDI ranking as AI infrastructure redraws overseas investment
The direction of global corporate investment in physical assets is becoming clearer. According to the fDi Report 2026 and an analysis by Visual Capitalist, announced greenfield foreign direct investment by multinational companies exceeded US$1.3 trillion in 2025, up 2.2% from a year earlier.
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan and die-shot images posted by Kurnal Insights show that the flagship SoC in the Huawei Mate 90 Pro Max uses two vertically stacked dies rather than a traditional single-plane chip design.
Tuesday 6 October 2026
Jedec unveils new standard for silicon photonics reliability qualification and testing
Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid growth due to its potential to replace copper interconnects amid AI infrastructure demand surges.
Tuesday 6 October 2026
TSMC expansion pushes Da Yi Cheng Technology's orders over NT$10 billion, visibility through 2028
Da Yi Cheng Technology (DYC) has rapidly expanded in recent years, benefiting from the global semiconductor capacity expansion wave, which has driven demand for second-phase electrical and mechanical installation work. The company is now applying its experience in the US, Japan, Germany, and Singapore.
Tuesday 6 October 2026
Column: How semiconductors' evolution foretells the rise of AI data centers
Semiconductors and AI data centers share a striking number of similarities.
Monday 5 October 2026
Samsung opens Boston quantum design lab to expand US research push
Samsung Electronics has set up a Quantum Design Lab in the Boston area of Massachusetts and started hiring for it, marking a new phase in the company's push into quantum computing. The effort places the South Korean tech giant closer to US research hubs and signals a broader attempt to connect semiconductor expertise with quantum development.
Monday 5 October 2026
Southern Taiwan Science Park revenue climbs 36.5% in first eight months of 2026
Companies in the Southern Taiwan Science Park (STSP) posted record revenue of NT$2.495124 trillion (US$78.59 billion) in the first eight months of 2026, up 36.5% from a year earlier, according to the STSP Bureau. The bureau said the growth reflected the global AI boom and the park's expanding role in the high-tech supply chain.
Monday 5 October 2026
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers are planned. Industry sources said her core mission was to meet TSMC and, more importantly, to coordinate capacity with packaging, testing, and substrate suppliers that are facing tight supply and rising prices.
Monday 5 October 2026
Taiwan teams accelerate 2D semiconductor transfer with published research in Nature
Researchers in Taiwan are intensifying efforts to turn 2D semiconductor materials from basic science into practical applications, with a series of studies published in Nature. The latest work, published in the October 1 issue of the leading scientific journal, follows another Nature paper published on July 1, 2026, underscoring the push in Taiwan's academia to speed up research in next-generation semiconductors.
Monday 5 October 2026
China's ASML DUV stockpile spurs calls to close export-control loophole
Chinese semiconductor manufacturers have stockpiled hundreds of immersion deep ultraviolet (DUV) lithography systems worth billions of dollars in recent years, prompting a Washington think tank to call for tighter export controls on equipment that could still support advanced chip production.
Monday 5 October 2026
Cheap SiC substrates ignite demand wave, reshape ecosystem
Prices for low-cost 6-inch silicon carbide (SiC) substrates, after years of capacity expansion and brutal price wars, are now showing clear signs of bottoming out in the second half of 2026. The cheap material has also unleashed wave after wave of demand, with China's domestic stimulus tightening SiC wafer fabrication capacity and spilling over into Taiwan's supply chain.
Monday 5 October 2026
AI hardware is propping up world trade, and pulling it toward East Asia and North America
The resilience of global goods trade amid tariff escalation and an energy shock is real, but it rests on a narrow base. A breakdown of ITC Trade Map export data shows that a handful of AI hardware categories, led by servers, processors and memory chips, account for well over a third of the growth in world exports, and that the gains are flowing overwhelmingly to a small group of East Asian exporters and their North American customers.
Monday 5 October 2026
TSMC, Intel named as Musk's Terafab ambitions face reality check
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel and TSMC for assistance.
Monday 5 October 2026
Chipmakers turn balance sheets into AI sales tools: How customer financing is becoming the new industry norm
Recent reports citing Anthropic's IPO filings show that Broadcom has agreed to provide up to US$42 billion in convertible-note financing to help fund the AI company's infrastructure spending, with Anthropic expected to become Broadcom's largest compute customer in 2027.
Monday 5 October 2026
Japan's strategic push to reclaim silicon supremacy with Rapidus
In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its potential customer base and help clients develop proprietary silicon. Established in 2022 to spearhead Japan's return to cutting-edge manufacturing, Rapidus is targeting the commercial production of advanced 2-nanometer logic chips by the second half of fiscal 2027.
Monday 5 October 2026
ESMT 3Q26 revenue jumps 58%, sets another record
Elite Semiconductor Microelectronics Technology (ESMT) reported September consolidated revenue of NT$7.461 billion (approx. US$234 million), up 470.23% from NT$1.308 billion a year earlier but down 5.62% from August. For the first nine months of 2026, revenue reached NT$43.363 billion, up 343.91% year-on-year.
Monday 5 October 2026
Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains

Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien, a Taiwanese scientist at the Agency for Science, Technology and Research's Institute of Microelectronics (A*STAR IME), is one example.

Monday 5 October 2026
TSMC emerges as potential Terafab partner as suppliers see over 80% chance of Musk deal
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium, disclosed that the chipmaker is in discussions with Elon Musk's Terafab over potential cooperation.
Monday 5 October 2026
Micronex plans Sanand lead-frame plant as India expands chip packaging supply chain
Micronex Technology plans to build a semiconductor lead-frame factory in Sanand, Gujarat, seeking to localize a packaging component as India expands its chip assembly and testing industry. The startup's agreement with Kaynes Semicon connects the proposed plant to Gujarat's growing semiconductor ecosystem, while similar supplier partnerships elsewhere point to a wider push for domestic materials and components.
Monday 5 October 2026
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development beyond hybrid bonding into a broader range of packaging technologies. The agreement brings Besi into Applied's Equipment and Process Innovation and Commercialization (EPIC) Center as an Innovation Partner, with the companies seeking to accelerate the transition from research to manufacturing.
Monday 5 October 2026
Weekly news roundup: Musk looms large as AI chip boom drives capacity expansion and geopolitical risks
Across the week, Taiwan-linked semiconductor groups and their partners continued expanding capacity, while AI demand, export controls, and financing structures shaped the industry outlook. ASML's push to raise EUV output comes as Musk and Huang warn China may narrow the lithography gap by 2030. TSMC is also tied to Texas, Singapore, and Tesla projects, while ASE added test capacity. Meanwhile, a US smuggling case and Broadcom's Anthropic financing highlight growing geopolitical and financial risk.