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Tuesday 14 July 2026
Six-inch SiC substrate price rebounds as supply tightens

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new orders becoming increasingly hard to absorb.

Tuesday 14 July 2026
Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx. US$110.62 million) to CNY850 million, up 231.16% to 275.31% from CNY226 million a year earlier, according to a forecast filed with the Shenzhen Stock Exchange. Diluted earnings per share are seen at CNY0.2290-0.2595, versus CNY0.0706 in the same period of 2025.
Tuesday 14 July 2026
Bosch starts sample production at its first US chip plant after securing up to US$225 million

German automotive supplier and chipmaker Bosch has begun sample production at its first US semiconductor factory after finalizing an agreement for up to US$225 million in federal funding. Commercial production of silicon carbide chips at the Roseville, California, site is expected to begin in 2026.

Tuesday 14 July 2026
Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel

US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.

Tuesday 14 July 2026
TSMC and Vanguard drive Taiwan's silicon foundry revenue up 54% YoY in June

Taiwan's silicon foundry industry posted a strong performance in June 2026, with aggregate revenue reaching US$15,131.2 million, up 5.9% from May and 54.0% from a year earlier — underscoring the sector's continued ride on AI and advanced-node chip demand.

Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneously bets on AI compute and storage.

Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an industry-wide upcycle rather than gains concentrated in a single segment.
Tuesday 14 July 2026
Intel concentrates its European chipmaking in Ireland with EUR5 billion Leixlip expansion
Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping far larger fab projects in Germany and Poland. The move signals that, under a turnaround intended to align capacity with real demand, the chipmaker sees consolidated, upgraded capacity in a proven site — rather than new greenfield megafabs — as its route back to competitiveness in the AI era.
Tuesday 14 July 2026
UMC pushes into silicon photonics in Singapore to ride AI's connectivity crunch
United Microelectronics Corp (UMC) is moving into silicon photonics, positioning itself to address one of the defining bottlenecks in artificial-intelligence data centers: the speed at which chips can talk to one another. In doing so, the mature-node specialist is turning Singapore into a manufacturing base for a technology that uses light rather than electrical signals to move data across AI clusters.
Tuesday 14 July 2026
Liying tops NT$100 million as AI chip demand lifts semiconductor services
Liying said revenue reached a quarterly record of NT$108 million in the second quarter of 2026, crossing the NT$100 million (US$3.11 million) mark for the first time as strong demand for AI chips kept semiconductor utilization rates high. The company also reported record first-half revenue of NT$206 million, reflecting continued demand for its circular-economy services tied to waste hydrofluoric acid and calcium fluoride sludge.
Tuesday 14 July 2026
C Sun sees advanced packaging and PCB demand driving 2026 revenue
C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment demand. The PCB and semiconductor equipment maker said the outlook remained positive as foundry, outsourced semiconductor assembly and test, IC substrate, and high-end multilayer board customers increased capital spending.
Tuesday 14 July 2026
Gudeng Precision Industrial posts record second quarter revenue on advanced semiconductor carrier demand
Gudeng Precision Industrial Electronics reported record June revenue and its highest quarterly sales in the second quarter of 2026, driven by stronger demand for EUV mask carriers and 12-inch wafer carriers as advanced-node manufacturing accelerated. The Taiwan-based supplier said momentum should remain strong in the second half of 2026, keeping full-year results on pace to challenge another high.
Tuesday 14 July 2026
iST June revenue rose as AI chip validation demand strengthened
Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based chip validation and analysis provider said the result reflected stronger demand tied to AI chip validation and a spillover effect from capacity constraints at packaging and testing plants.
Tuesday 14 July 2026
Ion Electronic Materials posts 30% June revenue growth on advanced gas demand
Ion Electronic Materials reported June 2026 consolidated revenue of NT$51.852 million (US$1.61 million), up 30% from a year earlier, as demand for advanced gases continued to expand. First-half consolidated revenue reached NT$315 million, down 3% from the same period in 2025, mainly because equipment revenue was absent.
Tuesday 14 July 2026
Trusval sets record first-half revenue as AI factory demand pushes orders to 2027
Trusval Technology posted record revenue in the second quarter and first half of 2026, supported by demand tied to global AI infrastructure buildouts and continued expansion of advanced process and advanced packaging capacity by semiconductor makers. The company said order visibility has now extended through 2027.
Tuesday 14 July 2026
Quartz component makers raise prices as material costs bite

Quartz component suppliers are raising prices as higher raw material costs from gold wire and ceramic bases squeeze margins. Industry sources said ceramic base prices could climb by double-digit percentages, in some cases even doubling, pushing makers to pass on some of the increases.

Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now expected in the first or second quarter of 2027. The overhaul is aimed at meeting listing requirements on corporate governance, independence, and the rule that senior executives cannot hold concurrent cross-company roles.
Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking a shift from laboratory research to engineering validation, small-batch tape-outs and early industrialisation.

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.

Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with prototypes potentially ready by the end of this year, The Elec reported, citing semiconductor industry sources.

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced semiconductor capacity and AI server infrastructure creates new demand for precision-engineered components. Companies traditionally focused on powertrain, transmission, and safety systems are leveraging decades of manufacturing expertise to secure positions in semiconductor equipment and AI liquid-cooling supply chains, creating new growth engines beyond their core automotive businesses.

Monday 13 July 2026
Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to partner with Intel to manufacture its chips. While Apple could benefit from expanding its chip suppliers, the episode also shows the power of Intel's government backing as the US seeks to reshore its semiconductor industry.