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Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer ceramic capacitor (MLCC) embedded semiconductor substrates at its Vietnam facility to strengthen its position in the AI semiconductor supply chain.
Tuesday 14 April 2026
Samsung 2nm yields reportedly remain below mass production threshold

Samsung Electronics is nearing a technical milestone for its 2nm process, but yields are reportedly still below the level required for stable mass production, raising questions about its ability to secure major foundry customers for the next-generation node.

Tuesday 14 April 2026
JCET CEO sees robotics extending automotive semiconductor growth

China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy vehicles and vehicle intelligence. As cars become more software-defined, semiconductor content and system complexity are rising, while electronic architectures shift from distributed systems toward centralized, platform-based designs.

Tuesday 14 April 2026
JCET advances CPO, glass substrates to capture AI packaging demand
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres, and high-performance computing.
Tuesday 14 April 2026
Samsung Foundry advances space semiconductor chip and technology development
As global companies unveil plans for space AI data centers, South Korean firms are prioritizing space-related technology as a new growth driver. Samsung Electronics' foundry division is reportedly actively developing space semiconductors and related foundry technologies.
Tuesday 14 April 2026
King Yuan Electronics posts record 1Q26 revenue, raises capex to NT$50 billion
Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing company King Yuan Electronics (KYEC) reported a strong first quarter of 2026 despite the typical seasonal slowdown.
Monday 13 April 2026
Global chip equipment sales reach record US$135 billion as AI drives investment surge

Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier, driven by investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the global semiconductor industry association, said.

Monday 13 April 2026
Japan funds AI chip ecosystem around Rapidus

Japan is accelerating efforts to rebuild a domestic advanced semiconductor ecosystem, with Rapidus at the center of a state-backed push spanning 2nm logic, advanced packaging, and AI chip demand creation.

Monday 13 April 2026
Gudeng targets record 2026 revenue on EUV pod and FOUP demand surge
Taiwan's Gudeng Precision Industrial is set to sustain double-digit revenue growth in 2026, buoyed by robust demand for EUV reticle pods and FOUP wafer carriers as advanced-node production and AI-driven applications accelerate across global semiconductor markets.
Monday 13 April 2026
Taiwan's AI revenue boom masks deeply divided industry: 1Q26 data analysis
The headline numbers for Taiwan's listed tech companies in the first quarter of 2026 are strong, but a sector-by-sector breakdown of 238 companies reveals a story far more nuanced than the AI-server narrative dominating the financial press. Growth is heavily concentrated, structurally bifurcated, and in some cases, arithmetically misleading.
Monday 13 April 2026
Taiwan's monthly exports top US$80 billion for first time, fueled by AI demand

Taiwan's exports rose to a record high in March, supported by demand for artificial intelligence (AI) and memory-related products, according to the Ministry of Finance.

Monday 13 April 2026
Taiwan DDI makers see 1Q26 revenue decline; small to mid-size demand remains weak
Taiwanese display driver IC (DDI) manufacturers have reported broadly declining revenues for the first quarter of 2026, reflecting ongoing challenges in the small- and mid-size segments. Novatek posted NT$23.145 billion (US$728 million), down 14.7% year over year; Raydium recorded NT$5.437 billion, down 6.7%; Fitipower had NT$4.501 billion, down 3.4%; Ilitek reported NT$3.918 billion, down 14.4%; and FocalTech saw NT$2.474 billion, down 17.3%. Only Sitronix bucked the trend, posting a robust 23% year-over-year increase to NT$5.329 billion.
Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI) demand accelerated the adoption of advanced nodes and advanced packaging, lifting both foundries and equipment suppliers.

Monday 13 April 2026
Silicon photonics scaling hits wafer testing bottleneck
AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The race to commercialize these technologies is accelerating across the semiconductor industry.
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
Monday 13 April 2026
Hormuz conflict exposes Southeast Asia's energy fault lines
A blockage of the Strait of Hormuz following conflict between the US and Iran is raising energy supply risks for Southeast Asia, with import-dependent economies most exposed. If the conflict continues, the region's recent gains from supply chain shifts could begin to erode.
Monday 13 April 2026
Supreme Court ruling stalls Taiwan-US trade deal, zero-tariff car imports in limbo
Taiwan and the US signed the Agreement on Reciprocal Trade (ART) on February 13, 2026, capping 10 months of negotiations. The deal set a reciprocal tariff of 15% without stacking and secured Taiwan the most favorable terms yet under Section 232 for semiconductors. But the US Supreme Court's invalidation of most of President Donald Trump's reciprocal tariffs has since frozen the agreement. Taiwan's Executive Yuan cannot submit it to the Legislative Yuan for review, and the prospect of zero-tariff US car imports has stalled along with it.
Monday 13 April 2026
Taiwan ramps up science park expansion as TSMC growth pushes capacity limits
Powered by surging semiconductor investment—led by TSMC—Taiwan's science parks are nearing full capacity, accelerating government efforts to expand land, infrastructure, and next-generation industry clusters.
Monday 13 April 2026
FormFactor and MPI vie to break SiPh test bottleneck as ficonTEC reportedly exits
As AI data centers officially enter the silicon photonics (SiPh) era, the industry faces severe challenges in testing accuracy and throughput on the path toward mass production of co-packaged optics (CPO) technology. This has drawn close attention to upstream test supply chain dynamics.
Monday 13 April 2026
Samsung caught between worker payouts and chip ambitions
South Korean tech giant Samsung Electronics is facing a large-scale strike threat, and whether it will extend into May remains an open question, as labor-management negotiations remain at a deadlock. The union's demand for a substantial allocation of a performance bonus has widened the gap between the two sides, raising the risk of industrial action.
Monday 13 April 2026
India roundup: Domestic chip firms anchor India's semiconductor ambitions

India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating its China ties. IndieSemiC and Kaynes target local chip gaps despite uncertain demand, and Cyient's Kinetic deal boosts power IC capabilities. Meanwhile, security-driven supplier shifts and new export opportunities highlight India's evolving strategic and industrial positioning.

Monday 13 April 2026
DIGITIMES Insight: US MATCH Act tightens export noose while Intel swaps debt for control and Nvidia co-opts rivals
The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES analyst Luke Lin.
Monday 13 April 2026
SAS Group's green and AI pivot gains traction
SAS Group's strategic shift into renewable energy, AI-related semiconductor materials, and automotive components signals growing resilience for global energy and tech supply chains, offering long-term recurring revenue through integrated hardware and service platforms and enhanced worldwide positioning for geopolitical robustness.
Monday 13 April 2026
Taiwan's chip program covers 200+ high-end devices to boost advanced IC design talent
The Chip-based Industrial Innovation Program (Taiwan CBI), a decade-long, NT$300 billion (US$9.4 billion) initiative launched by the Executive Yuan to support academic and research institutions in acquiring costly semiconductor equipment, has begun to achieve initial results. According to a report from the National Science and Technology Council (NSTC), over 200 key semiconductor-related devices are now available to provide regular fabrication and implementation services, becoming a major boost for training advanced IC design talent.
Sunday 12 April 2026
US expands tech curbs on China with MATCH Act and FCC testing ban proposal

US lawmakers from both parties have recently introduced a new bill aimed at further restricting China's access to advanced semiconductor manufacturing equipment. The move seeks to strengthen efforts to curb China's ambitions in semiconductor development and to achieve closer alignment with allies such as the Netherlands and Japan on export controls.