IC design, distribution
  • Fingerprint sensor demand to soar from 5G phones
    Fingerprint recognition will continue to be a major feature for smartphones next year, with optical and ultrasonic in-display sensors to be two main options for device vendors. Taiwan-based Goodix Technology is set to ramp up shipments for optical...
  • Hisilicon to sell IoT chip modules on the open market
    Hisilicon Technologies, a chip arm of Huawei, will be ready to sell its IoT chip modules on open market in early 2020 at the earliest, according to company technology vice president Fengguo Yang.
  • Oppo crosses into the mobile chip business
    Chinese handset vendor Oppo is currently developing a mobile processor in house, and the chip, dubbed M1, is an auxiliary processor, according to a China-based tech.qq.com report, citing company sources.
  • 5G smartphones incorporating ultrasonic or optical in-display fingerprint sensors
    Goodix Technology is set to ramp up shipments of its optical in-display fingerprint sensors in 2020, and has reportedly reserved sufficient 8-inch fab capacity from TSMC, according to industry sources.
  • AMS Taiwan county manager Daniel Lee
    Austrian sensor chipmaker AMS will move to enhance its focus on non-mass market applications including automotive, industrial and healthcare, according to Daniel Lee, country manager for Taiwan at AMS.
  • UMC enters Sony CIS supply chain
    UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through the wholly-owned Japanese subsidiary, now renamed United Semiconductor Japan (USJC), the Taiwan-based foundry house...
  • MediaTek's Dimensity 100 is designed for sub-6GHz 5G networks
    SoC solutions supporting 5G mmWave technology are unlikely to make a meaningful presence in the 5G chip market until the second half of 2020, according to industry sources.
  • CIS demand from the car industry has been stable
    Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which in turn will provide more opportunities for Taiwan-based backend firms, according to industry sources.
  • Global Unichip has adopted Cadence's solution
    Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12 and N7) designs for artificial intelligence (AI) and high-performance computing (HPC) applications.
  • The 5G phone market is expected to see explosive growth in 2020
    Taiwan-based IC design houses have seen significant increases in orders for related ICs for 5G phones recently, particularly from first-tier Chinese handset brands, with the ramp-ups likely to result in strong performances for most firms in the first quarter of 2020, according to sources from Taiwan's...
  • FocalTech chairman Genda Hu
    FocalTech Systems is expected to see its fourth-quarter revenues meet its estimate of slight sequential growth, but it remains to be seen whether the IC design house will remain profitable during the quarter, according to market observers.
  • Global semi equipment sales to rebound in 2020
    Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a new high in 2021, according to SEMI.
  • TSMC to end 2019 with growth
    The world's top pure-play foundry is set to wrap up 2019 with strong sales performances, thanks to impressive contributions from advanced manufacturring processes. TSMC is also on course to enter commerical production in first-half 2019...
  • Intel 17-qubit superconducting test chip for quantum computing
    Intel Labs has unveiled a cryogenic control chip, code-named "Horse Ridge," for speeding up development of full-stack quantum computing systems.
  • MediaTek to unveil 2nd 5G SoC
    MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000, in November, according to industry sources familiar with the matter.
  • TWS earbud chip market to see competition heat up
    The global market for SoCs for true wireless stereo (TWS) earbuds is poised for exponential growth in 2020, but competition will heat up, driving IC suppliers to improve their product portfolios to stay competitive, according to industry sources.
  • Sony is expanding CIS offerings
    Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly from Sony's move to expand CIS capacity and launch smart CIS devices in 2020 to meet increasing demand for 5G, AI...
  • Sony sees strong CIS sales
    TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent Chinese-language Commercial Times report.
  • Nuvoton will acquire PSCS in an all-cash deal valued at US$250 million
    Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business to turn profitable, according to Arthur Chiao, chairman for Nuvoton and Winbond Electronics.
  • Qualcomm has launched new Arm-based processors for notebooks
    Although the memory market looks to be heading towards a recovery in 2020, suppliers are cautious about expanding supply. Winbond is building a new plant in Kaohsiung, southern Taiwan, with completion originally slated for year-end 2020 and commerical production for 2021. But now the company has now...
  • Qualcomm intros Arm processors for Windows notebooks
    Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package (SiP) services to integrate multiple chips into one single package to help OEMs lower their R&D costs.
  • TSMC on track to start 3nm production in 2022
    TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a 3nm facility where volume production will start in 2022. Next...
  • Demand from the Wi-Fi 6 sector is picking up
    MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
  • Qualcomm
    TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being manufactured using Samsung's EUV-based 7nm process technology.
  • Semiconductor sales are expected to decline in 2019
    With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical memory segment, according to IHS Markit.

Taiwan handsets – 3Q 2019

Taiwan LCD TVs – 3Q 2019

Taiwan LCD monitors – 3Q 2019

Global LCD panel shipment forecast, 2020 and beyond

Global mobile device shipment forecasts, 2020 and beyond: Smartphones, notebooks and tablets

Taiwan semiconductor foundry sector, 2Q19

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