CONNECT WITH US
Global supply chain: Advanced economies
Advanced economies news coverage
IN THE NEWS
Friday 14 August 2026
South Korea's memory-chip exports surge 277% as system chips slip

South Korea's semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over...

Friday 14 August 2026
Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...
Friday 14 August 2026
Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone

Taiwan Mobile announced on August 13 that it will acquire additional common shares of Systex through its wholly owned subsidiary Taiwan...

Friday 14 August 2026
SK Hynix looks beyond memory with new global growth team
SK Hynix has set up a dedicated team to search for growth opportunities beyond its core memory business and has put a senior group executive in charge, a move aimed at turning the...
Friday 14 August 2026
Taiwan machine tool exports return to growth in July

Driven by sustained momentum in AI and semiconductor demand, Taiwan's machinery exports continued their upward trajectory in July,...

Friday 14 August 2026
Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...
Friday 14 August 2026
Taiwan tech dividend expansion to accelerate non-tech industry upgrades
Taiwan is seeking to sign an agreement with the US to avoid double taxation, seen as the last major hurdle to unlocking Taiwanese investment in the US. Taiwan's technology dividend...
Friday 14 August 2026
Taiwan's AIDC sees homegrown drone complete GPS-denied flight tests
Taiwanese aerospace manufacturer Aerospace Industrial Development (AIDC) stated that its AIxVNAV vision-based unmanned aerial vehicle (UAV) navigation and positioning system has passed...
Friday 14 August 2026
China PCB makers pour billions into AI server, HPC, optical markets
Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...
Friday 14 August 2026
Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
Chinese automakers are reshaping Europe's car market, and the pressure is forcing global rivals into uneasy partnerships that could trim costs while raising strategic risks. For drivers,...
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
Friday 14 August 2026
Qisda unit expands robot computing platform into Europe and U.S. supply chains
Acepillar, a unit of Qisda, said it has extended its industrial PC, motion control, and automation capabilities into humanoid robotics as global demand shifts toward high-compute,...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Kioxia eyes customer trials for PCIe Gen6 optical SSD

Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles...

Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...