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Thursday 1 October 2026
Topco opens Fukuoka office to link Japan chip hubs
Topco Scientific said its Japanese subsidiary, Shunkawa, officially opened its Fukuoka office on October 1, making it the company’s third base in Japan alongside its Tokyo headquarters...
Thursday 1 October 2026
Taiwan aligns green certifications with Japan and EPEAT to speed electronics market entry
Taiwan is moving to align its Green Mark ecolabel with international certification systems in an effort to reduce green trade barriers and shorten time to market for electronics pr...
Thursday 1 October 2026
Taiwan extends fuel freeze, seeks extra subsidies for CPC, Taipower
Taiwan's Executive Yuan has moved to extend price controls and seek additional subsidies for CPC Corporation and Taiwan Power Company as Middle East conflict has lifted global oil...
Thursday 1 October 2026
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction...
Thursday 1 October 2026
DB HiTek raises foundry prices by up to 30% as Chinese demand strains 200mm capacity
DB HiTek has raised foundry prices by as much as 30%, with Chinese customers facing the steepest increases as rising orders push the South Korean foundry's 8-inch capacity close to...
Thursday 1 October 2026
Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
Thursday 1 October 2026
China's share of global solar module demand falls below 40% as Europe, India gain ground
The global solar module market is undergoing a significant geographic shift in 2026. China remains the world's largest source of module demand, but its share of global shipments is...
Thursday 1 October 2026
Samsung raises Galaxy S26 prices in South Korea seven months after launch
Under pressure from rising memory prices, Samsung Electronics has raised the South Korean launch prices of its Galaxy S26 series about seven months after release. Most models went...
Thursday 1 October 2026
MG Taiwan details recall after MG ZS scores zero stars in TNCAP test
The Taiwan New Car Assessment Program (TNCAP) on September 30 released its third-quarter ratings, publishing the MG ZS assessment under its second-edition protocol, which gave the...
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
Thursday 1 October 2026
Volvo Taiwan sees AI wealth lift economy, but not yet car demand
Volvo Car Taiwan acting president Eric Lin said on Sept. 30 that Taiwan's economy is improving on the back of the AI boom, but that the wealth gains are unlikely to translate into...
Thursday 1 October 2026
MediaTek TPU orders rise as chip capacity war intensifies
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
Thursday 1 October 2026
Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking
Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver...
Thursday 1 October 2026
Taiwan launches joint cybersecurity audits for government IT service providers
Taiwan's Ministry of Digital Affairs (MODA) has launched a joint cybersecurity audit initiative aiming to reduce repeated inspections on vendors that provide the government with IT...
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...