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Thursday 22 October 2026
Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains

Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product...

Thursday 22 October 2026
Walrus Pump sees slower demand for higher-capacity AI cooling pumps
Liquid cooling is becoming mainstream in AI servers, prompting data-center customers to assess pumps that can move 100 metric tons of water per hour as chip heat rises. Taiwan pump...
Thursday 22 October 2026
Nvidia's AI factory strategy points to a broader shift in computing, industry
Nvidia is positioning the expansion of artificial intelligence as an infrastructure and industrial shift, not simply a software trend. At GTC Berlin, CEO Jensen Huang described an...
Thursday 22 October 2026
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
Thursday 22 October 2026
Humanoid robot maker PAL says wheels could handle 80% of the market
Wheeled robots could address as much as 80% of the market, according to PAL Robotics CEO Francesco Ferro, a notable assessment from a company that also develops bipedal humanoids.
Thursday 22 October 2026
Elon Musk expands South Korean supplier network for Terafab
Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea, with Tesla and SpaceX approaching materials, components, and equipment suppliers...
Thursday 22 October 2026
Taiwan's FTC blocks Grab's Foodpanda acquisition over competition concerns
Grab Holdings' proposed acquisition of Delivery Hero's Foodpanda operations in Taiwan has been rejected by Taiwan's Fair Trade Commission (FTC). The commission made the announcement...
Thursday 22 October 2026
Chief Telecom's CTSP AI data center bookings exceed 50%
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...
Thursday 22 October 2026
TASA satellites reach orbit to test coordinated LEO broadband links
The Taiwan Space Agency (TASA) said two 8U CubeSats developed by Tron Future Tech successfully reached orbit on October 20 aboard SpaceX's Bandwagon-5 rideshare mission, advancing...
Thursday 22 October 2026
Taiwan tech supply chain eyes Texas for first US industrial cluster
As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Thursday 22 October 2026
Syscom, Japan's CIJ sign AI partnership for overseas expansion
Syscom Computer Engineering is expanding its portfolio in edge AI and its broader enablement ecosystem, with the company showcasing its latest products at the 2026 AIoT Taiwan exhibition,...
Thursday 22 October 2026
Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages
Russia is reportedly considering reinstating parallel imports of products from Samsung Electronics and SK Hynix to ease shortages of memory and storage devices used in data centers...
Thursday 22 October 2026
2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
Thursday 22 October 2026
High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...