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Thursday 1 October 2026
Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
Thursday 1 October 2026
China's share of global solar module demand falls below 40% as Europe, India gain ground
The global solar module market is undergoing a significant geographic shift in 2026. China remains the world's largest source of module demand, but its share of global shipments is...
Thursday 1 October 2026
Samsung raises Galaxy S26 prices in South Korea seven months after launch
Under pressure from rising memory prices, Samsung Electronics has raised the South Korean launch prices of its Galaxy S26 series about seven months after release. Most models went...
Thursday 1 October 2026
MG Taiwan details recall after MG ZS scores zero stars in TNCAP test
The Taiwan New Car Assessment Program (TNCAP) on September 30 released its third-quarter ratings, publishing the MG ZS assessment under its second-edition protocol, which gave the...
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
Thursday 1 October 2026
Volvo Taiwan sees AI wealth lift economy, but not yet car demand
Volvo Car Taiwan acting president Eric Lin said on Sept. 30 that Taiwan's economy is improving on the back of the AI boom, but that the wealth gains are unlikely to translate into...
Thursday 1 October 2026
MediaTek TPU orders rise as chip capacity war intensifies
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
Thursday 1 October 2026
Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking
Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver...
Thursday 1 October 2026
Taiwan launches joint cybersecurity audits for government IT service providers
Taiwan's Ministry of Digital Affairs (MODA) has launched a joint cybersecurity audit initiative aiming to reduce repeated inspections on vendors that provide the government with IT...
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Thursday 1 October 2026
Honor joins Taiwan foldable phone race with Magic V6
Honor launched its first foldable smartphone in Taiwan, the Magic V6, on September 30, about six months after formally entering the local smartphone market in April 2026. The company...
Thursday 1 October 2026
ProLogium advances Dunkirk superfactory, deepens Europe battery autonomy
ProLogium, a maker of inorganic lithium ceramic batteries, said construction and infrastructure work at its Dunkirk superfactory in France has started in phases, including power infrastructure...
Thursday 1 October 2026
Unimicron expands ABF substrate capacity with NT$10B Hukou land deal
Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI...
Thursday 1 October 2026
GPS-free indoor drones target high-rack inspection as smart warehouses expand
The drone market is expanding beyond military applications as commercial demand gains momentum. Following the rollout of drone logistics services for Taiwan's outlying islands, industry...
Thursday 1 October 2026
Samsung Foundry gets boost from HBM4 as 2nm push continues
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.