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Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
Friday 4 September 2026
From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026
Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026...
Friday 4 September 2026
South Korea taps chip windfall for next tech push
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
Friday 4 September 2026
SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
TAIPEI, Taiwan — The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth...
Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
Friday 4 September 2026
Taiwan to expand AI compute capacity as supercomputer at research institute hits full load
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According...
Friday 4 September 2026
Ennostar accelerates AI optical communications with micro LED
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
Friday 4 September 2026
Fujitsu says useful quantum computers may need far fewer qubits than expected
For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told...
Friday 4 September 2026
China Motor unit Greentrans launches Taiwan-made quadruped robots
China Motor Corp. subsidiary Greentrans unveiled its next-generation quadruped robots, GT5X and GT3X, at SEMICON Taiwan 2026 amid growing demand for AI applications, smart semiconductor...
Friday 4 September 2026
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
Friday 4 September 2026
Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements...
Friday 4 September 2026
Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers
Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers...
Friday 4 September 2026
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...