Global supply chain: Advanced economies

Advanced economies news coverage

IN THE NEWS

Thursday 14 May 2026

US court cleared Apple to seek documents from Samsung's Korea HQ in DOJ antitrust case

A US federal court in New Jersey granted Apple the right to pursue internal records from Samsung Electronics' South Korea headquarters as part of Apple's response to the Department...

Thursday 14 May 2026

Lam Research to hire 1,000-plus engineers in Taiwan on AI chip demand

Lam Research said it will hire more than 1,000 professional engineers in Taiwan in 2026 as customer demand mounts and the company expands technical support services for foundry, memory...

Thursday 14 May 2026

Foxconn Wisconsin ransomware attack spotlights cybersecurity gap at Taiwan manufacturers

Foxconn confirmed a ransomware intrusion at its Wisconsin plant in the US, and said the affected facility continued operating normally after the incident. The attack renewed scrutiny...

Thursday 14 May 2026

Taiwan plans green power spot market to ease surplus renewable power by 2027

Taiwan intends to launch a green power spot market as early as late 2026 or early 2027 to allocate intermittent renewable generation better and reduce surplus electricity pressures...

Thursday 14 May 2026

Sharp delays Kameyama LCD shutdown as losses mount

Sharp is delaying the shutdown of its Kameyama No. 2 LCD plant to December from August, as customer demand has held up stronger than expected ahead of the planned production halt.

Thursday 14 May 2026

NSK-NTN merger to create the world's largest bearing maker

Japan's NSK and NTN have agreed to pursue a merger that would create the world's largest bearing maker, as rising costs, slowing demand, and Chinese competition push Japan's industrial...

Thursday 14 May 2026

Oppo Taiwan forecasts 5% to 8% shipment decline while revenue is set to rise

Oppo Taiwan said on the 12th that annual smartphone shipments were likely to fall 5% to 8% this year as surging memory prices pushed up handset costs and extended replacement cycles...

Thursday 14 May 2026

Korea races to narrow chip packaging gap with Taiwan and China

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small...

Wednesday 13 May 2026

Intel's preliminary Apple deal puts Samsung's foundry ambitions under pressure

Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker...

Wednesday 13 May 2026

Altasec deepens edge AI imaging push into Europe and US security markets

Altasec Technology, a smart security and control solutions provider founded in 2011, will list on Taiwan's Emerging Stock Board on May 14 as it moves to capture demand from AI applications...

Wednesday 13 May 2026

Tesla boosts Berlin output with US$250M battery cell expansion

Tesla is investing US$250 million to expand battery-cell production at its Berlin-Brandenburg Gigafactory, reinforcing its long-term commitment to Europe just as the company starts...

Wednesday 13 May 2026

Samsung labor talks collapse as bonus dispute threatens chip output

Samsung Electronics and its largest labor union failed to reach a pay deal following government-mediated talks, raising the risk of an 18-day strike beginning May 21, 2026, that could...

Wednesday 13 May 2026

Doosan to build new CCL plant in Thailand

South Korean copper clad laminate (CCL) maker Doosan is reportedly moving to strengthen its overseas capacity in Thailand, a key production hub for Taiwan PCB suppliers serving global...

Wednesday 13 May 2026

Canada warns US tariff rollback is non-negotiable as USMCA review looms

Canada and industry groups pushed back against the prospect of linked concessions as the US prepared for a high-level summit with China on May 14 and North America readied for the...

Wednesday 13 May 2026

Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...

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