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Monday 7 September 2026
Analysis: Under tariff threats, Taiwan chipmakers hedge beyond US
Taiwanese companies are only at the start of a broader overseas investment cycle, as Washington signals possible new semiconductor tariffs and Taipei moves to deepen industrial links...
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
Monday 7 September 2026
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
Monday 7 September 2026
Eaton expands AI data center stack from grid to chip
As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
Monday 7 September 2026
Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective...
Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Monday 7 September 2026
Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Monday 7 September 2026
Pegatron, Deloitte Taiwan team up to speed smart manufacturing
Pegatron announced on September 3 that it had signed a memorandum of understanding with Deloitte Taiwan, combining Pegatron's self-developed enterprise AI digital twin platform with...
Monday 7 September 2026
Experts say subsidies can't buy semiconductor competitiveness
At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC...
Monday 7 September 2026
Machine builders flood SEMICON 2026 to grow local chip tools
Taiwan's machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the...
Monday 7 September 2026
Acer hedges memory price shock with local AI, diversification
Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds...
Sunday 6 September 2026
TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that...
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...