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IN THE NEWS
Friday 12 August 2022
Components suppliers brace for hinge minimization trend for foldable handsets
Samsung Electronics has minimized the hinge mechanism in its newly unveiled foldable smartphones to cut production costs and make them slimmer and lighter, and other vendors including...
Wednesday 20 July 2022
China IC designers score points in developing homegrown CPUs
China has witnessed rapid development of homegrown CPU chips in recent years, gradually stretching from single product development to ecosystem deployments looking to break the dominance...
Thursday 14 July 2022
Samsung creates advanced packaging department; Chinese makers keen on building 8.6G panel line; Huawei AITO M7 electric SUV unveiled
The highlights of this edition of the Asia Enterprise research report include Samsung Electronics' advanced packaging business and the establishment of the "Advanced Packaging Group"...
Friday 1 July 2022
Xiaomi may renew mobile SoC development via new IC design JV
Chinese handset vendor Xiaomi recently has deepened its in-house chip development by investing in a new semiconductor company, sparking market speculation that Xiaomi may renew development...
Thursday 30 June 2022
Huawei to launch new-gen foldable phones in early 2023
Huawei reportedly plans to launch its next-generation foldable flagship model, the Mate X3, in early 2023 to meet the seasonal needs during the Chinese Lunar New Year holidays.
Monday 27 June 2022
Taiwan IC test supply chain gaining from HPC chip boom
Taiwan's suppliers of high-end IC test interface solutions are poised to enjoy growing HPC chip demand for AI, datacenter and server applications, particularly now that Chinese chipmakers...
Thursday 23 June 2022
Supply chain sees no cutbacks in foldable smartphone orders
Despite speculation indicating Samsung Electronics has suffered from excessive smartphone inventories, the Korean vendor has yet to cut its foldable smartphone shipment goal for this...
Thursday 23 June 2022
Handset vendors see inventory swelling at channels
Channel dealers and retailers are suffering from excess smartphone inventories, casting a shadow on the overall handset market outlook for the second half of 2022, according to industry...
Thursday 9 June 2022
China looks to become self-reliant on EDA software
China is trying to become self-reliant on electronic design automation (EDA) software, with more China-based semiconductor firms beginning to adopt EDA products offered by domestic...
Wednesday 8 June 2022
China miniLED-backlight industry booming
The miniLED-backlight industry in China is heading for robust growth as more Chinese TV brands, including TCL, Huawei and Hisense, have rolled out miniLED-backlit TV models for the...
Wednesday 1 June 2022
Samsung to invest KRW450 trillion in chip and bio sectors; China smartphone makers deepen metaverse deployments
This Asia tech industry summary will mainly focus on Samsung Electronics unveiling a KRW450 trillion (US$359.84 billion) investment plan for its semiconductor and biotechnology businesses;...
Friday 27 May 2022
Maxscend to commercialize production of SAW filters
China-based Maxscend Microelectronics, dedicated to supplying RF frontend chips such as RF switches and low-noise amplifiers, is set to kick off trial production of SAW (surface acoustic...
Monday 16 May 2022
Silicon Motion to operate independently after merger with MaxLinear
Silicon Motion Technology will not change its trade mark or operating strategy after being acquired by US-based broadband communication chips supplier MaxLinear, as both companies...
Friday 13 May 2022
Global tablet market - 1Q 2022
According to Digitimes Research's statistics, global tablet shipments amounted to 32 million units in first-quarter 2022 in line with expectation. The volume was the lowest since...
Friday 13 May 2022
China smartphone market - 1Q 2022
According to DIGITIMES Research's surveys and analyses, first-quarter 2022 smartphone shipments to the China market fell 26.5% from the prior year level, coming short of the 70-million-unit...
Monday 4 September 2017
IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of the cloud with the speed and responsiveness of native AI processing, according to the company. Cloud AI has seen broad application, but user experience still has room for improvement, including latency, stability, and privacy, according to the vendor. Cloud AI and on-device AI can complement each other. On-device AI offers strong sensing capabilities, which are the foundation of understanding and assisting people. Sensors produce a large amount of real-time, scenario-specific, and personalized data. Supported by strong chip processing capabilities, devices will become more cognitive of user needs, providing personalized and readily accessible services. Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one square centimeter. Huawei's new flagship Kirin 970 is its first mobile AI computing platform featuring a dedicated neural processing unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970's new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power, Huawei claims. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners.