According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture...
Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics...
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Samsung Display debuted at Computex 2025, highlighting its advanced OLED technology. The company presented a range of IT OLED products, such as notebooks, tablets, monitors, and other...
E Ink, the leading company in electronic paper technology, has joined forces with Realtek Semiconductor to introduce a next-generation System on Panel (SoP) design for electronic...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical...
Samsung Electro-Mechanics is teaming up with South Korean semiconductor materials company SoulBrain to develop materials for glass substrates, with plans for mass production by 2027...
Corning Incorporated recently filed a patent infringement investigation with the United States International Trade Commission (USITC), targeting several TV and panel manufacturers,...
Samsung Display is advancing its microOLED technology by shifting from silicon wafers to glass substrates, a move aimed at improving production efficiency and reducing costs for AR/VR...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
