News tagged silicon at DIGITIMES

NEWS TAGGED SILICON

Wednesday 15 April 2026

Taiwan equipment makers ride advanced packaging and SiPh wave

Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...

Wednesday 15 April 2026

Broadcom and Meta deepen AI infrastructure alliance with multi-gigawatt ambitions

Broadcom and Meta have unveiled a sweeping multi-year, multi-generation partnership aimed at scaling Meta's AI infrastructure, signaling...

Monday 13 April 2026

Silicon photonics scaling hits wafer testing bottleneck

AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The...

Monday 13 April 2026

FormFactor and MPI vie to break SiPh test bottleneck as ficonTEC reportedly exits

As AI data centers officially enter the silicon photonics (SiPh) era, the industry faces severe challenges in testing accuracy and throughput on the path toward mass production of...

Saturday 11 April 2026

Samsung Exynos 2700 benchmark leak offers early look at 2nm SF2P performance

Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process...

Saturday 11 April 2026

Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy

Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push...

Friday 10 April 2026

MAtek sees record March revenue as AI and silicon photonics boost testing demand

MAtek's March revenue surge has implications for global chipmakers and AI infrastructure providers: rising demand for advanced material and failure analysis testing linked to AI chip...

Friday 10 April 2026

Taiwan accelerates SiPh and materials breakthroughs for next-gen AI computing

Taiwan is stepping up its global semiconductor leadership with a coordinated push into silicon photonics (SiPh) and advanced materials, aiming to meet surging demand for faster, more...

Friday 10 April 2026

Intel–Google alliance reframes AI infrastructure around CPUs

A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...

Friday 10 April 2026

Amazon signals chip export ambitions as in-house silicon business tops US$20 billion run rate

Amazon's custom chip business has surpassed an annual revenue run rate of more than US$20 billion, CEO Andy Jassy said in his annual shareholder letter, according to The Information...

Friday 10 April 2026

Anthropic reportedly explores in-house chip design amid rapid revenue growth and evolving AI compute stack

Anthropic is exploring the possibility of designing its own AI chips, though the effort remains at a very early stage, Reuters reported, citing three sources familiar with...

Thursday 9 April 2026

When will CPO actually see mass production?

The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible...

Thursday 9 April 2026

Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale

India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India,...

Thursday 9 April 2026

ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab

Semiconductor startup ChipX is moving to commercialize silicon photonics and high-voltage power chip technologies for artificial intelligence (AI) data centers, as it advances plans...

Tuesday 7 April 2026

Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook