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NEWS TAGGED 2018
Wednesday 7 September 2022
SK Hynix to break ground for new memory fab in October
SK Hynix has disclosed plans to break ground in October for a new memory fab in South Korea, with construction scheduled to complete in early 2025.
Wednesday 31 August 2022
TSMC to boost advanced packaging capacity by 2026
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...
Thursday 14 July 2022
Xiaomi invests in LED driver IC startup
Xiaomi, through its investment arm, has poured nearly CNY2.5 billion (US$371.4 million) into HyAsic Semiconductor to obtain a 4.35% stake in the China-based LED driver IC startup.
Thursday 28 April 2022
SK Hynix sees profits more than double in 1Q22
SK Hynix has reported operating profits jumped 116% from a year earlier to KRW2.86 trillion (US$2.26 billion) in the first quarter of 2022 when revenue climbed 43% on year to KRW12.16...
Tuesday 22 March 2022
CXMT to deliver 17nm DRAM samples in 2Q22
China-based memory foundry ChangXin Memory Technologies (CXMT) is poised to start delivering samples of DRAM chips built using its in-house developed 17nm process technology, according...
Friday 11 March 2022
Taiwan IC design houses focus more on automotive electronics
Taiwan-based IC design houses including display driver IC (DDI) companies, network IC specialist, and suppliers of sensors, audio chips and MEMS microphones have all put increased...
Tuesday 11 January 2022
China chipmakers reportedly build additional output for power semiconductors
China-based chipmakers including China Resources Microelectronics (CR Micro), Silan Microelectronics and StarPower Semiconductor have reportedly stepped up their capacity expansion...