Amid growing uncertainty over global tariffs, Taiwanese memory chipmaker Winbond Electronics has seen a sudden surge in urgent orders during the second quarter of 2025, so much so...
ChangXin Memory Technologies (CXMT) has accelerated its next-generation DRAM development, transitioning from 17nm to 16nm process technology for its first DDR5 product, according...
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
China government-supported chipmaker Loongson has begun research on its CPU product line entering the next-generation 7nm technology, with development beginning in 2024, according...
TSMC plans to raise sub-7nm foundry quotes by 3-6% in 2024, while quotes for 16nm and above process manufacturing will remain stable, according to industry sources.
NXP Semiconductors and TSMC have jointly announced their collaboration to deliver the industry's first automotive embedded MRAM in 16 nm FinFET technology.
The International Solid-State Circuits Conference (ISSCC), the largest annual event for the IC design sector, will be held February 19-23, 2023 in San Francisco. A total of 23 papers...
Semiconductor energy efficiency has improved 1X every two years over the past 15 years, with advanced chips showing particularly strong performance, according to TSMC chairman Mark...
Delivery lead times for network chips are still as long as 52 weeks, but supply volume has significantly increased. Shortages will continue to improve in the second half of 2022,...
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will...
Kurt Sievers, president and CEO of NXP Semiconductors, said during his keynote at Computex 2022 that the company is about to complete the development of its new-generation automotive...
MediaTek and Realtek Semiconductor both continue to strive for more available 16nm and 12nm fab capacity for Wi-Fi core chips, according to industry sources.
Xiaomi, Oppo, Bitmain Technologies, and AI processor startup Horizon Robotics are all eyeing close partnerships with TSMC to satisfy their growing demand, particularly that for sub-5nm...
Wi-Fi core chip suppliers have obtained more available fab capacities at foundries, which are experiencing cutbacks in orders from other areas, and therefore are seeing their tight...
