For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

At the 2026 OCP APAC Summit, debate over networking architectures in cloud AI data centers sharpened as industry players said the main...

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable...

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...