News tagged copper at DIGITIMES

NEWS TAGGED COPPER

Friday 11 September 2026

Huawei stakes out the AI optics rulebook with 7.2Tbps NPO

Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging...

Friday 11 September 2026

CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...

Thursday 10 September 2026

Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026

Gem Terminal rides China plug rule shift for 8.8% sales growth

Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements...

Wednesday 9 September 2026

Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders

Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...

Sunday 6 September 2026

Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...

Saturday 5 September 2026

Topco targets optical comms, cooling as copper gives way

System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...

Friday 4 September 2026

The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom

A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future...

Thursday 3 September 2026

Broadcom says CPO fits scale-out better than scale-up

Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...

Thursday 3 September 2026

PlayNitride sees 3.2T AI links opening a new front for Micro LED, but auto weakness weighs on 2H26

Micro LED is moving beyond displays into AI optical communications, with PlayNitride targeting commercial deployment within two years if industry standards and supply-chain integration...

Tuesday 1 September 2026

Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables

DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...

Monday 31 August 2026

Marvell sees 2027 acceleration in scale-up optics

Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...

Monday 31 August 2026

TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...

Monday 24 August 2026

AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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