Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements...
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future...
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
Micro LED is moving beyond displays into AI optical communications, with PlayNitride targeting commercial deployment within two years if industry standards and supply-chain integration...
DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...
TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
