Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

At the 2026 OCP APAC Summit, debate over networking architectures in cloud AI data centers sharpened as industry players said the main...

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable...

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...