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NEWS TAGGED LINGSEN
Monday 19 February 2024
Backend house Lingsen sells Chinese subsidiary
Taiwan-based Lingsen Precision Industries, which specializes in power management IC, sensor, and memory module backend services, recently announced the sale of its subsidiary Ningbo...
Friday 26 January 2024
Backend firm Lingsen reportedly in Humane Ai Pin supply chain
Backend house Lingsen Precision Industries reportedly has entered the supply chain for US startup Humane's Ai Pin, according to industry sources.
Tuesday 24 October 2023
Taiwan OSATs see partial fab utilization recovery
Several Taiwan-based OSATs, including ChipMOS Technologies, Lingsen Precision Industries, Orient Semiconductor Electronics (OSE), and Walton Advanced Engineering, have begun to see...
Friday 6 January 2023
Taiwan OSATs see stable orders for customized MEMS sensors
Taiwan OSATs including ASE Technology and Lingsen Precision Industries are set to enjoy stable backend orders for MEMS sensors from international clients, thanks to increasing penetration...
Wednesday 23 November 2022
OSAT Lingsen expects sales to pick up in 3Q23
Lingsen Precision Industries, which specializes in power management ICs, sensor, and memory module backend services, expects to see its sales hit bottom in second-quarter 2023 before...
Tuesday 27 September 2022
ASEH to see production utilization drop in 4Q22
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Friday 24 December 2021
Taiwan backend houses step up deployments for 3rd-gen semiconductors
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Tuesday 14 December 2021
Taiwan supply chain braces for booming 3rd-gen semiconductor applications
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Tuesday 14 December 2021
IC designers zero in on peripheral chips for WBG semiconductor modules
Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...