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    Acer sees CPU shortages worse than memory as 2H24 PC market weakens
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    NEWS TAGGED BANDWIDTH
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Saturday 16 May 2026
    One-person companies may upend small businesses in AI shift, adviser says

    Lee-Feng Chien, innovation economy adviser to the Executive Yuan's Economic Development Commission, said at an AI forum on May 14 that...

    Friday 15 May 2026
    InP compound semiconductors break AI power and bandwidth barriers
    Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
    Thursday 14 May 2026
    Taiwan panel industry transforms by riding the AI wave into microLED optical communications

    Introduction

    Monday 11 May 2026
    Memory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP
    Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
    Monday 11 May 2026
    Secure City Solutions: The Canadian Firm Revolutionizing High-Stakes Video Data

    In the high-stakes world of global security and emergency response, the shift toward "video-centric" operations has created a massive technical bottleneck: the struggle...

    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    South Korea eyes memory-led AI order against Nvidia
    As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
    Thursday 30 April 2026
    Taiwan launches all-photonic network to strengthen data center resilience and AI computing backup
    Taiwan President Lai Ching-te has pledged to transform Taiwan into an "AI island," with a key focus on developing an all-photonic network (APN). The National Science and Technology...
    Wednesday 29 April 2026
    China memory chip designer Montage lifts profit on DDR5, AI server demand
    China-based memory interface chip supplier Montage Technology reported solid first-quarter 2026 results, supported by rising demand for AI servers and accelerating adoption of next-generation...
    Monday 27 April 2026
    What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure
    The CPO market is projected to grow at a 142% CAGR from 2026 to 2030 (excl. ELS). As AI clusters scale and 3.2T data rates push copper to its limits, CPO is emerging as a key solut...
    Wednesday 22 April 2026
    CXMT HBM3 timeline slips, mass production unlikely in 2026
    China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook