Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context...
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
AP Memory has announced that its new generation PSRAM, known as ApSRAM (Attached-pSRAM), has completed customer platform validation and is slated for mass production by the end of...
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
High bandwidth memory (HBM) has reshaped the global DRAM industry landscape, fueled by a surge in AI demand over the past three years. Nvidia's next-generation AI accelerator "Rubin"...
The global race to build ever-larger AI models is intensifying, and the battle is no longer confined to Nvidia's powerful GPUs. Another crucial, though less visible, component has...
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
SK Hynix is partnering with flash memory manufacturer Sandisk to jointly promote the standardization of High Bandwidth Flash (HBF) technology. The two companies plan to leverage synergies...
The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
