Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs....
Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...
Tokyo-based startup EdgeCortix plans to deliver samples of its next-generation Sakura-X artificial intelligence (AI) processor by the end of 2026,...
Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...