中文網
Taipei
Mon, Aug 15, 2022
03:12
mostly clear
28°C
CONNECT WITH US
NEWS TAGGED MIXED-SIGNAL IC
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Thursday 14 January 2021
Value of semiconductor industry M&A agreements sets record in 2020, says IC Insights
Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of US$118 billion, surpassing...
Wednesday 30 December 2020
Airoha to acquire IC Plus
Airoha Technology, a MediaTek subsidiary, will acquire all shares of fellow company IC Plus at NT$22 (US$0.78) per share, according to company filings with the Taiwan Stock Exchange...
Friday 18 December 2020
MediaTek announces equity investment in Asix
MediaTek through subsidiary Airoha Technology will invest up to NT$495 million (US$17.6 million) through private placement to acquire an about 20% stake in fellow Taiwan-based IC...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Friday 18 January 2019
Value of semiconductor M&A falls considerably
The historic flood of merger and acquisition agreements that swept through the semiconductor industry in 2015 and 2016 slowed significantly in 2017 and then eased back further in...
Thursday 14 June 2018
Smart home IC startup revving up deployments in Chengdu
Named one of the eight innovative enterprises and IC unicorns at IC Market China 2018 held in mid-April in Nanjing, the Shanghai-based Montage Technology Group, dedicated to providing...
Friday 25 August 2017
Chipbond, ChipMOS see rising orders for TDDI chips
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Monday 14 August 2017
ChipMOS to enter production for 3D sensing components in 3Q17, says report
Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Friday 4 November 2016
Parade expects to post revenue growth of up to 17% in 4Q16
Parade Technologies, a supplier of mixed-signal ICs for display and high-speed interface standards, expects to post revenues of between US$70 million and US$77 million for the fourth...
Friday 29 January 2016
Parade looks to up to 8% revenue increase in 1Q16
Mixed-signal IC design house Parade Technologies expects to post consolidated revenues of between US$67 million and US$73 million in the first quarter of 2016 representing sequential...
Thursday 20 September 2012
Parade sees strong improvement in order visibility
Parade Technologies, an Intel Capital-invested mixed signal IC design house, has seen its order visibility improve significantly in September thanks to orders from the ultrabook and...
Friday 29 June 2012
Maxim to expand and upgrade US wafer fabs
Maxim Integrated Products, which specializes in the manufacture of analog and mixed-signal semiconductors, has announced a US$200 million multi-year investment to upgrade its US wafer...
Thursday 10 May 2012
Keeping industrial interesting: Q&A with analog and mixed signal solution provider Maxim
According to analog and mixed-signal semiconductor maker Maxim Integrated Products, the industrial segment has been the fastest growing analog semiconductor segment over the past...
Tuesday 8 May 2012
Center of gravity shifts for mixed-signal development: Q&A with Ravi Subramanian, CEO of Berkeley Design Automation
Over the next 30 years, the world's middle class (defined as per capita income of more than US$8,000 a year) will grow to include four billion people, meaning that 170 people are...