At SEMICON Japan 2024 in Tokyo, Rapidus Chairman Tetsuro Higashi revealed that the installation of all equipment for trial production of 2nm chips will be finalized by March 2025,...
The US Department of Commerce has awarded Micron Technology US$6.165 billion to expand memory chip production in New York and Idaho, creating 20,000 jobs. The chipmaker also secured...
On December 5, the US Department of Commerce finalized grants under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities, directing significant...
Tsinghua Unigroup's chip subsidiary Unisoc announced plans to secure an additional CNY2 billion (US$448 million) in equity financing, following its earlier CNY4 billion (US$896 million)...
According to Taiwan's Ministry of Economic Affairs, MediaTek subsidiary Airoha has secured NT$140 million (US$4.3 million) in R&D subsidies through the ministry's A+ Industrial...
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production...
Japanese NAND manufacturer Kioxia has secured approval for its initial public offering (IPO) on the Tokyo Stock Exchange, scheduled for December 18. South Korean SK Hynix may acquire...
The Japanese government is preparing a budget amendment for fiscal year 2024 (April 2024 – March 2025) to allocate additional support for the semiconductor and AI sectors, with...
Revised Award Provides Up to $7.865 Billion in Direct Funding, Down from $8.5 Billion, to Support Intel's $100+ Billion Expansion Plan Across Four U.S. States
Taiwan-based millimeter wave (mmWave) technology company TMYTEK is preparing to go public next year following a successful US$25 million Series B funding round that brought its total...
The US Department of Commerce has awarded two significant grants under the CHIPS Incentives Program. The funding will go to BAE Systems and Rocket Lab to advance the country's supply...
As Donald Trump's inauguration fast approaches, Gina Raimondo, the US Secretary of Commerce, revealed to Politico that she instructed Commerce Department staff to work overtime...
The Japanese government is preparing to provide over JPY10 trillion (approx. US$65 billion) in support for the semiconductor and AI industries by the fiscal year 2030 (April 2030...
Japanese authorities have officially terminated subsidies for APB Corp, a pioneer in next-generation all-polymer battery technology, amid severe financial difficulties and leadership...
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
