Global DRAM shipments saw their sharpest increase in nearly two years during the second quarter of 2025, solidifying SK hynix's lead over Samsung Electronics. The surge was driven...
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...
In the first half of 2025, SK Hynix recorded the highest operating profit and the largest corporate tax payment among South Korean companies. The surge in demand for high-bandwidth...
China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market...
Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including...
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly...
The US is proposing annual approvals for exports of chipmaking supplies to Samsung Electronics and SK Hynix's factories in China, a compromise aimed at preventing disruptions to the...
The upcoming SEMICON Taiwan will feature keynote speeches from top executives at South Korean semiconductor giants Samsung Electronics and SK Hynix, in addition to a forum hosted...
Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation...
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
While geopolitical tensions push many companies away from China, South Korean chip equipment maker Nextin is doubling down with a new factory in Wuxi, betting big on a market that...
Samsung Electronics and SK Hynix are reportedly pushing back plans to phase out DDR4 DRAM, extending production until 2026 after prices for the older chips surged past next-generation...
