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NEWS TAGGED SK HYNIX
Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
SK Hynix faces US patent fight over HBM, 3D NAND

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

Monday 10 August 2026
Ex-SK Hynix employee gets 18 months for leaking chip secrets to Chinese firms

The Seoul High Court has upheld an 18-month prison sentence for a former SK Hynix employee who leaked trade secrets tied to CMOS image...

Saturday 8 August 2026
Analysis: Memory makers hold US$38 billion that isn't theirs to keep

Suppliers locked supply and price floors through 2030. The collateral protecting them runs out first — and that is when procurement...

Friday 7 August 2026
SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1...
Friday 7 August 2026
SK Hynix's Solidigm weighs up to US$7 billion in pre-IPO funding

Solidigm, SK Hynix's US NAND and enterprise storage unit, is weighing a pre-IPO funding round of KRW5 trillion to KRW10 trillion, roughly US$3.5 billion to US$7 billion,...

Thursday 6 August 2026
Apple's CXMT play reportedly backfires on DUV limits, giving Samsung and SK Hynix more DRAM leverage

Apple's attempt to use China's ChangXin Memory Technologies (CXMT) as leverage against Samsung Electronics and SK Hynix has backfired...

Thursday 6 August 2026
DRAM price surge lifts Samsung and Micron as SK Hynix loses share
Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung...

Wednesday 5 August 2026
FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
Sandisk and SK Hynix release HBF spec to advance AI memory standard
Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide...