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NEWS TAGGED YOLE
Saturday 10 October 2026
Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
Monday 5 October 2026
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development...
Wednesday 16 September 2026
Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
Monday 14 September 2026
Yole Group takes outside capital for the first time, selling minority stake to new French fund
Yole Group, the French market-research firm that tracks the semiconductor, photonics and electronics supply chains, has sold a minority stake to Cervinvest Scale, the lower-midcap...
Friday 4 September 2026
Processor, memory boom could push chip supply chain out of sync, says Yole
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
Monday 29 June 2026
China memory makers fuel local chip equipment push as CXMT lands Tencent deal

ChangXin Memory Technologies has signed a long-term DRAM supply agreement with Tencent Holdings valued at more than CNY20 billion (approx...

Wednesday 14 January 2026
CPO module output to grow by 137% annually as Taiwan fosters key photonic tech
Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...
Wednesday 24 September 2025
Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS...
Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...
Thursday 21 August 2025
SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
Monday 30 June 2025
China set to lead global foundry capacity by 2030 amid accelerating domestic expansion
China is poised to overtake Taiwan as the world's top semiconductor foundry hub by 2030, according to Yole Group. With 21% of global capacity in 2024 and rapid domestic expansion underway,...
Friday 7 March 2025
Compound semiconductor market on track for US$25 bln by 2030, fueled by EVs, 5G, and AI
The global compound semiconductor market is projected to reach US$25 billion by 2030, growing at an annual rate of nearly 13% from 2024, according to Yole Group's Activity Manager...
Monday 30 September 2024
China's top OSATs invest big in advanced packaging to compete globally
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
Tuesday 9 July 2024
OmniVision expands automotive CIS market share
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held...
Tuesday 17 October 2023
Samsung, SK Hynix keen on CXL DRAM development to unlock new opportunities beyond HBM
In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...