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Monday 19 November 2018
DRAM vendors remain focused on process technology transition
The world's top DRAM suppliers saw their operating margins climb to record highs in the third quarter of 2018, though their ASP increases started slowing down, according to DRAMeXchange...
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Friday 5 October 2018
Taiwan firms eyeing automotive MOSFET processing orders from IDMs
As international IDMs are moving at full throttles to develop lucrative high-voltage automotive MOSFETs, Taiwan mid-end and back-end supply chain players are gearing up to win long-term...
Monday 3 September 2018
Wafer thinning needed to boost silicon power devices performance
Wafer thinning technology is expected to play an increasingly crucial role in Taiwan's power discrete device supply chain, as the technology can work well to lower resistance and...
Wednesday 1 August 2018
Apple, Qualcomm may make peace over 5G, supply chain speculates
Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...
Friday 22 June 2018
TSMC ramping up 7nm chip production
Taiwan Semiconductor Manufacturing Company (TSMC) has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also...
Tuesday 29 May 2018
Global 1Q18 NAND flash market posts 3% decrease, says DRAMeXchange
Revenues of the global NAND flash industry dropped 3% sequentially to US$15.74 billion in the first quarter of 2018, when a seasonal slowdown in demand dragged down the memory prices,...
Monday 21 May 2018
Taiwan OSAT firms keen to develop FOPLP with good yield rate
Lagging behind Taiwan Semiconductor Manufacturing Company (TSMC) in the development of fan-out wafer level packaging (FOWLP) technology, Taiwan's main OSAT (outsourced semiconductor...
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Tuesday 30 January 2018
Kinsus profits shrink in 2017
IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...
Thursday 30 November 2017
Notebook hinge maker Sinher boosting MIM self-sufficiency rate to 50%
Notebook hinge maker Sinher Technology is installing two more batch furnaces to expand in-house MIM (metal injection molding) production capacity to meet growing demand, bringing...
Tuesday 14 November 2017
Global 3Q17 DRAM revenues climb 16.2%. says DRAMeXchange
Sales in the global DRAM market surged 16.2% sequentially to a record US$19.18 billion in the third quarter of 2017, when contract prices of various DRAM products rose by about 5%...
Wednesday 25 October 2017
Globalfoundries to adopt EUV for 7nm FinFET
Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Friday 25 August 2017
AMD Vega graphics cards in shortages
AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...
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Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research