Taiwan-based notebook ODMs have completed most of their plant relocation and their present focus is to improve production yield rates and reduce costs at the relocated facilities...

Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...

Flexible PCB maker Flexium Interconnect has disclosed its September and third-quarter revenues improved significantly on year due mainly to strong demand for handset antenna boards,...

Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first...

Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...

Nvidia has decided to choose Samsung Electronics over TSMC for producing next-generation GPUs in 2020 on 7nm EUV (extreme ultraviolet) node despite Samsung's yield rates for the process...

Manufacturers could see their equipment invest return rate fall significantly if their machinery equipment fails to achieve maximum productivity, but they can counter by first incorporating...

Semiconductor Manufacturing International (SMIC) is expected to enter volume production of chips built using 14nm FinFET process technology in the first half of 2019, fulfilling the...

While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...

PCB maker Apex International is expected to enjoy a strong first quarter of 2019, thanks to robust shipments of its automotive boards, according to company sources.

Taiwan-based Unitech Printed Circuit Board has taken the lead to incorporate smart manufacturing into the PCB sector, seeking to significantly boost yield rates and tap the market...

The world's top DRAM suppliers saw their operating margins climb to record highs in the third quarter of 2018, though their ASP increases started slowing down, according to DRAMeXchange...

Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...

As international IDMs are moving at full throttles to develop lucrative high-voltage automotive MOSFETs, Taiwan mid-end and back-end supply chain players are gearing up to win long-term...

Wafer thinning technology is expected to play an increasingly crucial role in Taiwan's power discrete device supply chain, as the technology can work well to lower resistance and...

Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...

Taiwan Semiconductor Manufacturing Company (TSMC) has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also...

Revenues of the global NAND flash industry dropped 3% sequentially to US$15.74 billion in the first quarter of 2018, when a seasonal slowdown in demand dragged down the memory prices,...

Lagging behind Taiwan Semiconductor Manufacturing Company (TSMC) in the development of fan-out wafer level packaging (FOWLP) technology, Taiwan's main OSAT (outsourced semiconductor...

Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...

IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...

Notebook hinge maker Sinher Technology is installing two more batch furnaces to expand in-house MIM (metal injection molding) production capacity to meet growing demand, bringing...

Sales in the global DRAM market surged 16.2% sequentially to a record US$19.18 billion in the third quarter of 2017, when contract prices of various DRAM products rose by about 5%...

Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...