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NEWS TAGGED WEEKLY NEWS ROUNDUP
Monday 2 September 2024
Weekly news roundup: Kaynes secures India's paying OSAT customer; former TSMC executive set to depart Samsung
These are the most-read DIGITIMES Asia stories in the week of August 26 – August 30.
Monday 26 August 2024
Weekly news roundup: Intel's 18A under fire for yield; US Chips Act scale now bigger than China Big Fund II
These are the most-read DIGITIMES Asia stories in the week of August 19 – August 23.
Monday 19 August 2024
Weekly news roundup: Japan's breakthrough in EUV tech; China gaining self-sufficiency in chip equipment except in exposure tools
These are the most-read DIGITIMES Asia stories in the week of August 12 – August 16.
Monday 12 August 2024
Weekly news roundup: Intel telecommunications faces cost cuts; Indian opto-semiconductor maker makes acquisition
These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.
Monday 5 August 2024
Weekly news roundup: CXMT begins mass-producing HBM2; Micron intros new data center SSD
These are the most-read DIGITIMES Asia stories in the week of July 29 – August 2.
Monday 29 July 2024
Weekly news roundup: Huawei sues MediaTek in China; YMTC head expects explosive chip demand in China
These are the most-read DIGITIMES Asia stories in the week of July 22 – July 26.
Monday 15 July 2024
Weekly news roundup: Chinese brands dominate domestic smartphone and TV markets; Taiwan fab toolmakers grab major orders
These are the most-read DIGITIMES Asia stories in the week of July 8 – July 12.
Monday 1 July 2024
Weekly news roundup: Indian chip companies look to smaller cities, fire at Micron Taiwan fab raises chip price concerns
These are the most-read DIGITIMES Asia stories in the week of June 24 – June 28.
Monday 24 June 2024
Weekly news roundup: pre-orders for Copilot+ PC collaborated by Microsoft, Qualcomm exceed expectations
These are the most-read DIGITIMES Asia stories in the week of June 17 – June 21.
Monday 17 June 2024
Weekly news roundup: Rising exports indicate China's semiconductor overcapacity
These are the most-read DIGITIMES Asia stories in the week of June 10 – June 14.
Tuesday 11 June 2024
Weekly news roundup: SPIL injects US$1.276 billion into Penang to build packaging, testing capacity
These are the most-read DIGITIMES Asia stories in the week of June 3 – June 7.
Monday 3 June 2024
Weekly news roundup: Russia to begin production of 350nm chips using self-developed EUV lithography machines in 2024
These are the most-read DIGITIMES Asia stories in the week of May 27 – May 31.
Monday 27 May 2024
Weekly news roundup: CSIA executive advises China's chip industry to prioritize practical wins over advanced node pursuits
These are the most-read DIGITIMES Asia stories in the week of May 20 – May 24.
Monday 20 May 2024
Weekly news roundup: Chinese semiconductor companies rally in full force to boost Huawei chips
These are the most-read DIGITIMES Asia stories in the week of May 13 – May 17.
Monday 13 May 2024
Weekly news roundup: Apple sparks speculation of partnership with EV startup
These are the most-read DIGITIMES Asia stories in the week of May 6 – May 10.
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BIZ FOCUS
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
MOST-READ
7 DAYS NEWS
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6
Samsung struggles to secure AI chip substrates, report says
Memory shortage could turn into a glut by 2028 as chipmakers expand
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels
TSMC's AI bottleneck spills demand across the semiconductor supply chain
Sandisk and SK Hynix release HBF spec to advance AI memory standard
Unitree sees 1H26 revenue rise over 35% on humanoid robot demand
Micron, MediaTek back ChipAgents as agentic AI startup extends series A to US$134 million
Montage brings CXL 3.2 memory expansion to AI data centres with Samsung, SK Hynix support
YMTC rejects patent-loss claims in global 3D NAND clash with Micron
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