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NEWS TAGGED WEEKLY NEWS ROUNDUP
Monday 16 December 2024
Weekly news roundup: global semiconductor landscape shifts as TSMC dominates, China lags, and new players emerge
Semiconductor Week in Review (Dec 8- 14) :
Monday 9 December 2024
Weekly news roundup: Global chip industry shifts as China rises, Intel falters, and TSMC pushes boundaries
Semiconductor Week in Review (Dec 1- 7) :
Monday 18 November 2024
Weekly news roundup: Intel-AMD merger plan faces market doubts, antitrust scrutiny
Semiconductor Week in Review (Nov 10 - 16): In a week dominated by seismic shifts in the semiconductor landscape, TSMC's suspension of sub-7nm chip supply to Chinese AI firms and postponement...
Monday 9 September 2024
Weekly news roundup: speculation grows on HiSilicon's production capacity amid SMIC's evolving revenue trends
These are the most-read DIGITIMES Asia stories in the week of September 2 - September 6.
Monday 2 September 2024
Weekly news roundup: Kaynes secures India's paying OSAT customer; former TSMC executive set to depart Samsung
These are the most-read DIGITIMES Asia stories in the week of August 26 – August 30.
Monday 26 August 2024
Weekly news roundup: Intel's 18A under fire for yield; US Chips Act scale now bigger than China Big Fund II
These are the most-read DIGITIMES Asia stories in the week of August 19 – August 23.
Monday 19 August 2024
Weekly news roundup: Japan's breakthrough in EUV tech; China gaining self-sufficiency in chip equipment except in exposure tools
These are the most-read DIGITIMES Asia stories in the week of August 12 – August 16.
Monday 12 August 2024
Weekly news roundup: Intel telecommunications faces cost cuts; Indian opto-semiconductor maker makes acquisition
These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.
Monday 5 August 2024
Weekly news roundup: CXMT begins mass-producing HBM2; Micron intros new data center SSD
These are the most-read DIGITIMES Asia stories in the week of July 29 – August 2.
Monday 29 July 2024
Weekly news roundup: Huawei sues MediaTek in China; YMTC head expects explosive chip demand in China
These are the most-read DIGITIMES Asia stories in the week of July 22 – July 26.
Monday 15 July 2024
Weekly news roundup: Chinese brands dominate domestic smartphone and TV markets; Taiwan fab toolmakers grab major orders
These are the most-read DIGITIMES Asia stories in the week of July 8 – July 12.
Monday 1 July 2024
Weekly news roundup: Indian chip companies look to smaller cities, fire at Micron Taiwan fab raises chip price concerns
These are the most-read DIGITIMES Asia stories in the week of June 24 – June 28.
Monday 24 June 2024
Weekly news roundup: pre-orders for Copilot+ PC collaborated by Microsoft, Qualcomm exceed expectations
These are the most-read DIGITIMES Asia stories in the week of June 17 – June 21.
Monday 17 June 2024
Weekly news roundup: Rising exports indicate China's semiconductor overcapacity
These are the most-read DIGITIMES Asia stories in the week of June 10 – June 14.
Tuesday 11 June 2024
Weekly news roundup: SPIL injects US$1.276 billion into Penang to build packaging, testing capacity
These are the most-read DIGITIMES Asia stories in the week of June 3 – June 7.
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BIZ FOCUS
Nov 3, 08:00
NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
Friday 30 October 2026
Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
Thursday 29 October 2026
STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO
Wednesday 28 October 2026
SK hynix Announces 3Q26 Financial Results
MOST-READ
7 DAYS NEWS
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
TSMC advances CoPoS packaging at Taoyuan Longtan site
NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
Marvell pays up for Lumentum, 33 times forward earnings, to match Broadcom on lasers
China's memory chipmakers extend their boom into the third quarter as capacity, policy risks build
Micron dismisses 4F-squared DRAM as CXMT presses ahead — why Samsung, SK Hynix remain divided
SK Hynix ramps up SOCAMM2 as material shortages push up PCB prices
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