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Tuesday 21 January 2020
Inventec expects 10% revenue expansion in 2020
Taiwan-based ODM Inventec expects each of its three major product lines to register about 10% revenue expansion in 2020 and a higher growth in 2021, with plans to simultaneously expand...
Friday 17 January 2020
Compal expects non-notebook shipments to surge in 2020
Compal Electronics expects its notebook shipments to register only flat growth on year in 2020, but shipments of its non-notebook products such as wearables, smart home devices, automotive...
Monday 13 January 2020
Taiwan, Vietnam to be major production bases for notebook ODMs
Despite a truce in the US-China trade war, notebook ODMs will continue their capacity relocation to Taiwan and Vietnam, with the two becoming their major production bases outside...
Friday 10 January 2020
Notebook ODMs to see shipments drop 10-15% in 1Q20
Notebook ODMs saw weaker-than-expected shipments in fourth-quarter 2020 due to Intel CPU shortages and clients' high inventory levels as a result of their early inventory build-ups...
Thursday 9 January 2020
ODM, EMS providers gear up for AR glasses market
Worldwide first-tier ODMs and EMS providers including Quanta Computer, Pegatron, Wistron and Flextronics have begun crossing into the manufacturing of augmented reality (AR) glasses,...
Thursday 9 January 2020
Huawei keeping a low profile at CES 2020
Huawei has a low-profile display at CES 2020, showcasing mostly existing products, such as the P30 Pro smartphone, the foldable Mate X, tablets and wearable, without unveiling any...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Thursday 19 December 2019
Kinwong, Plotech to build new HDI PCB capacities in China
Chinese PCB maker Kinwong Electronic and Taiwan-based peer Plotech Technology have both disclosed plans to set up new production lines for HDI boards in China seeking to cash in on...
Wednesday 18 December 2019
Worldwide wearables market to top 300 million units in 2019, says IDC
The global market for wearables is on track to ship 305.2 million units in 2019, up 71.4% from the 178 million units shipped in 2018, according to IDC. From there, total volumes will...
Wednesday 18 December 2019
Components makers find Apple orders less juicy
Apple has informed its upstream partners it will stop paying non-recurring engineering (NRE) fees for the development of new iPhones' chassis and metal frames, according to industry...
Wednesday 18 December 2019
Rigid-flex boards to stay as mainstream for midrange applications
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Wednesday 11 December 2019
Worldwide wearables shipments surge 94.6% in 3Q19, says IDC
Global shipments of wearable devices totaled 84.5 million units in the third quarter of 2019, an on-year increase of 94.6% and a new record for shipments in a single quarter, according...
Monday 9 December 2019
Smart glasses may replace smartphones, says Jorjin chairman
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
Friday 6 December 2019
Smart AR glasses shipments to rise significantly in 2023, says Digitimes Research
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...