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Wednesday 7 January 2026
Samsung speeds Pyeongtaek P5 fab toward 2028 output

Samsung Electronics is accelerating construction of its P5 semiconductor line in Pyeongtaek, South Korea, as it moves toward a 2028 production...

Tuesday 6 January 2026
CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
Tuesday 6 January 2026
TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall
Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages,...
Monday 5 January 2026
TSMC's US fabs expose structural cost gap with Taiwan

The economics of advanced semiconductor manufacturing in the US differ sharply from those in Taiwan, and TSMC's experience in Arizona...

Monday 5 January 2026
Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

Friday 2 January 2026
SanDisk, Micron vie for PSMC's Tongluo fab capacity
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo,...
Friday 2 January 2026
Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier
TSMC has officially commenced volume production of its 2nm (N2) semiconductor process in the fourth quarter of 2025, marking a milestone as the first foundry worldwide to offer chiplet...
Wednesday 31 December 2025
TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona...

Wednesday 31 December 2025
Samsung modernizes 30-year-old Austin fab to serve Apple, high-end chip demand
Samsung Electronics is reportedly beginning upgrades to the core gas infrastructure at its semiconductor fab in Austin, Texas. Industry observers view the move as the start of a broader...
Tuesday 30 December 2025
TSMC hits its 2nm milestone on schedule as China flexes military muscle
TSMC today announced that its highly anticipated 2nm (N2) technology began volume production in the fourth quarter of 2025, meeting its roadmap targets precisely on schedule.
Tuesday 30 December 2025
TSMC's Arizona red tape exposes reality of reshoring US manufacturing
TSMC's Arizona semiconductor complex illustrates the practical hurdles of re-shoring advanced manufacturing to the US. The project required navigating 18,000 unique rules and permits,...
Tuesday 30 December 2025
Samsung rumored to jump to 2nm at Texas fab, signaling US chip competition
Samsung Electronics is reportedly upgrading its Texas fab from 4nm to 2nm, aiming to rival TSMC in the US market. If confirmed, the move could reshape supply chains for major tech...
Monday 29 December 2025
8-inch foundry price rises take hold as BCD, HV nodes lead
The global 8-inch wafer foundry market has entered a price upcycle. Foundries, including SMIC and Hua Hong Semiconductor, along with major Taiwanese and South Korean mature-node players,...
Friday 26 December 2025
Winbond prepares 16nm 8Gb DDR4 mass production for 2026 shipment upgrade
Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease,...
Friday 26 December 2025
Exclusive: Ex-TSMC COO discusses how mass production sparked full-scale advancement
J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview...