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    CXMT valuation gap highlights uncertainty over China’s DRAM push
    8h 18min ago
    Interview: Memory makers’ expansion drives up material costs and exposes FOUP shortages
    8h 18min ago
    BYD accelerates in-house chip push with 4nm Xuanji A3
    8h 18min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    8h 18min ago
    L&F Plus ships first samples from South Korea’s first LFP cathode mass-production line
    8h 20min ago
    NEWS TAGGED FAB
    Monday 3 August 2026
    Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
    Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
    Monday 3 August 2026
    xLight bets on EUV light source, eyes ASML deal
    The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...
    Monday 3 August 2026
    TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
    A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...
    Saturday 1 August 2026
    Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

    Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

    Friday 31 July 2026
    Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
    Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
    Thursday 30 July 2026
    Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
    Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
    Wednesday 29 July 2026
    TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

    TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

    Tuesday 28 July 2026
    Magnitude 7.1 quake strikes Japan's Kumamoto; TSMC says JASM staff safe, recovery underway
    A powerful earthquake struck Japan's Kyushu region at 4:27 p.m. on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles...
    Tuesday 28 July 2026
    Samsung, SK Hynix race to secure chipmaking tools before equipment lead times hit one year
    Samsung Electronics and SK Hynix are considering placing semiconductor equipment orders earlier as a global wave of fab investment stretches delivery times for key chipmaking tools...
    Tuesday 28 July 2026
    EYEQ Lab completes 200mm SiC line validation with yield above 90%

    South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide...

    Monday 27 July 2026
    CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
    China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...
    Sunday 26 July 2026
    Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
    This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...
    Friday 24 July 2026
    India's chip plants face harder test: finding repeat customers
    India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
    Friday 24 July 2026
    TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
    Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
    1/22 pages
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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