NeoGene Tech has unveiled a breakthrough technology to fabricate a porous wick structure with thickness at only 10-micron, enabling ultrathin vapor chamber devices in large area with...

Demand for vapor chambers (VC) from smartphone vendors has been disappointing so far in 2020, due to the coronavirus pandemic deterring the launch of high-end models by non-Apple...

As demand for 5G mobile phones increases, the vapor chamber (VC) is emerging to become a key component in 5G smartphone thermal management. Competition is keen among vapor chamber...

Taiwan-based cooling module providers remain optimistic about sales prospects of vapor chamber (VC) products for applications in 5G phones in 2021 although their expectations for...

Vapor chambers are increasingly applied to notebooks beyond handsets to better remove heat, and some brand vendors including HP and Lenovo reportedly will launch in second-half 2020...

Taiwan-based smartphone cooling module specialists are capable of producing vapor chambers with thickness of only 0.3mm and will begin shipping the cooling solutions for smartphones...

Taiwan-based cooling module specialists including Auras Technology expect ASPs for handset-use solutions to drop about 10% in the second half of 2020, due to competition from Chinese...

At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...

The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...

Anli International is planning to establish a sintering production line at its factory site in Zhejiang, China to provide etching process for its vapor chamber products with volume...

Cooling fan makers are looking forward to the business opportunities brought by autonomous driving and 5G developments with Sunonwealth Electric Machine Industry expecting demand...

Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...

Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.

The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond,...

Taiwan-based cooling modules supplier Chaun-Choung Technology (CCI) has seen shipments for smartphones ramp up since the third quarter of 2019, expecting the revenue ratio for such...

Demand for vapor chambers (VCs) from smartphone vendors will grow exponentially in the next few years to support high heat-sinking performance required for 5G smartphones, according...

Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...

Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...

With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...

As China's Ministry of Industry and Information Technology is set to issue 5G licenses in the near future, sources from cooling module makers have pointed out that they have received...

The fabrication of semiconductor devices comprises a sequence of processing steps including etching, lithography, diffusion and thin film. How to ensure all process equipment is in...

Razer is bringing its second gaming smartphone, the Razer Phone 2, into Taiwan, its first market in Asia, with the availability to begin on November 17 at NT$25,990 (US$842).

Cooling module maker Chaun-Choung Technology (CCI) has disclosed that Japan-based Nidec is planning to acquire up to a 48% stake in the company through a tender offer at NT$108 (US$3.50)...

Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...

Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...