Foxconn Electronics' (Hon Hai Precision Industry's) legal battles against Taiwan-based connector maker Lotes over the infringement of Foxconn's USB 3.0 patents are starting to favor...
Kingston Technology reportedly plans to expand its purchases of USB3.0 flash drive components, which is expected to boost the penetration rate for drives with USB 3.0, according to...
Demand for USB 3.0 flash drives has been a disappointment thus far in 2013 with the penetration rate reaching only 10%. Industry observers anticipate the penetration rate will climb...
Silicon Motion Technology has announced that it has begun sampling its new, single-channel controller solution for USB 3.0 flash drives, the SM3267. By integrating an embedded crystal...
USB 3.0 controller IC vendor Innostor Technology plans to begin volume production of its new single-channel USB 3.0 controller chip, the IS917, in September, according to the compa...
The USB 3.0 Promoter Group has announced the completion of the USB 3.1 specification which adds enhancements to enable SuperSpeed USB to operate at up to 10Gbps.
Intel's 8-series chipsets, designed for Haswell-based processors, are seeing defects in their USB 3.0 feature, and although Intel has distributed fixed chipsets to motherboard and...
Apple has filed a patent application with the USPTO for a hybrid USB/SD port which combines a USB port with SD card slot to save space to make notebooks slimmer. Ultrabook vendors...
ASMedia Technology has started developing 10Gbps USB 3.5 host and device controller chips with availability scheduled for 2014, according to company president Chewei Lin.
More USB 3.0 device controller suppliers have launched crystal-less solutions designed for small, lightweight products, including startup M31 Technology. The design would also help...
Innostor Technology, a fabless USB device controller firm, expects to see shipments of its SuperSpeed USB (USB 3.0) flash drive controllers climb 30% sequentially in the second quarter...
USB controller design firm ASMedia Technology expects to start mass producing chips using 85nm process technology, according to company president Chewei Lin.
M31 Technology, a Taiwan-based silicon IP startup, has announced that its USB 3.0 PHY (physical layer interface) technology is silicon proven on TSMC's 40nm HKMG technology node....
