中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
EMS Watch
WWDC
Meet the Analysts
Server EMS Tracker
On-Demand Briefing
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Scale AI's data neutrality under question: Meta stake reportedly sparks client exodus
ICT
1min ago
China solar giants' unprecedented losses prompt calls to confront structural crisis
Sustainability
3min ago
Canon Anelva looks to AI and compact equipment to outpace flat market
Semiconductors
17min ago
Chinese electronics brands begin exporting from India amid policy shifts and local push
ICT
18min ago
Acer chief strategy officer becomes chair of IPC maker Posiflex
ICT
30min ago
Global SiC wafer growth slows as China reshapes market dynamics
Semiconductors
32min ago
NEWS TAGGED UNIVERSAL CUSTOMER PREMISE EQUIPMENT
Monday 14 September 2020
Nexcom Network and Communication Solutions Group gears up for 5G's challenges with Fresh Technology
Nexcom's Network and Communication Solutions Group (NCS), leading supplier of network appliances, is ready to take on the challenges of 5G technology with its newest uCPE (Universal...
BIZ FOCUS
Jun 10, 13:38
SK Hynix presents future DRAM technology roadmap at IEEE VLSI 2025
Tuesday 10 June 2025
Struggling to enhance chip test performance? Let's explore solutions!
Tuesday 10 June 2025
Ensuring SoC integration: The role of Eurosmart PP0117
Monday 9 June 2025
Linxens teams up with Dracula Technologies to develop battery-free smart labels for next-gen sustainable IoT
MOST-READ
7 DAYS NEWS
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
TSMC adjusts global growth plans as Washington ramps up demands
Nvidia courts ASIC allies with NVLink Fusion, so why is Broadcom still saying no?
DDR4 crunch sends prices soaring 50%
Nvidia, AMD to launch China-ready AI chips in 3Q25—cut down, not counted out
Solomon Technology shifts focus to software and platform integration in AI robot strategy
Phoenix Contact challenges liquid cooling dominance in EV charging
VinFast commits to full local sourcing, expands supplier support to boost Vietnam's EV supply chain
India roundup: India's US$21 billion chip dream
Taiwan adds Huawei, SMIC, others to export control entity list
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first