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Grand Opening of Wolfspeed Mohawk Valley 200mm SiC Fab
Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED UNIMICRON TECHNOLOGY
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Friday 22 April 2022
China lockdowns disrupting PCB shipments
COVID lockdowns in Kunshan and other Chinese cities, where high-tech manufacturing hubs are located, are impacting local businesses, including PCB makers seeing their production and...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Wednesday 13 April 2022
ABF substrate makers thriving on brisk demand for datacenter applications
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
Thursday 7 April 2022
Unimicron, Nan Ya PCB see Kunshan lockdown slightly affect April revenues
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Tuesday 22 March 2022
ABF substrate makers continue to see clients queue up for capacity
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Thursday 17 March 2022
Zhen Ding looks to rank among world's top-5 IC substrate suppliers by 2030
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Wednesday 16 March 2022
COVID lockdowns in China may affect shipments of new Apple devices
Shipments of new Apple devices may more or less be affected by the COVID lockdowns in Shenzhen and Dongguan, where its supply chain partners including Foxconn, Unimicron Technology...
Thursday 10 March 2022
TSMC, Unimicron to offer production solutions for Apple M1 Ultra
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Tuesday 8 March 2022
Apple Car reportedly may adopt ABF substrates from Korean maker
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Thursday 3 March 2022
Optical inspection equipment maker Utechzone upbeat about 2022 sales
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Thursday 24 February 2022
Unimicron in talks about ABF substrate orders for 2027-2030
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Wednesday 23 February 2022
Unimicron to merge with SiP substrate specialist
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Wednesday 19 January 2022
Taiwan ABF substrate makers eyeing new profits with new capacities
Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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