The Japanese yen's depreciation will provide Japan-based ABF substrate companies with an additional advantage over their Taiwanese counterparts, in addition to technology leadership,...
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Taiwan's PCB and IC substrate market will first stagnate before seeing a sharp increase in 2024, according to Maurice Lee, chairman of the Taiwan Printed Circuit Association (TPCA)...
The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources.
Unimicron Technology's production yield rates for high-end ABF substrates remain lower than those of Ibiden. This presents a challenge to the Taiwanese company, despite being the...
BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...
The advancement of AI application is driving significant developments in the essential materials for PCB and HDI, with Taiwan's leading trio in Copper Clad Laminate (CCL) —...
In response to its mid-term expansion strategy, Unimicron Technology has upped its capex goal for this year by NT$6.9 billion (US$218.8 million) to NT$24.2 billion, a nearly 40% increase,...
Following a significant drop in sales of BT substrates and midrange ABF substrates in 2023 amid sluggish post-pandemic consumer electronics demand, Taiwan's Unimicron Technology is...
