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Friday 14 July 2017
Toshiba develops 3D flash memory with TSV technology
Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...
Wednesday 5 July 2017
Supply of NAND flash for new iPhone falling short
SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...
Friday 30 June 2017
Talks to sell Toshiba Memory continue; announces new products
Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...
Thursday 29 June 2017
Commentary: Where is Foxconn heading?
The failure of Foxconn Electronics (Hon Hai Precision Industry) to make it to the priority bidder list for acquiring Toshiba's semiconductor unit and its chairman Terry Gou's subsequent...
Friday 23 June 2017
Foxconn chairman still expects 50% chance of getting Toshiba semiconductor business
Commenting on Toshiba's decision that it will put its negotiation priority for the sale of its semiconductor department on the alliance of Japan- and US-based enterprises, Foxconn...
Thursday 22 June 2017
Global industrial semiconductor revenues rise 4% in 2016, says IHS
Worldwide industrial semiconductor revenues grew 3.8% on year to US$43.5 billion in 2016, according to IHS Markit.
Wednesday 21 June 2017
WD comments on Toshiba bid on flash JV
Western Digital has issued a statement regarding Toshiba's selection of a consortium led by Korea-based SK Hynix and Bain Capital Japan, with funding provided by the government in...
Wednesday 21 June 2017
Toshiba names preferred bidder for memory-chip business sale
Toshiba announced on June 21 that its board of directors had resolved to select the consortium of Innovation Network Corporation of Japan, Bain Capital Private Equity and Development...
Friday 16 June 2017
Terry Guo tries to allay concerns about Foxconn-China links amid Toshiba buyout
Foxconn Electronics (Hon Hai Precision Industry) chairman Terry Guo has commented on the company's bid to acquire Toshiba's semiconductor department, saying that Foxconn is willing...
Tuesday 6 June 2017
Apple, Amazon to join Foxconn bid to acquire Toshiba semi unit, says report
Apple and Amazon will participate in Foxconn Electronics' bid to acquire Toshiba's semiconductor business, Foxconn chairman Terry Guo told the Japan-based Nikkei Asian Review.<...
Tuesday 23 May 2017
3S teaming up with Marvell to develop 28nm controller chips
Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.
Monday 22 May 2017
Phison still eyeing stake in Toshiba chip unit
Phison Electronics originally planned to invest US$500 million in Toshiba's memory chip unit, but the plan has been postponed as Toshiba decided to sell more of the business' stake,...
Wednesday 17 May 2017
Ardentec expanding automotive MCU testing business in Japan
Ardentec has expanded its automotive MCU testing business in Japan, which will further buoy its sales performance starting in the second quarter of 2017, according to industry sour...
Friday 28 April 2017
Digitimes Research: Study of Japan IT industry for 1Q17
While LG Electronics has dominated the global OLED TV market, Japan-based Panasonic, Sony and Toshiba still launched OLED TVs in Japan in the first quarter of 2017, with panels supplied...
Thursday 20 April 2017
PTI to enjoy robust demand for NAND flash
Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.