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NEWS TAGGED TONG HSING
Friday 19 April 2024
Tong Hsing sees promising automotive CIS demand
Tong Hsing Electronics Industries saw automotive products contribute to 66% of its revenue in the first quarter of this year.
Tuesday 5 March 2024
Taiwan CIS earnings calls show light at the end of the tunnel
Earning calls from Taiwan's CIS supply chain promise an uptick in demand in 2024.
Thursday 23 November 2023
CMOS packaging specialist Tong Hsing expects modest growth in 4Q23
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Tuesday 15 August 2023
CIS backend houses express caution about 2H23
Tong Hsing Electronic Industries, VisEra Technologies, and Xintec, all of whom are in the CMOS image sensor (CIS) backend sector, have expressed caution regarding their market prospects...
Wednesday 26 July 2023
Tong Hsing sees weak demand for handset-use CIS
Tong Hsing Electronics, a major backend services provider for CMOS image sensors (CIS), expects the handset market to remain weak throughout 2023, with demand sliding faster than...
Friday 9 June 2023
Tong Hsing eyes accelerating MOSFET biz dev: Q&A with company president C. S. Chang
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in...
Friday 21 April 2023
CIS packaging house Tong Hsing less optimistic about automotive demand
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house.
Thursday 13 April 2023
III-V semiconductor suppliers & IC inspection labs poised to embrace LEO satellite business
With its importance significantly highlighted during the Russia-Ukraine war, low-earth orbit (LEO) satellite communications will usher in enormous business opportunities for III-V...
Monday 20 March 2023
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with...
Thursday 16 March 2023
CIS backend specialist Tong Hsing upbeat about automotive demand
CIS packaging and testing firm Tong Hsing Electronic is expected to see sales generated from the automotive applications register a high single-digit percentage growth in 2023.
Tuesday 17 January 2023
OmniVision eyeing three major applications with new CIS offerings in 2023
China-based CMOS image sensor (CIS) supplier OmniVision Technologies continues the release of new products despite market downturns, focusing on handset, automotive and metaverse...
Wednesday 28 September 2022
Handset CIS destocking slow
Lackluster handset sales have led to excess inventories of related CMOS image sensors (CIS), also dragging down wafer reconstitution (RW) demand, according to industry sources.
Wednesday 17 August 2022
Tong Hsing building new plant in Taiwan
CMOS image sensor (CIS) packaging service provider Tong Hsing Electronic Industries is constructing its fourth plant in northern Taiwan, with the facility to begin production in the...
Wednesday 13 July 2022
Taiwan CIS backend firms look to automotive for 2H22 growth
CMOS image sensor backend specialists including Tong Hsing Electronic Industries and Xintec are vying for more orders coming from the automotive sector to offset weakness in handset...
Thursday 23 June 2022
Automotive CIS backend may incorporate RW technology
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
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