Thursday 9 March 2023
OSATs see clear automotive MCU orders from IDMs till end-2023
Taiwan's OSATs including ASE Technology, TeraPower Technology under Powertech Technology (PTI), and Ardentec have seen clear order visibility for automotive MCUs from IDMs till the...
Tuesday 10 January 2023
PTI posts about flat revenue growth in 2022
Memory and logic IC backend specialist Powertech Technology (PTI) Group has reported revenue still edged up 0.16% on year to NT$83.93 billion (US$2.75 billion) in 2022, despite lackluster...
Thursday 1 September 2022
OSATs strive to grow revenues from automotive sector
Taiwan-based OSATs including ASE Technology, Powertech Technology Group (PTI), King Yuan Electronics (KYEC), Ardentec, Sigurd Microelectronics are all looking to grow revenues from...
Friday 19 August 2022
Backend demand for automotive MCUs, MPUs stays robust
Backend demand for automotive MCUs and MPUs remains in high gear, with OSATs and packaging materials suppliers seeing clear order visibility through the end of this year, according...
Tuesday 7 June 2022
Taiwan-based IC testing firms maintain positive outlook for 2022
Taiwan-based IC testing firms expect to enjoy strong demand for high-end testing driven by network chips, high-performance computing (HPC) solutions, power management ICs (PMIC),...
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Wednesday 13 April 2022
Lead times for automotive and industrial MCUs from IDMs still long
Delivery lead times for automotive and industrial MCUs from international IDMs are still long reaching at least 30 weeks or even more than one year, while Taiwan makers are gearing...
Tuesday 12 April 2022
PTI obtains backend orders for new MediaTek smartphone APs
Powertech Technology (PTI) has obtained orders for packaging MediaTek's smartphone application processors slated for launch later in 2022, under the chipmaker's strategy to diversify...
Tuesday 29 March 2022
Testing houses see customers turn cautious
Dedicated testing houses including Sigurd Microelectronics and King Yuan Electronics (KYEC) have seen their customers increasingly adopt a wait-and-see attitude towards order commitments...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Monday 17 January 2022
Taiwan MCU makers to ramp up shipments for non-consumer segments in 2Q22
Taiwan-based MCU vendors, including Nuvoton Technology, Megawin Technology, Holtek Semiconductor, and Nyquest Technology, are poised to see their shipments for industrial applications...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
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