Taiwan-based Lite-On Technology will team up with China's Tsinghua Unigroup to jointly develop the China market for storage products such as solid state drives (SSD), with the latter...
Taiwan IC packaging and testing specialists ASE and Siliconware Precision Industries (SPIL) will convene provisional shareholders meetings in February 2018 and set up a joint holding...
Huawei has launched its Mate 10 and Mate 10 Pro smartphones in the Taiwan market with the availability to begin on November 28. The Mate 10 carries a price tag of NT$20,900 (US$697),...
Packaging and testing company Siliconware Precision Industries (SPIL) has gained land use rights for a 147,097-square meter industrial site located at the Fujian (Jinjiang) IC Industrial...
Packaging and testing company Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$7.41 billion (US$245.5 million) for October 2017, up 1.2% on month but...
Advanced Semiconductor Engineering (ASE) expects sales of its core IC assembly test and material (ATM) business to register flat sequential growth in the fourth quarter, while sales...
With edge computing promising to become an important part of cloud systems, Taiwan Semiconductor Manufacturing Company (TSMC) is eyeing the market opportunities with its advanced...
IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...
While Apple has started to release more orders to AMD for high-end GPUs needed for new iMac series since September 2017, Taiwan-based outsourced semiconductor assembly and test (OSAT)...
Testing house King Yuan Electronics (KYEC) has obtained orders for MediaTek's major products for 2018, including 12nm mobile SoCs, and chips solutions for voice assistant devices...
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential increases of 11.9% and 7.5%, respectively, in consolidated...
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
