中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Nvidia
Terafab
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
Tomorrow's Headlines
11h 2min ago
Nvidia emerges as AI industry’s central bank amid cloud startup risks
Tomorrow's Headlines
11h 2min ago
Apple reportedly plans high-end HomeView with robotic arm
Tomorrow's Headlines
11h 2min ago
Rising memory costs push smartphone makers from LTPO to LTPS panels
Tomorrow's Headlines
11h 2min ago
Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
Tomorrow's Headlines
11h 2min ago
NEWS TAGGED SOLID-STATE BATTERY
Tuesday 15 December 2020
EV sector keen on developing solid-state batteries
Many battery makers and automakers have been developing solid-state batteries for electric vehicles (EVs), according to industry sources.
Wednesday 18 March 2020
Researchers develop flexible chargeable batteries
A research team in Taiwan has disclosed it has developed flexible (bendable) chargeable batteries based on magnesium fabric.
5/5
pages
1
2
3
4
5
BIZ FOCUS
Oct 21, 08:00
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
PCB material shortages persist as capacity expansion extends beyond 2029
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first