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    Advantest surpasses Tokyo Electron in market value, fueled by AI chip testing
    9h 15min ago
    Challenges in connected cars safety hinder EV adoption in Europe and US
    9h 15min ago
    China's domestic memory firms show revenue growth but face profit challenges in 1H25
    9h 15min ago
    Samsung's tri-fold smartphone to arrive in October with limited initial launch
    9h 15min ago
    India reportedly approached Myanmar's Kachin Independence Army to sought rare earth supply
    9h 15min ago
    Infineon expands investment in RISC-V automotive MCU product line
    9h 15min ago
    NEWS TAGGED SILICON
    Thursday 11 September 2025
    ACE Solution and Taiwan Nano & Micro-Photonics Showcase Semiconductor and Silicon Photonics Solutions at SEMICON 2025
    ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world's most influential semiconductor exhibitions. ACE Solution...
    Thursday 11 September 2025
    Shenzhen expo underscores integration of optoelectronics and semiconductors
    The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...
    Thursday 11 September 2025
    Taiwan showcases breakthroughs in CoWoS and SiC equipment to boost semiconductor self-reliance
    The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
    Tuesday 9 September 2025
    Malaysian IC design house Oppstar and Inventec to develop AI chips together
    Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
    Tuesday 9 September 2025
    China's JFSemi cracks 12-inch SiC wafer barrier with homegrown laser technology

    The global silicon carbide (SiC) market remains centered on 6-inch wafers, with only a few Chinese players moving into 8-inch lines....

    Friday 5 September 2025
    OpenAI reportedly developing custom AI chips with Broadcom, mass output slated for 2026
    Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first...
    Thursday 4 September 2025
    Resonac launches JOINT3 alliance to develop next-gen semiconductor tech
    Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
    Thursday 4 September 2025
    China's SiC substrate industry faces setback, seeks strategic pivot
    In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
    Wednesday 3 September 2025
    TSMC surpasses Intel in US silicon photonics patents as chip industry ramps up initiatives
    TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
    Wednesday 3 September 2025
    Taiwan targets new growth in AI chip packaging with silicon carbide substrates
    As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...
    Wednesday 27 August 2025
    Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks
    Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...
    Tuesday 19 August 2025
    Smartphone display market sees diverging price trends across panel types

    The third quarter, traditionally a peak season for the smartphone supply chain, has brought a mixed picture for display panel pricing...

    Thursday 14 August 2025
    China's leading SiC epitaxy plants see quarterly order surge, signaling market bottom
    China's SiC industry faces oversupply as 6-inch substrate prices plunge, prompting a strategic pivot to 8-inch wafers
    Thursday 14 August 2025
    TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
    Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
    Monday 11 August 2025
    Weekly news roundup: 'China for China' Strategy, Xiaomi's open-source voice AI, and Broadcom at OCP APAC
    Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...
    1/11 pages
    Veeam Q3
    BIZ FOCUS
    Sep 9, 12:48
    Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
    Wednesday 10 September 2025
    How Flash Memory Shapes Server Security: From Firmware Integrity to Root of Trust
    Wednesday 10 September 2025
    C SUN taps into AI packaging boom, diversifies applications to fuel next decade of growth
    Wednesday 10 September 2025
    3S will unveil AI empowered formic acid reflow oven for high reliability power module assembly, redefining green, flux-free, low void rate soldering
    Summary of Tech Supply Chain News!