中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Nvidia
TSMC
AI Search
NTN Convergence
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Chinese semiconductor suppliers expand Southeast Asia presence at SEMICON SEA 2026
Tomorrow's Headlines
57min ago
AMD data center revenue surpassed Intel’s for the first time
Tomorrow's Headlines
57min ago
Taiwan firms’ US investment plans outpace expectations as government sets up US$50 billion financing
Tomorrow's Headlines
57min ago
Samsung bonus system sparks strike risk as rivals use different models
Tomorrow's Headlines
57min ago
Trump-Xi Beijing summit puts Taiwan's supply chain at the center of the conversation
Tomorrow's Headlines
57min ago
Samsung exits China consumer appliances as local brands move upmarket
Tomorrow's Headlines
57min ago
NEWS TAGGED SIIMPEL
Monday 20 October 2008
MEMS mass production to lead to increased foundry outsourcing: Q&A with Siimpel CEO Chee Kwan
Increasing global demand for smartphones has resulted in related advancements in handset functionality and increased competition among component suppliers. In August of this year,...
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
7 DAYS NEWS
CPU shortage more acute than memory; industry awaits Intel 18A yield improvement
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
Qualcomm moves into custom DRAM with CXMT for smartphones
From chips to telecoms, South Korea faces an AI-era labor reckoning
Intel targets entry-level advanced packaging, draws interest from Google and Amazon
Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration
Commentary: Why Apple's Intel and Samsung talks remain preliminary—and what that means for TSMC
Arm's $2 billion AGI CPU backlog signals strong hyperscaler demand
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first