中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Computex 2025
Meet the Analysts
Server EMS Tracker
On-Demand Briefing
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China races ahead in hydrogen—but will it flood the market again?
Tomorrow's Headlines
10h 3min ago
Why Compal lost the ZT deal—and why it doesn’t mind
Tomorrow's Headlines
10h 4min ago
Xiaomi's Xring O1 chip probes US export control limits in transistor count
Tomorrow's Headlines
10h 23min ago
Trump's Middle East visit brings major deals for US AI chipmakers
Tomorrow's Headlines
10h 23min ago
JASM and Sony adopt cautious expansion in Japan's semiconductor sector
Tomorrow's Headlines
10h 23min ago
Samsung regains lead in SEA smartphone shipments in 1Q25
Tomorrow's Headlines
10h 24min ago
NEWS TAGGED RUNCOM
Friday 20 June 2008
Zyxel shipments of WiMAX products to US market remain steady
Shipments of Zyxel Communications' WiMAX products to the US have remained steady, and have not been exposed to recently rumored problems related to WiMAX chips, according to Zyxel.
Wednesday 4 June 2008
Qisda likely to team up with MediaTek for production of EDGE/WiMAX handsets, say sources
Qisda is expected to join hands with MediaTek for the future production of EDGE/WiMAX dual-mode handsets, according to market sources.
BIZ FOCUS
May 9, 11:30
Is your AI system built to last—or bound to fail? Only DEEPX has the answer
Monday 19 May 2025
Empowering the intelligent future: Fibocom elevates AI capabilities for next-gen innovation
Monday 19 May 2025
MSI showcases AI-driven, high-performance innovations at COMPUTEX 2025
Wednesday 14 May 2025
VIA Labs presents USB4 gaming dock reference design compliant with the latest EU EUP/ERP regulations
MOST-READ
7 DAYS NEWS
Exclusive: Google considers HBM3E supplier change
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
Lip-Bu Tan's Intel: leaner, flatter, and betting big on packaging
Intel CEO's four turnaround strategies unveiled
Huawei reportedly erects three advanced chip fabs in Shenzhen to sidestep foreign tech
Malaysia retracts Huawei AI server deployment claim as US export control tension rises
TSMC passes on 3 countries' fab bids as nations vie for AI chip clout
Japan’s chip buildout stalls as new fabs sit idle
From exit to OSAT: Foxconn's WLP comeback in Indian semiconductors
Jensen Huang calls US chip ban 'wrong,' opens Nvidia's NVLink Fusion to global tech heavyweights
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first