SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform,...
Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled...
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced...
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
SpaceX is expanding its AI computing infrastructure to meet rising demand for AI applications, securing US$40 billion in financing commitments for GPUs and equipment. The surge in...
Oracle has signed partnerships with Cerebras and other chipmakers to host their chips in its cloud infrastructure. The Cerebras deal gives the chipmaker a new large customer to anchor...
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
More than 30 years ago, Lenovo set out with a vision to bring personal computers into every household. Today, Chairman and CEO Yuanqing Yang has defined a new mission for the 42-year-old...
Nvidia used its first GTC conference in Berlin to present a factory-style approach to AI, framing AI production as an industrial process. CEO Jensen Huang introduced the DSX full-stack...
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing...
Wistron and Wiwynn are showcasing next-generation AI compute and storage systems for AI factories at the 2026 Open Compute Project (OCP) Global Summit in San Jose, California, with...
Taiwanese server chassis maker Chenbro Micom is expanding its role in AI infrastructure, moving beyond traditional server enclosures into high-end AI servers and rack-level solutions...
The AI server supply chain is poised for a stronger quarter as Nvidia's Vera Rubin and AWS's Trainium 3 gradually ramp up, with momentum expected to strengthen across the supply chain...
