Hewlett-Packard Enterprise (HPE) will be stepping up its investment in Taiwan, where the US vendor will locate its next-generation technology and strategic supply chain hub, focusing...

Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could result...

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...

As network infrastructures around the globe continue to mature, the declining cost of sensor components has given rise to a surge of Internet of Things (IoT) devices, which has itself...

National Yang Ming Chiao Tung University (NYCU) has set up an Industry Academia Innovation School consisting of two institutes, with Institute of Prospective Semiconductors focusing...

TSMC's equipment suppliers remain optimistic about demand from the foundry, which has been stepping up its pace of advanced technology development and capacity expansion, according...

Vietnam's VinFast has disclosed it has signed an MoU with China's Gotion High-Tech, focusing on the procurement of Gotion's LFP batteries and discussion of the possibility of establishing...

3M has introduced a new member of its high-strength hollow glass bubbles product line to provide a low-loss high-speed high frequency (HSHF) resin additive for composite materials...

Production technology for ABF substrates will be evolving rapidly to satisfy demand for HPC and other high-end chips, according to Tzyy-Jang Tseng, chairman for Unimicron technology...

Phison Electronics has managed to obtain more capacity support from two foundry service providers, and will see its output for 2022 jump 200% from this year, according to KS Pua, chairman...

TSMC reportedly has started installing 3nm process manufacturing equipment at its new Fab 18b.

TSMC is looking to diversify its manufacturing bases for the sustainability of the company's competitiveness, Digitimes Research believes.

TSMC will soon disclose plans to build additional 28nm and 12/16nm process fabrication lines at new fabs, in addition to its Nanjing fab expansion, according to industry sources.

Huawei has reportedly obtained a patent for Si IGBT (insulated gate bipolar transistors) from China's authorities.

DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...