In an era dominated by cloud-based AI, a growing movement toward edge computing is emerging. Canadian edge AI startup Picovoice offers a full portfolio of voice AI and LLM technologies,...

In an exclusive interview, Mariia Zhuldybina, CEO and co-founder of TRAQC, a Canadian startup, shared her vision for transforming quality control in additive electronics manufacturing...

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, today announced the launch of DaVinci Gen V, the latest flagship product...

Footprintku AI, the global leader in electronics digital data services, made headlines at the 2025 AI EXPO with the debut of its groundbreaking DFM-oriented ECAD Library cloud platform...

The explosion of edge AI is reshaping the mission of ultrabooks, transforming them from mere productivity tools into real-time intelligent terminals. From real-time voice translation...

TCL CSOT, a global leader in display technology innovation, is making a significant presence at TouchTaiwan 2025, held from April 16-18, showcasing its electronic paper display solutions...

Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for...

Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...

The memory market is undergoing a significant transformation as suppliers pivot from traditional inventory-based models to forecast-driven production.

Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line...

As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...