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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 12 September 2025
China's Lightstar targets record localization in optical passive components amid tariff pressures
China's drive for technology self-sufficiency is transforming the communications supply chain. Shenzhen-based Lightstar Technology expects localization of advanced optical passive...
Friday 12 September 2025
SEMICON Taiwan 2025: CHPT enters US CSP supply chain; order visibility extends to 3Q26
Taiwanese test interface manufacturer CHPT showcased its latest innovations at SEMICON Taiwan 2025. Besides unveiling a comprehensive upgrade solution centered on "AI-driven probe...
Friday 12 September 2025
Yageo to acquire up to 28.5% stake in Anpec Electronics through public tender offer
Taiwan-based passive components manufacturer Yageo Corporation announced on September 11 that it plans to acquire up to 28.5% of power IC designer Anpec Electronics via a public tender...
Thursday 11 September 2025
SEMICON Taiwan 2025: Infineon CEO reveals future opportunities in power semiconductors
Jochen Hanebeck, CEO of Infineon, emphasized the concept "no AI without power" during his keynote speech at the SEMICON Taiwan 2025 Master Forum. Power semiconductors play a critical...
Thursday 11 September 2025
Shenzhen Dual-expo Spotlight | China leans on laser chips to localize AI data centers and bypass tariffs
The China International Optoelectronic Exposition (CIOE) and SEMI-e 2025 Semiconductor Innovation Exhibition kicked off in Shenzhen on September 10, underscoring the laser industry's...
Thursday 11 September 2025
SEMICON Taiwan 2025: Taiwan's 10-year chip program seeks to link semiconductor supply chains among democratic countries
In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...
Thursday 11 September 2025
LCY Chemical eyes advanced chip, display materials
LCY Chemical is actively expanding into the electronic materials market in its 110th year since the company's founding in 1915. According to CEO Vincent Liu, the company's electronic...
Wednesday 10 September 2025
Horiba opens Taiwan lab to drive next-gen semiconductor, AI materials research
Japanese measurement leader Horiba Ltd., active in Taiwan for nearly 30 years, has opened a new Application and Solutions Platform (ASP) instrumentation lab at its Hsinchu headquarters...
Wednesday 10 September 2025
Everlight targets high-performance markets as third-gen semiconductor sales set to double in 2025
Everlight Electronics is ramping up its push into third-generation semiconductors, highlighting new research and market strategies in SiC and GaN at SEMICON 2025. The company emphasized...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Zhen Ding recasts PCBs as semiconductor engines, strikes AI factory pact with Advantech
Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...
Wednesday 10 September 2025
Growth in military and semiconductor sectors fuels new momentum for IPC firms
Industrial PC (IPC) companies have begun releasing their revenue figures for August 2025. Despite challenges from the global high-interest-rate environment and geopolitical tensions,...
Wednesday 10 September 2025
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...
Tuesday 9 September 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's...

Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Globalwafers chief warns materials, not process nodes, will decide chip industry's future
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials...