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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 7 October 2025
China's SiC industry finds high-value exit in Meta's AR supply chain

As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

Tuesday 7 October 2025
Chang Wah Technology announces significant price hike for LED lead frames from 2026
Facing continuing growth in precious metal costs, IC packaging lead frame manufacturer Chang Wah Technology has revealed plans to raise prices on its LED lead frames starting January...
Tuesday 7 October 2025
AI demand drives PCB material prices up amid supply strain
Due to global tariffs and inflation, the consumer market outlook for the second half of 2025 remains pessimistic. Taiwanese PCB industry players believe that overall industry growth...
Tuesday 7 October 2025
Taiwan PCB posts record 1H25 output, TPCA projects 12% annual growth
According to the Taiwan Printed Circuit Association (TPCA), the PCB manufacturing output value of Taiwanese companies in the second quarter of 2025 reached NT$218.2 billion (US$7.2...
Monday 6 October 2025
Gold and copper prices soar as Trump's policies shake global supply chains
Upon US President Donald Trump's return to the White House, his chip containment policy has ignited a rare earth export control battle with China, affecting the already imbalanced...
Friday 3 October 2025
Shibaura deal clears Japan's national security review; opens path for Yageo acquisition
Yageo announced on October 3 that it has successfully passed a key milestone in its tender offer for Japan's Shibaura Electronics, securing 50.01% of outstanding shares, or 7,624,200...
Thursday 2 October 2025
Yageo accelerates strategy to integrate active and passive components with Anpec acquisition
Taiwan-based passive components manufacturer Yageo Corporation has completed its public tender offer for power management IC (PMIC) design firm Anpec Electronics. On October 1, 2025,...
Wednesday 1 October 2025
Intel & TSMC invest billions to transform Arizona into semiconductor powerhouse
More and more tech giants have followed TSMC's lead after its announcement of a US$165 billion investment to build more plants in Arizona. A half mountain, half desert state is slowly...
Wednesday 1 October 2025
Yageo surpasses minimum share acceptance in public tender offer to acquire Anpec Electronics
Taiwan's Yageo has successfully crossed the minimum acceptance threshold in its public tender offer to acquire power management IC designer Anpec Electronics, reaching this milestone...
Wednesday 1 October 2025
China's 12-inch SiC leap: SICC, Jingsheng in spotlight
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
Wednesday 1 October 2025
China's copper foil sector pushes back against price war with processing fee hike
China's PCB industry has, in recent years, been entangled in a vicious price war, leading many local PCB manufacturers to collapse under the pressure of internal cutthroat competition...
Tuesday 30 September 2025
TSMC 2025 full-year revenue set to break US$100 billion
Although semiconductor chip tariffs have yet to be finalized, with exchange rates stabilizing and strong pull-in momentum from major smartphone and AI chip clients, TSMC's third quarter...
Tuesday 30 September 2025
Allied Circuit, Meiko to co-build high-layer PCB plant in Vietnam for AI servers
Compal Electronics' PCB subsidiary, Allied Circuit Co., Ltd. (ACCL), has announced a joint venture with Japan's Meiko to establish a high-layer count (HLC) printed circuit board plant...
Tuesday 30 September 2025
PCB giant GCE expands Thailand plant phase 2, ASIC server capacity to start 2H26
Networking and server PCB giant GCE announced plans to expand its Thailand facility with a US$40 million investment to boost ASIC server production capacity by the second half of...
Saturday 27 September 2025
Infineon, Rohm sign MOU to support flexible SiC power device shipments
Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...